JPWO2022034871A1 - - Google Patents
Info
- Publication number
- JPWO2022034871A1 JPWO2022034871A1 JP2022542846A JP2022542846A JPWO2022034871A1 JP WO2022034871 A1 JPWO2022034871 A1 JP WO2022034871A1 JP 2022542846 A JP2022542846 A JP 2022542846A JP 2022542846 A JP2022542846 A JP 2022542846A JP WO2022034871 A1 JPWO2022034871 A1 JP WO2022034871A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020136712 | 2020-08-13 | ||
| PCT/JP2021/029458 WO2022034871A1 (ja) | 2020-08-13 | 2021-08-07 | 樹脂層付き銅箔、及び、これを用いた積層体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022034871A1 true JPWO2022034871A1 (ja) | 2022-02-17 |
Family
ID=80247906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022542846A Pending JPWO2022034871A1 (ja) | 2020-08-13 | 2021-08-07 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2022034871A1 (ja) |
| KR (1) | KR20230050341A (ja) |
| CN (1) | CN116075557A (ja) |
| TW (1) | TW202216441A (ja) |
| WO (1) | WO2022034871A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202248029A (zh) * | 2021-03-31 | 2022-12-16 | 日商太陽控股股份有限公司 | 硬化性樹脂積層體、乾薄膜、硬化物及電子零件 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5421540B2 (ja) * | 2007-01-29 | 2014-02-19 | ソマール株式会社 | 樹脂被覆金属箔及びその製造方法、並びにこの製造方法で得られた樹脂被覆金属箔を用いた金属張積層板及びその製造方法 |
| KR101817498B1 (ko) * | 2008-12-26 | 2018-01-11 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 복합 동박 |
| JP5659673B2 (ja) * | 2010-10-06 | 2015-01-28 | 住友ベークライト株式会社 | 樹脂シート、積層板、電子部品、プリント配線板及び半導体装置 |
| JP6252658B2 (ja) | 2016-11-16 | 2017-12-27 | 味の素株式会社 | 絶縁樹脂シート |
-
2021
- 2021-08-07 CN CN202180056742.4A patent/CN116075557A/zh active Pending
- 2021-08-07 KR KR1020237005096A patent/KR20230050341A/ko unknown
- 2021-08-07 WO PCT/JP2021/029458 patent/WO2022034871A1/ja active Application Filing
- 2021-08-07 JP JP2022542846A patent/JPWO2022034871A1/ja active Pending
- 2021-08-09 TW TW110129314A patent/TW202216441A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022034871A1 (ja) | 2022-02-17 |
| TW202216441A (zh) | 2022-05-01 |
| CN116075557A (zh) | 2023-05-05 |
| KR20230050341A (ko) | 2023-04-14 |