JPWO2021205980A1 - - Google Patents
Info
- Publication number
- JPWO2021205980A1 JPWO2021205980A1 JP2022514442A JP2022514442A JPWO2021205980A1 JP WO2021205980 A1 JPWO2021205980 A1 JP WO2021205980A1 JP 2022514442 A JP2022514442 A JP 2022514442A JP 2022514442 A JP2022514442 A JP 2022514442A JP WO2021205980 A1 JPWO2021205980 A1 JP WO2021205980A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020070039 | 2020-04-08 | ||
PCT/JP2021/014166 WO2021205980A1 (ja) | 2020-04-08 | 2021-04-01 | 実装システム、実装方法及びプログラム |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021205980A1 true JPWO2021205980A1 (ja) | 2021-10-14 |
Family
ID=78024104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022514442A Pending JPWO2021205980A1 (ja) | 2020-04-08 | 2021-04-01 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2021205980A1 (ja) |
WO (1) | WO2021205980A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023163027A1 (ja) * | 2022-02-25 | 2023-08-31 | パナソニックIpマネジメント株式会社 | 実装システム及び実装方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2633147B2 (ja) * | 1992-07-23 | 1997-07-23 | 松下電工株式会社 | 部品実装方法 |
US20140198185A1 (en) * | 2013-01-17 | 2014-07-17 | Cyberoptics Corporation | Multi-camera sensor for three-dimensional imaging of a circuit board |
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2021
- 2021-04-01 WO PCT/JP2021/014166 patent/WO2021205980A1/ja active Application Filing
- 2021-04-01 JP JP2022514442A patent/JPWO2021205980A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2021205980A1 (ja) | 2021-10-14 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240205 |