JPWO2021172426A1 - - Google Patents
Info
- Publication number
- JPWO2021172426A1 JPWO2021172426A1 JP2022503688A JP2022503688A JPWO2021172426A1 JP WO2021172426 A1 JPWO2021172426 A1 JP WO2021172426A1 JP 2022503688 A JP2022503688 A JP 2022503688A JP 2022503688 A JP2022503688 A JP 2022503688A JP WO2021172426 A1 JPWO2021172426 A1 JP WO2021172426A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2429/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Derivatives of such polymer
- C08J2429/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Mechanical Engineering (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020031717 | 2020-02-27 | ||
PCT/JP2021/007087 WO2021172426A1 (ja) | 2020-02-27 | 2021-02-25 | 樹脂フィルム、複合シート、及び第1保護膜付き半導体チップの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021172426A1 true JPWO2021172426A1 (ja) | 2021-09-02 |
Family
ID=77490089
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022503187A Pending JPWO2021171898A1 (ja) | 2020-02-27 | 2021-01-29 | |
JP2022503692A Pending JPWO2021172431A1 (ja) | 2020-02-27 | 2021-02-25 | |
JP2022503678A Pending JPWO2021172410A1 (ja) | 2020-02-27 | 2021-02-25 | |
JP2022503688A Pending JPWO2021172426A1 (ja) | 2020-02-27 | 2021-02-25 | |
JP2022503687A Pending JPWO2021172424A1 (ja) | 2020-02-27 | 2021-02-25 |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022503187A Pending JPWO2021171898A1 (ja) | 2020-02-27 | 2021-01-29 | |
JP2022503692A Pending JPWO2021172431A1 (ja) | 2020-02-27 | 2021-02-25 | |
JP2022503678A Pending JPWO2021172410A1 (ja) | 2020-02-27 | 2021-02-25 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022503687A Pending JPWO2021172424A1 (ja) | 2020-02-27 | 2021-02-25 |
Country Status (5)
Country | Link |
---|---|
JP (5) | JPWO2021171898A1 (ja) |
KR (5) | KR20220147084A (ja) |
CN (5) | CN115176333A (ja) |
TW (5) | TW202136448A (ja) |
WO (5) | WO2021171898A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022138946A1 (ja) * | 2020-12-25 | 2022-06-30 | リンテック株式会社 | 半導体チップの製造方法 |
JP7095780B1 (ja) | 2021-06-09 | 2022-07-05 | 住友ベークライト株式会社 | 離型フィルムおよび成型品の製造方法 |
JP2024047019A (ja) * | 2022-09-26 | 2024-04-05 | 株式会社レゾナック | 半導体装置の製造方法及び半導体ウエハ加工用接着フィルム |
JP2024047022A (ja) * | 2022-09-26 | 2024-04-05 | 株式会社レゾナック | 半導体装置の製造方法及び半導体ウエハ加工用接着フィルム |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59205426A (ja) | 1983-05-06 | 1984-11-21 | Nippon Mining Co Ltd | 転炉の操業方法 |
JP4778667B2 (ja) * | 2001-06-29 | 2011-09-21 | 富士通株式会社 | アンダーフィル用シート材、半導体チップのアンダーフィル方法および半導体チップの実装方法 |
JP4776188B2 (ja) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | 半導体装置製造方法およびウエハ加工用テープ |
JP4532358B2 (ja) * | 2005-06-15 | 2010-08-25 | 株式会社ディスコ | 半導体チップの製造方法 |
JP5564782B2 (ja) * | 2008-06-17 | 2014-08-06 | 日立化成株式会社 | 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置 |
JP2011171712A (ja) * | 2010-01-21 | 2011-09-01 | Hitachi Chem Co Ltd | 半導体ウエハ加工用接着テープ、半導体ウエハ加工用接着テープ付き半導体ウエハの製造方法、半導体装置の製造方法及び半導体装置 |
JP5738263B2 (ja) * | 2012-12-25 | 2015-06-17 | 日立化成株式会社 | 半導体装置の製造方法 |
KR102177881B1 (ko) * | 2013-03-19 | 2020-11-12 | 린텍 가부시키가이샤 | 보호막 형성용 필름, 보호막을 구비한 칩 및 보호막을 구비한 칩의 제조 방법 |
JP6328987B2 (ja) * | 2014-04-22 | 2018-05-23 | デクセリアルズ株式会社 | 半導体装置の製造方法 |
JP2015092594A (ja) | 2014-12-10 | 2015-05-14 | 日東電工株式会社 | 保護層形成用フィルム |
WO2017077957A1 (ja) | 2015-11-04 | 2017-05-11 | リンテック株式会社 | 半導体装置の製造方法 |
TWI623425B (zh) * | 2015-11-04 | 2018-05-11 | 日商琳得科股份有限公司 | 固化性樹脂膜及第一保護膜形成用片 |
