JPWO2021205994A1 - - Google Patents

Info

Publication number
JPWO2021205994A1
JPWO2021205994A1 JP2022514449A JP2022514449A JPWO2021205994A1 JP WO2021205994 A1 JPWO2021205994 A1 JP WO2021205994A1 JP 2022514449 A JP2022514449 A JP 2022514449A JP 2022514449 A JP2022514449 A JP 2022514449A JP WO2021205994 A1 JPWO2021205994 A1 JP WO2021205994A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022514449A
Other languages
Japanese (ja)
Other versions
JP7199602B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021205994A1 publication Critical patent/JPWO2021205994A1/ja
Application granted granted Critical
Publication of JP7199602B2 publication Critical patent/JP7199602B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2022514449A 2020-04-10 2021-04-01 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Active JP7199602B2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020071070 2020-04-10
JP2020071070 2020-04-10
JP2021014519 2021-02-01
JP2021014519 2021-02-01
PCT/JP2021/014232 WO2021205994A1 (en) 2020-04-10 2021-04-01 Substrate processing method and substrate processing device

Publications (2)

Publication Number Publication Date
JPWO2021205994A1 true JPWO2021205994A1 (en) 2021-10-14
JP7199602B2 JP7199602B2 (en) 2023-01-05

Family

ID=78023514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022514449A Active JP7199602B2 (en) 2020-04-10 2021-04-01 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Country Status (5)

Country Link
JP (1) JP7199602B2 (en)
KR (1) KR102583543B1 (en)
CN (1) CN115349163B (en)
TW (1) TW202214358A (en)
WO (1) WO2021205994A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024014291A1 (en) * 2022-07-12 2024-01-18 東京エレクトロン株式会社 Substrate processing method and substrate processing device
TWI836625B (en) * 2022-09-26 2024-03-21 南亞塑膠工業股份有限公司 Cleaning system for circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018056223A (en) * 2016-09-27 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus
JP2018093146A (en) * 2016-12-07 2018-06-14 東京エレクトロン株式会社 Substrate processing device, substrate processing method and storage medium

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4357182B2 (en) * 2003-02-10 2009-11-04 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP4940066B2 (en) * 2006-10-23 2012-05-30 東京エレクトロン株式会社 Cleaning apparatus, cleaning method, and computer-readable storage medium
JP5996424B2 (en) 2012-12-28 2016-09-21 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
US10553421B2 (en) * 2015-05-15 2020-02-04 Tokyo Electron Limited Substrate processing apparatus, substrate processing method and storage medium
JP7007869B2 (en) * 2017-11-14 2022-01-25 東京エレクトロン株式会社 Board processing equipment, board processing method and computer-readable recording medium

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018056223A (en) * 2016-09-27 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus
JP2018093146A (en) * 2016-12-07 2018-06-14 東京エレクトロン株式会社 Substrate processing device, substrate processing method and storage medium

Also Published As

Publication number Publication date
WO2021205994A1 (en) 2021-10-14
CN115349163B (en) 2023-10-17
CN115349163A (en) 2022-11-15
JP7199602B2 (en) 2023-01-05
KR20220153666A (en) 2022-11-18
KR102583543B1 (en) 2023-10-05
TW202214358A (en) 2022-04-16

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