JPWO2021177420A1 - - Google Patents
Info
- Publication number
- JPWO2021177420A1 JPWO2021177420A1 JP2022504465A JP2022504465A JPWO2021177420A1 JP WO2021177420 A1 JPWO2021177420 A1 JP WO2021177420A1 JP 2022504465 A JP2022504465 A JP 2022504465A JP 2022504465 A JP2022504465 A JP 2022504465A JP WO2021177420 A1 JPWO2021177420 A1 JP WO2021177420A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020036584 | 2020-03-04 | ||
PCT/JP2021/008521 WO2021177420A1 (ja) | 2020-03-04 | 2021-03-04 | 導電性ペースト、電子部品及び積層セラミックコンデンサ |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021177420A1 true JPWO2021177420A1 (ja) | 2021-09-10 |
Family
ID=77613008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022504465A Pending JPWO2021177420A1 (ja) | 2020-03-04 | 2021-03-04 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2021177420A1 (ja) |
KR (1) | KR20220145326A (ja) |
CN (1) | CN115210823A (ja) |
TW (1) | TW202141532A (ja) |
WO (1) | WO2021177420A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116959779B (zh) * | 2023-09-15 | 2023-12-08 | 南通艾盛新能源科技有限公司 | 高分子分散剂、有机载体以及金属导电浆料 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005197019A (ja) | 2004-01-05 | 2005-07-21 | Matsushita Electric Ind Co Ltd | 導電性ペーストおよびこれを用いた積層セラミック電子部品 |
JP5843821B2 (ja) * | 2013-08-13 | 2016-01-13 | Jx日鉱日石金属株式会社 | 金属粉ペースト、及びその製造方法 |
CN108780673B (zh) * | 2016-02-29 | 2020-06-02 | 住友金属矿山株式会社 | 导电性浆料、电子部件以及叠层陶瓷电容器 |
JP6939015B2 (ja) * | 2017-03-29 | 2021-09-22 | 住友金属鉱山株式会社 | 積層セラミックコンデンサ内部電極用のグラビア印刷用導電性ペースト |
JP7176227B2 (ja) * | 2017-05-23 | 2022-11-22 | 住友金属鉱山株式会社 | 導電性ペースト、電子部品及び積層セラミックコンデンサ |
WO2019107501A1 (ja) * | 2017-11-30 | 2019-06-06 | 住友金属鉱山株式会社 | 導電性ペースト、電子部品、及び積層セラミックコンデンサ |
JP7206671B2 (ja) * | 2018-07-25 | 2023-01-18 | 住友金属鉱山株式会社 | 導電性ペースト、電子部品及び積層セラミックコンデンサ |
-
2021
- 2021-03-04 KR KR1020227024705A patent/KR20220145326A/ko unknown
- 2021-03-04 JP JP2022504465A patent/JPWO2021177420A1/ja active Pending
- 2021-03-04 WO PCT/JP2021/008521 patent/WO2021177420A1/ja active Application Filing
- 2021-03-04 CN CN202180018601.3A patent/CN115210823A/zh active Pending
- 2021-03-04 TW TW110107776A patent/TW202141532A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN115210823A (zh) | 2022-10-18 |
KR20220145326A (ko) | 2022-10-28 |
TW202141532A (zh) | 2021-11-01 |
WO2021177420A1 (ja) | 2021-09-10 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20221116 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20221128 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231011 |