JPWO2022004464A1 - - Google Patents
Info
- Publication number
- JPWO2022004464A1 JPWO2022004464A1 JP2022533879A JP2022533879A JPWO2022004464A1 JP WO2022004464 A1 JPWO2022004464 A1 JP WO2022004464A1 JP 2022533879 A JP2022533879 A JP 2022533879A JP 2022533879 A JP2022533879 A JP 2022533879A JP WO2022004464 A1 JPWO2022004464 A1 JP WO2022004464A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing & Machinery (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020112615 | 2020-06-30 | ||
PCT/JP2021/023400 WO2022004464A1 (ja) | 2020-06-30 | 2021-06-21 | 硬化性シリコーン組成物及びその硬化物 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022004464A1 true JPWO2022004464A1 (ja) | 2022-01-06 |
Family
ID=79316192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022533879A Pending JPWO2022004464A1 (ja) | 2020-06-30 | 2021-06-21 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20240043623A1 (ja) |
EP (1) | EP4174137A4 (ja) |
JP (1) | JPWO2022004464A1 (ja) |
KR (1) | KR20230030637A (ja) |
CN (1) | CN116134093A (ja) |
TW (1) | TW202206505A (ja) |
WO (1) | WO2022004464A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023132229A1 (ja) * | 2022-01-06 | 2023-07-13 | 日産化学株式会社 | 接着剤組成物、積層体、積層体の製造方法、及び加工された基板の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS528854A (en) | 1975-07-11 | 1977-01-24 | Hitachi Ltd | Device for detecting oil inside a draining pit |
US5366809A (en) | 1993-09-02 | 1994-11-22 | Dow Corning Corporation | Silicone pressure-sensitive adhesives |
US5373078A (en) | 1993-10-29 | 1994-12-13 | Dow Corning Corporation | Low viscosity curable organosiloxane compositions |
JP3831481B2 (ja) | 1996-11-18 | 2006-10-11 | 東レ・ダウコーニング株式会社 | カルバシラトラン誘導体、その製造方法、接着促進剤、および硬化性シリコーン組成物 |
JP5534977B2 (ja) | 2010-06-29 | 2014-07-02 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および光半導体装置 |
JP5680889B2 (ja) | 2010-06-29 | 2015-03-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および光半導体装置 |
WO2014124389A1 (en) * | 2013-02-11 | 2014-08-14 | Dow Corning Corporation | Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin |
KR20150097947A (ko) | 2014-02-19 | 2015-08-27 | 다우 코닝 코포레이션 | 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물 |
JP6586555B2 (ja) * | 2014-12-26 | 2019-10-09 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、それからなる半導体用封止剤および半導体装置 |
CN106008979A (zh) * | 2015-03-27 | 2016-10-12 | 豪雅冠得股份有限公司 | 固化性树脂组合物及光半导体装置 |
WO2017043328A1 (ja) * | 2015-09-11 | 2017-03-16 | ケイ素材料開発株式会社 | 架橋性オルガノポリシロキサン組成物およびその硬化物 |
JP2018172447A (ja) * | 2015-09-11 | 2018-11-08 | ケイ素材料開発株式会社 | 架橋性オルガノポリシロキサン組成物およびその硬化物 |
EP3699236A4 (en) * | 2017-10-20 | 2021-07-14 | Dow Toray Co., Ltd. | COMPOSITION OF PARTICULAR CURING SILICONE, RELATED CURED ARTICLE, AND METHOD FOR MANUFACTURING THIS COMPOSITION |
WO2019093295A1 (ja) * | 2017-11-07 | 2019-05-16 | ダウ・東レ株式会社 | オルガノポリシロキサン組成物 |
JP7491655B2 (ja) * | 2018-12-13 | 2024-05-28 | ダウ・東レ株式会社 | シリコーン感圧接着剤組成物およびその用途 |
-
2021
- 2021-06-21 KR KR1020237002719A patent/KR20230030637A/ko active Search and Examination
- 2021-06-21 JP JP2022533879A patent/JPWO2022004464A1/ja active Pending
- 2021-06-21 EP EP21833019.9A patent/EP4174137A4/en active Pending
- 2021-06-21 WO PCT/JP2021/023400 patent/WO2022004464A1/ja unknown
- 2021-06-21 US US18/013,882 patent/US20240043623A1/en active Pending
- 2021-06-21 CN CN202180060343.5A patent/CN116134093A/zh active Pending
- 2021-06-28 TW TW110123604A patent/TW202206505A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP4174137A1 (en) | 2023-05-03 |
EP4174137A4 (en) | 2024-07-17 |
TW202206505A (zh) | 2022-02-16 |
WO2022004464A1 (ja) | 2022-01-06 |
CN116134093A (zh) | 2023-05-16 |
US20240043623A1 (en) | 2024-02-08 |
KR20230030637A (ko) | 2023-03-06 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240605 |