JPWO2021205994A1 - - Google Patents
Info
- Publication number
- JPWO2021205994A1 JPWO2021205994A1 JP2022514449A JP2022514449A JPWO2021205994A1 JP WO2021205994 A1 JPWO2021205994 A1 JP WO2021205994A1 JP 2022514449 A JP2022514449 A JP 2022514449A JP 2022514449 A JP2022514449 A JP 2022514449A JP WO2021205994 A1 JPWO2021205994 A1 JP WO2021205994A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/0209—Cleaning of wafer backside
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020071070 | 2020-04-10 | ||
JP2020071070 | 2020-04-10 | ||
JP2021014519 | 2021-02-01 | ||
JP2021014519 | 2021-02-01 | ||
PCT/JP2021/014232 WO2021205994A1 (en) | 2020-04-10 | 2021-04-01 | Substrate processing method and substrate processing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021205994A1 true JPWO2021205994A1 (en) | 2021-10-14 |
JP7199602B2 JP7199602B2 (en) | 2023-01-05 |
Family
ID=78023514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022514449A Active JP7199602B2 (en) | 2020-04-10 | 2021-04-01 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7199602B2 (en) |
KR (1) | KR102583543B1 (en) |
CN (1) | CN115349163B (en) |
TW (1) | TW202214358A (en) |
WO (1) | WO2021205994A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024014291A1 (en) * | 2022-07-12 | 2024-01-18 | 東京エレクトロン株式会社 | Substrate processing method and substrate processing device |
TWI836625B (en) * | 2022-09-26 | 2024-03-21 | 南亞塑膠工業股份有限公司 | Cleaning system for circuit board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018056223A (en) * | 2016-09-27 | 2018-04-05 | 株式会社Screenホールディングス | Substrate processing apparatus |
JP2018093146A (en) * | 2016-12-07 | 2018-06-14 | 東京エレクトロン株式会社 | Substrate processing device, substrate processing method and storage medium |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4357182B2 (en) * | 2003-02-10 | 2009-11-04 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate processing method |
JP4940066B2 (en) * | 2006-10-23 | 2012-05-30 | 東京エレクトロン株式会社 | Cleaning apparatus, cleaning method, and computer-readable storage medium |
JP5996424B2 (en) | 2012-12-28 | 2016-09-21 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
US10553421B2 (en) * | 2015-05-15 | 2020-02-04 | Tokyo Electron Limited | Substrate processing apparatus, substrate processing method and storage medium |
JP7007869B2 (en) * | 2017-11-14 | 2022-01-25 | 東京エレクトロン株式会社 | Board processing equipment, board processing method and computer-readable recording medium |
-
2021
- 2021-03-29 TW TW110111232A patent/TW202214358A/en unknown
- 2021-04-01 WO PCT/JP2021/014232 patent/WO2021205994A1/en active Application Filing
- 2021-04-01 JP JP2022514449A patent/JP7199602B2/en active Active
- 2021-04-01 KR KR1020227038206A patent/KR102583543B1/en active IP Right Grant
- 2021-04-01 CN CN202180025344.6A patent/CN115349163B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018056223A (en) * | 2016-09-27 | 2018-04-05 | 株式会社Screenホールディングス | Substrate processing apparatus |
JP2018093146A (en) * | 2016-12-07 | 2018-06-14 | 東京エレクトロン株式会社 | Substrate processing device, substrate processing method and storage medium |
Also Published As
Publication number | Publication date |
---|---|
WO2021205994A1 (en) | 2021-10-14 |
CN115349163B (en) | 2023-10-17 |
CN115349163A (en) | 2022-11-15 |
JP7199602B2 (en) | 2023-01-05 |
KR20220153666A (en) | 2022-11-18 |
KR102583543B1 (en) | 2023-10-05 |
TW202214358A (en) | 2022-04-16 |
Similar Documents
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