JPWO2021132495A1 - - Google Patents

Info

Publication number
JPWO2021132495A1
JPWO2021132495A1 JP2021567633A JP2021567633A JPWO2021132495A1 JP WO2021132495 A1 JPWO2021132495 A1 JP WO2021132495A1 JP 2021567633 A JP2021567633 A JP 2021567633A JP 2021567633 A JP2021567633 A JP 2021567633A JP WO2021132495 A1 JPWO2021132495 A1 JP WO2021132495A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021567633A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021132495A1 publication Critical patent/JPWO2021132495A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
JP2021567633A 2019-12-27 2020-12-24 Pending JPWO2021132495A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019239454 2019-12-27
PCT/JP2020/048522 WO2021132495A1 (en) 2019-12-27 2020-12-24 Thermosetting resin composition, prepreg, laminate, printed wiring board and semiconductor package

Publications (1)

Publication Number Publication Date
JPWO2021132495A1 true JPWO2021132495A1 (en) 2021-07-01

Family

ID=76575965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567633A Pending JPWO2021132495A1 (en) 2019-12-27 2020-12-24

Country Status (3)

Country Link
JP (1) JPWO2021132495A1 (en)
TW (1) TW202140672A (en)
WO (1) WO2021132495A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118139742A (en) * 2021-10-27 2024-06-04 株式会社力森诺科 Resin-coated metal foil, printed wiring board, method for manufacturing the same, and semiconductor package
WO2023243676A1 (en) * 2022-06-17 2023-12-21 株式会社レゾナック Resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06122765A (en) * 1992-09-02 1994-05-06 Mitsubishi Kasei Corp Resin composition for semiconductor sealing
JP6503754B2 (en) * 2015-01-20 2019-04-24 日立化成株式会社 Thermosetting resin composition, prepreg, film with resin, laminate, multilayer printed wiring board and semiconductor package
JP6203303B2 (en) * 2016-02-18 2017-09-27 エア・ウォーター株式会社 Thermosetting resin composition, its production method and use
US11331888B2 (en) * 2016-07-20 2022-05-17 Showa Denko Materials Co., Ltd. Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor
JP7169076B2 (en) * 2018-03-22 2022-11-10 太陽インキ製造株式会社 Thermosetting resin composition, dry film, cured product, and electronic component

Also Published As

Publication number Publication date
WO2021132495A1 (en) 2021-07-01
TW202140672A (en) 2021-11-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231110