JPWO2022004464A1 - - Google Patents

Info

Publication number
JPWO2022004464A1
JPWO2022004464A1 JP2022533879A JP2022533879A JPWO2022004464A1 JP WO2022004464 A1 JPWO2022004464 A1 JP WO2022004464A1 JP 2022533879 A JP2022533879 A JP 2022533879A JP 2022533879 A JP2022533879 A JP 2022533879A JP WO2022004464 A1 JPWO2022004464 A1 JP WO2022004464A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022533879A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022004464A1 publication Critical patent/JPWO2022004464A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing & Machinery (AREA)
  • Silicon Polymers (AREA)
JP2022533879A 2020-06-30 2021-06-21 Pending JPWO2022004464A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020112615 2020-06-30
PCT/JP2021/023400 WO2022004464A1 (ja) 2020-06-30 2021-06-21 硬化性シリコーン組成物及びその硬化物

Publications (1)

Publication Number Publication Date
JPWO2022004464A1 true JPWO2022004464A1 (ja) 2022-01-06

Family

ID=79316192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022533879A Pending JPWO2022004464A1 (ja) 2020-06-30 2021-06-21

Country Status (7)

Country Link
US (1) US20240043623A1 (ja)
EP (1) EP4174137A4 (ja)
JP (1) JPWO2022004464A1 (ja)
KR (1) KR20230030637A (ja)
CN (1) CN116134093A (ja)
TW (1) TW202206505A (ja)
WO (1) WO2022004464A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023132229A1 (ja) * 2022-01-06 2023-07-13 日産化学株式会社 接着剤組成物、積層体、積層体の製造方法、及び加工された基板の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528854A (en) 1975-07-11 1977-01-24 Hitachi Ltd Device for detecting oil inside a draining pit
US5366809A (en) 1993-09-02 1994-11-22 Dow Corning Corporation Silicone pressure-sensitive adhesives
US5373078A (en) 1993-10-29 1994-12-13 Dow Corning Corporation Low viscosity curable organosiloxane compositions
JP3831481B2 (ja) 1996-11-18 2006-10-11 東レ・ダウコーニング株式会社 カルバシラトラン誘導体、その製造方法、接着促進剤、および硬化性シリコーン組成物
JP5534977B2 (ja) 2010-06-29 2014-07-02 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および光半導体装置
JP5680889B2 (ja) 2010-06-29 2015-03-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および光半導体装置
WO2014124389A1 (en) * 2013-02-11 2014-08-14 Dow Corning Corporation Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin
KR20150097947A (ko) 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
JP6586555B2 (ja) * 2014-12-26 2019-10-09 ダウ・東レ株式会社 硬化性シリコーン組成物、それからなる半導体用封止剤および半導体装置
CN106008979A (zh) * 2015-03-27 2016-10-12 豪雅冠得股份有限公司 固化性树脂组合物及光半导体装置
WO2017043328A1 (ja) * 2015-09-11 2017-03-16 ケイ素材料開発株式会社 架橋性オルガノポリシロキサン組成物およびその硬化物
JP2018172447A (ja) * 2015-09-11 2018-11-08 ケイ素材料開発株式会社 架橋性オルガノポリシロキサン組成物およびその硬化物
EP3699236A4 (en) * 2017-10-20 2021-07-14 Dow Toray Co., Ltd. COMPOSITION OF PARTICULAR CURING SILICONE, RELATED CURED ARTICLE, AND METHOD FOR MANUFACTURING THIS COMPOSITION
WO2019093295A1 (ja) * 2017-11-07 2019-05-16 ダウ・東レ株式会社 オルガノポリシロキサン組成物
JP7491655B2 (ja) * 2018-12-13 2024-05-28 ダウ・東レ株式会社 シリコーン感圧接着剤組成物およびその用途

Also Published As

Publication number Publication date
EP4174137A1 (en) 2023-05-03
EP4174137A4 (en) 2024-07-17
TW202206505A (zh) 2022-02-16
WO2022004464A1 (ja) 2022-01-06
CN116134093A (zh) 2023-05-16
US20240043623A1 (en) 2024-02-08
KR20230030637A (ko) 2023-03-06

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Effective date: 20240605