JPWO2022014038A1 - - Google Patents

Info

Publication number
JPWO2022014038A1
JPWO2022014038A1 JP2022536093A JP2022536093A JPWO2022014038A1 JP WO2022014038 A1 JPWO2022014038 A1 JP WO2022014038A1 JP 2022536093 A JP2022536093 A JP 2022536093A JP 2022536093 A JP2022536093 A JP 2022536093A JP WO2022014038 A1 JPWO2022014038 A1 JP WO2022014038A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022536093A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022014038A1 publication Critical patent/JPWO2022014038A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2022536093A 2020-07-17 2020-07-17 Pending JPWO2022014038A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/027832 WO2022014038A1 (ja) 2020-07-17 2020-07-17 塗布装置および部品装着機

Publications (1)

Publication Number Publication Date
JPWO2022014038A1 true JPWO2022014038A1 (ja) 2022-01-20

Family

ID=79554568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022536093A Pending JPWO2022014038A1 (ja) 2020-07-17 2020-07-17

Country Status (5)

Country Link
US (1) US20230247772A1 (ja)
JP (1) JPWO2022014038A1 (ja)
CN (1) CN115700017A (ja)
DE (1) DE112020007440T5 (ja)
WO (1) WO2022014038A1 (ja)

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4518114A (en) * 1983-08-08 1985-05-21 Hewlett-Packard Company Dip soldering apparatus and method
JPS617063A (ja) * 1984-06-20 1986-01-13 Alps Electric Co Ltd 小型電子部品の半田付け装置
JPS62292262A (ja) * 1986-06-11 1987-12-18 インターナショナル・ビジネス・マシーンズ・コーポレーション はんだ付け装置
US4869418A (en) * 1986-06-11 1989-09-26 International Business Machines Corporation Solder leveling method and apparatus
US4799616A (en) * 1986-06-11 1989-01-24 International Business Machines Corporation Solder leveling method and apparatus
US5686226A (en) * 1995-08-03 1997-11-11 Motorola, Inc. Method of forming an applicator for applying tacking media to a circuit substrate
US5834062A (en) * 1996-06-27 1998-11-10 Motorola, Inc. Material transfer apparatus and method of using the same
US5753299A (en) * 1996-08-26 1998-05-19 Electro Scientific Industries, Inc. Method and apparatus for forming termination stripes
DE19807279C2 (de) * 1998-02-23 2000-02-17 Dieter Friedrich Verfahren zum Herstellen eines elektronischen Bauelementes
JPH11354914A (ja) 1998-06-05 1999-12-24 Fujitsu Ten Ltd 電子部品実装方法
US6257480B1 (en) * 1998-07-07 2001-07-10 Denso Corporation Jet soldering method and apparatus
KR100642746B1 (ko) * 2004-02-06 2006-11-10 삼성전자주식회사 멀티 스택 패키지의 제조방법
US8146793B2 (en) * 2005-04-19 2012-04-03 Aurigin Technology Pte. Ltd. Pins for transferring material
JP5375133B2 (ja) * 2009-01-28 2013-12-25 パナソニック株式会社 部品実装装置
DE102011077242A1 (de) * 2011-06-09 2012-12-13 Robert Bosch Gmbh Schutzgaszuführung
CN104206033B (zh) * 2012-04-10 2017-12-08 富士机械制造株式会社 球搭载方法及对基板作业机
US9289841B2 (en) * 2012-04-16 2016-03-22 Tanigurogumi Corporation Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
JP6118813B2 (ja) * 2012-10-31 2017-04-19 富士機械製造株式会社 対基板作業システムおよび粘性流体供給方法
JP6108164B2 (ja) * 2012-11-07 2017-04-05 日本電産株式会社 半田接合構造および半田接合方法
KR102060831B1 (ko) * 2013-02-27 2019-12-30 삼성전자주식회사 플립 칩 패키징 방법, 그리고 상기 플립 칩 패키징 방법에 적용되는 플럭스 헤드 및 그 제조 방법
CN106332468A (zh) * 2016-08-26 2017-01-11 乐清市浙佳电子科技有限公司 焊接机及焊接方法
WO2018109807A1 (ja) * 2016-12-12 2018-06-21 株式会社Ｆｕｊｉ 部品装着機
WO2018163331A1 (ja) * 2017-03-08 2018-09-13 株式会社Ｆｕｊｉ 転写装置及び部品実装装置
US20190221456A1 (en) * 2018-01-12 2019-07-18 Intel Corporation Selective and multilevel solder paste pin transfer

Also Published As

Publication number Publication date
CN115700017A (zh) 2023-02-03
DE112020007440T5 (de) 2023-05-04
WO2022014038A1 (ja) 2022-01-20
US20230247772A1 (en) 2023-08-03

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