JPWO2021250984A1 - - Google Patents

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Publication number
JPWO2021250984A1
JPWO2021250984A1 JP2021542162A JP2021542162A JPWO2021250984A1 JP WO2021250984 A1 JPWO2021250984 A1 JP WO2021250984A1 JP 2021542162 A JP2021542162 A JP 2021542162A JP 2021542162 A JP2021542162 A JP 2021542162A JP WO2021250984 A1 JPWO2021250984 A1 JP WO2021250984A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021542162A
Other languages
Japanese (ja)
Other versions
JP6966668B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2021/013840 external-priority patent/WO2021250984A1/en
Application granted granted Critical
Publication of JP6966668B1 publication Critical patent/JP6966668B1/en
Publication of JPWO2021250984A1 publication Critical patent/JPWO2021250984A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/40Extraction of image or video features
    • G06V10/44Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
    • G06V10/443Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by matching or filtering
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/70Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/764Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/10Image acquisition modality
    • G06T2207/10024Color image
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/20Special algorithmic details
    • G06T2207/20081Training; Learning
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/20Special algorithmic details
    • G06T2207/20212Image combination
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Artificial Intelligence (AREA)
  • Computing Systems (AREA)
  • Databases & Information Systems (AREA)
  • Evolutionary Computation (AREA)
  • General Health & Medical Sciences (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2021542162A 2020-06-08 2021-03-31 Semiconductor inspection method and semiconductor inspection equipment Active JP6966668B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020099463 2020-06-08
JP2020099463 2020-06-08
PCT/JP2021/013840 WO2021250984A1 (en) 2020-06-08 2021-03-31 Semiconductor inspecting method and semiconductor inspecting device

Publications (2)

Publication Number Publication Date
JP6966668B1 JP6966668B1 (en) 2021-11-17
JPWO2021250984A1 true JPWO2021250984A1 (en) 2021-12-16

Family

ID=78509540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021542162A Active JP6966668B1 (en) 2020-06-08 2021-03-31 Semiconductor inspection method and semiconductor inspection equipment

Country Status (5)

Country Link
US (1) US20230206422A1 (en)
EP (1) EP4131350A4 (en)
JP (1) JP6966668B1 (en)
KR (1) KR20230021669A (en)
CN (1) CN115699281A (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004146428A (en) * 2002-10-22 2004-05-20 Renesas Technology Corp Method for analyzing failure
JP2007000306A (en) 2005-06-23 2007-01-11 Yoshiko Amano Clothes-line hanger
JP2009186319A (en) * 2008-02-06 2009-08-20 Fujitsu Microelectronics Ltd Defect inspection method and defect inspection apparatus
KR102278352B1 (en) * 2013-12-26 2021-07-19 하마마츠 포토닉스 가부시키가이샤 Image processing method, image processing apparatus, image processing program, and storage medium in which image processing program has been stored
KR101664405B1 (en) 2014-02-20 2016-10-10 김일희 Isolated power generating type escalator handle cleaner
US10605859B2 (en) * 2016-09-14 2020-03-31 Qualcomm Incorporated Visible alignment markers/landmarks for CAD-to-silicon backside image alignment
JP6865044B2 (en) * 2017-01-19 2021-04-28 浜松ホトニクス株式会社 Inspection method, inspection equipment, and marking forming method
US10282510B2 (en) * 2017-04-07 2019-05-07 Fei Company Alignment of CAD data to images in high resolution optical fault analysis
JP7158224B2 (en) * 2018-09-26 2022-10-21 浜松ホトニクス株式会社 Semiconductor device inspection method and semiconductor device inspection apparatus

Also Published As

Publication number Publication date
JP6966668B1 (en) 2021-11-17
EP4131350A4 (en) 2024-05-08
US20230206422A1 (en) 2023-06-29
KR20230021669A (en) 2023-02-14
EP4131350A1 (en) 2023-02-08
CN115699281A (en) 2023-02-03

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