JPWO2021193028A1 - - Google Patents
Info
- Publication number
- JPWO2021193028A1 JPWO2021193028A1 JP2022509541A JP2022509541A JPWO2021193028A1 JP WO2021193028 A1 JPWO2021193028 A1 JP WO2021193028A1 JP 2022509541 A JP2022509541 A JP 2022509541A JP 2022509541 A JP2022509541 A JP 2022509541A JP WO2021193028 A1 JPWO2021193028 A1 JP WO2021193028A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020059099 | 2020-03-27 | ||
| PCT/JP2021/009335 WO2021193028A1 (en) | 2020-03-27 | 2021-03-09 | Resin composition for molding and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021193028A1 true JPWO2021193028A1 (en) | 2021-09-30 |
Family
ID=77891456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022509541A Pending JPWO2021193028A1 (en) | 2020-03-27 | 2021-03-09 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021193028A1 (en) |
| TW (1) | TW202140599A (en) |
| WO (1) | WO2021193028A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113912914B (en) * | 2021-12-07 | 2022-02-18 | 北京石墨烯技术研究院有限公司 | Polymer-based composite heat conduction material and preparation method and application thereof |
| CN115403743A (en) * | 2022-09-27 | 2022-11-29 | 重庆大学 | Curing method of high-thermal-conductivity spherical boron nitride composite epoxy resin |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6331575B2 (en) * | 2013-03-28 | 2018-05-30 | 三菱ケミカル株式会社 | Composition for interlayer filler of stacked semiconductor device, stacked semiconductor device, and manufacturing method of stacked semiconductor device |
| CN105980298B (en) * | 2014-02-12 | 2018-12-18 | 电化株式会社 | Spherical particulate boron nitride and its manufacturing method |
| EP3594259B1 (en) * | 2017-03-09 | 2024-04-17 | Resonac Corporation | Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing epoxy resin |
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2021
- 2021-03-09 JP JP2022509541A patent/JPWO2021193028A1/ja active Pending
- 2021-03-09 WO PCT/JP2021/009335 patent/WO2021193028A1/en active Application Filing
- 2021-03-15 TW TW110109162A patent/TW202140599A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202140599A (en) | 2021-11-01 |
| WO2021193028A1 (en) | 2021-09-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231102 |