JPWO2021246091A1 - - Google Patents

Info

Publication number
JPWO2021246091A1
JPWO2021246091A1 JP2022528490A JP2022528490A JPWO2021246091A1 JP WO2021246091 A1 JPWO2021246091 A1 JP WO2021246091A1 JP 2022528490 A JP2022528490 A JP 2022528490A JP 2022528490 A JP2022528490 A JP 2022528490A JP WO2021246091 A1 JPWO2021246091 A1 JP WO2021246091A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022528490A
Other versions
JPWO2021246091A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021246091A1 publication Critical patent/JPWO2021246091A1/ja
Publication of JPWO2021246091A5 publication Critical patent/JPWO2021246091A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022528490A 2020-06-05 2021-04-27 Pending JPWO2021246091A1 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020098079 2020-06-05
JP2020098076 2020-06-05
JP2020098078 2020-06-05
JP2020181132 2020-10-29
PCT/JP2021/016757 WO2021246091A1 (ja) 2020-06-05 2021-04-27 検査装置、部品装着システムおよび基板製造方法

Publications (2)

Publication Number Publication Date
JPWO2021246091A1 true JPWO2021246091A1 (ja) 2021-12-09
JPWO2021246091A5 JPWO2021246091A5 (ja) 2023-02-17

Family

ID=78830842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022528490A Pending JPWO2021246091A1 (ja) 2020-06-05 2021-04-27

Country Status (3)

Country Link
JP (1) JPWO2021246091A1 (ja)
CN (1) CN115669256A (ja)
WO (1) WO2021246091A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8224063B2 (en) * 2007-09-28 2012-07-17 Panasonic Corporation Inspection apparatus and inspection method
US8300921B2 (en) * 2008-01-25 2012-10-30 Panasonic Corporation Inspection apparatus and inspection method
JP5927504B2 (ja) * 2012-11-30 2016-06-01 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法
JP6047760B2 (ja) * 2013-11-20 2016-12-21 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法
JP6277423B2 (ja) * 2014-09-11 2018-02-14 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装システム
EP3451812B1 (en) * 2016-04-26 2022-11-30 Fuji Corporation Substrate work machine

Also Published As

Publication number Publication date
CN115669256A (zh) 2023-01-31
WO2021246091A1 (ja) 2021-12-09

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