KR102412725B1 (ko) * | 2016-10-05 | 2022-06-23 | 린텍 가부시키가이샤 | 제1 보호막 형성용 시트 |
JP6438181B1 (ja) * | 2017-05-17 | 2018-12-12 | リンテック株式会社 | 半導体装置及びその製造方法 |
JP7098221B2 (ja) * | 2017-09-08 | 2022-07-11 | 株式会社ディスコ | ウェーハの加工方法 |
TWI783082B (zh) * | 2017-11-17 | 2022-11-11 | 日商琳得科股份有限公司 | 熱硬化性樹脂膜及第一保護膜形成用片材 |
CN111357088B (zh) * | 2017-11-17 | 2024-05-14 | 琳得科株式会社 | 带第一保护膜的半导体芯片及其制造方法、及半导体芯片-第一保护膜层叠体的评价方法 |
JP7064184B2 (ja) * | 2017-12-11 | 2022-05-10 | 日東電工株式会社 | ダイシングテープ一体型封止用シート及び半導体装置の製造方法 |
TWI825080B (zh) * | 2018-03-30 | 2023-12-11 | 日商琳得科股份有限公司 | 半導體晶片的製造方法 |
-
2021
- 2021-01-29 JP JP2022503187A patent/JPWO2021171898A1/ja active Pending
- 2021-01-29 CN CN202180016958.8A patent/CN115176333A/zh active Pending
- 2021-01-29 TW TW110103355A patent/TW202136448A/zh unknown
- 2021-01-29 WO PCT/JP2021/003161 patent/WO2021171898A1/ja active Application Filing
- 2021-01-29 KR KR1020227028764A patent/KR20220147084A/ko unknown
- 2021-02-25 JP JP2022503692A patent/JPWO2021172431A1/ja active Pending
- 2021-02-25 KR KR1020227014068A patent/KR20220147571A/ko active Search and Examination
- 2021-02-25 KR KR1020227010219A patent/KR20220147062A/ko active Search and Examination
- 2021-02-25 JP JP2022503678A patent/JPWO2021172410A1/ja active Pending
- 2021-02-25 JP JP2022503688A patent/JPWO2021172426A1/ja active Pending
- 2021-02-25 WO PCT/JP2021/007049 patent/WO2021172410A1/ja active Application Filing
- 2021-02-25 CN CN202180006480.0A patent/CN114729142A/zh active Pending
- 2021-02-25 KR KR1020227014617A patent/KR20220147064A/ko active Search and Examination
- 2021-02-25 CN CN202180005977.0A patent/CN114555697A/zh active Pending
- 2021-02-25 WO PCT/JP2021/007103 patent/WO2021172431A1/ja active Application Filing
- 2021-02-25 KR KR1020227011241A patent/KR20220147063A/ko active Search and Examination
- 2021-02-25 WO PCT/JP2021/007082 patent/WO2021172424A1/ja active Application Filing
- 2021-02-25 CN CN202180006372.3A patent/CN114728508A/zh active Pending
- 2021-02-25 JP JP2022503687A patent/JPWO2021172424A1/ja active Pending
- 2021-02-25 WO PCT/JP2021/007087 patent/WO2021172426A1/ja active Application Filing
- 2021-02-25 CN CN202180005802.XA patent/CN114585683A/zh active Pending
- 2021-02-26 TW TW110106841A patent/TW202140664A/zh unknown
- 2021-02-26 TW TW110106835A patent/TW202200373A/zh unknown
- 2021-02-26 TW TW110106842A patent/TW202146540A/zh unknown
- 2021-02-26 TW TW110106852A patent/TW202200374A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202200374A (zh) | 2022-01-01 |
CN114728508A (zh) | 2022-07-08 |
WO2021172424A1 (ja) | 2021-09-02 |
CN114555697A (zh) | 2022-05-27 |
TW202140664A (zh) | 2021-11-01 |
CN114585683A (zh) | 2022-06-03 |
WO2021172431A1 (ja) | 2021-09-02 |
CN114729142A (zh) | 2022-07-08 |
KR20220147063A (ko) | 2022-11-02 |
TW202146540A (zh) | 2021-12-16 |
KR20220147064A (ko) | 2022-11-02 |
WO2021172410A1 (ja) | 2021-09-02 |
WO2021172426A1 (ja) | 2021-09-02 |
JPWO2021172424A1 (ja) | 2021-09-02 |
KR20220147062A (ko) | 2022-11-02 |
WO2021171898A1 (ja) | 2021-09-02 |
JPWO2021172431A1 (ja) | 2021-09-02 |
JPWO2021172410A1 (ja) | 2021-09-02 |
JPWO2021171898A1 (ja) | 2021-09-02 |
TW202200373A (zh) | 2022-01-01 |
CN115176333A (zh) | 2022-10-11 |
KR20220147084A (ko) | 2022-11-02 |
KR20220147571A (ko) | 2022-11-03 |
TW202136448A (zh) | 2021-10-01 |
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A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231226 |