JPWO2021250984A1 - - Google Patents
Info
- Publication number
- JPWO2021250984A1 JPWO2021250984A1 JP2021542162A JP2021542162A JPWO2021250984A1 JP WO2021250984 A1 JPWO2021250984 A1 JP WO2021250984A1 JP 2021542162 A JP2021542162 A JP 2021542162A JP 2021542162 A JP2021542162 A JP 2021542162A JP WO2021250984 A1 JPWO2021250984 A1 JP WO2021250984A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
- G06V10/443—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by matching or filtering
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10024—Color image
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20212—Image combination
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Artificial Intelligence (AREA)
- Computing Systems (AREA)
- Databases & Information Systems (AREA)
- Evolutionary Computation (AREA)
- General Health & Medical Sciences (AREA)
- Medical Informatics (AREA)
- Software Systems (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020099463 | 2020-06-08 | ||
JP2020099463 | 2020-06-08 | ||
PCT/JP2021/013840 WO2021250984A1 (en) | 2020-06-08 | 2021-03-31 | Semiconductor inspecting method and semiconductor inspecting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6966668B1 JP6966668B1 (en) | 2021-11-17 |
JPWO2021250984A1 true JPWO2021250984A1 (en) | 2021-12-16 |
Family
ID=78509540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021542162A Active JP6966668B1 (en) | 2020-06-08 | 2021-03-31 | Semiconductor inspection method and semiconductor inspection equipment |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230206422A1 (en) |
EP (1) | EP4131350A4 (en) |
JP (1) | JP6966668B1 (en) |
KR (1) | KR20230021669A (en) |
CN (1) | CN115699281A (en) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004146428A (en) * | 2002-10-22 | 2004-05-20 | Renesas Technology Corp | Method for analyzing failure |
JP2007000306A (en) | 2005-06-23 | 2007-01-11 | Yoshiko Amano | Clothes-line hanger |
JP2009186319A (en) * | 2008-02-06 | 2009-08-20 | Fujitsu Microelectronics Ltd | Defect inspection method and defect inspection apparatus |
KR102278352B1 (en) * | 2013-12-26 | 2021-07-19 | 하마마츠 포토닉스 가부시키가이샤 | Image processing method, image processing apparatus, image processing program, and storage medium in which image processing program has been stored |
KR101664405B1 (en) | 2014-02-20 | 2016-10-10 | 김일희 | Isolated power generating type escalator handle cleaner |
US10605859B2 (en) * | 2016-09-14 | 2020-03-31 | Qualcomm Incorporated | Visible alignment markers/landmarks for CAD-to-silicon backside image alignment |
JP6865044B2 (en) * | 2017-01-19 | 2021-04-28 | 浜松ホトニクス株式会社 | Inspection method, inspection equipment, and marking forming method |
US10282510B2 (en) * | 2017-04-07 | 2019-05-07 | Fei Company | Alignment of CAD data to images in high resolution optical fault analysis |
JP7158224B2 (en) * | 2018-09-26 | 2022-10-21 | 浜松ホトニクス株式会社 | Semiconductor device inspection method and semiconductor device inspection apparatus |
-
2021
- 2021-03-31 EP EP21822608.2A patent/EP4131350A4/en active Pending
- 2021-03-31 CN CN202180041063.XA patent/CN115699281A/en active Pending
- 2021-03-31 US US17/925,625 patent/US20230206422A1/en active Pending
- 2021-03-31 JP JP2021542162A patent/JP6966668B1/en active Active
- 2021-03-31 KR KR1020227044286A patent/KR20230021669A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6966668B1 (en) | 2021-11-17 |
EP4131350A4 (en) | 2024-05-08 |
US20230206422A1 (en) | 2023-06-29 |
KR20230021669A (en) | 2023-02-14 |
EP4131350A1 (en) | 2023-02-08 |
CN115699281A (en) | 2023-02-03 |
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