JPWO2021132106A1 - - Google Patents
Info
- Publication number
- JPWO2021132106A1 JPWO2021132106A1 JP2021567414A JP2021567414A JPWO2021132106A1 JP WO2021132106 A1 JPWO2021132106 A1 JP WO2021132106A1 JP 2021567414 A JP2021567414 A JP 2021567414A JP 2021567414 A JP2021567414 A JP 2021567414A JP WO2021132106 A1 JPWO2021132106 A1 JP WO2021132106A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019235574 | 2019-12-26 | ||
| PCT/JP2020/047563 WO2021132106A1 (en) | 2019-12-26 | 2020-12-18 | Method for manufacturing flexible transparent electronic device, and article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021132106A1 true JPWO2021132106A1 (en) | 2021-07-01 |
Family
ID=76574148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021567414A Pending JPWO2021132106A1 (en) | 2019-12-26 | 2020-12-18 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021132106A1 (en) |
| CN (1) | CN114762024A (en) |
| WO (1) | WO2021132106A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116014051A (en) * | 2021-10-22 | 2023-04-25 | 隆达电子股份有限公司 | Miniature LED packaging structure |
| WO2023090335A1 (en) * | 2021-11-19 | 2023-05-25 | Ａｇｃ株式会社 | Transparent electronic device, laminated glass, and method for producing transparent electronic device |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142666A (en) * | 2001-07-24 | 2003-05-16 | Seiko Epson Corp | Transfer method for element, method for manufacturing element, integrated circuit, circuit board, electrooptic device, ic card and electronic apparatus |
| US6814832B2 (en) * | 2001-07-24 | 2004-11-09 | Seiko Epson Corporation | Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance |
| JP5288581B2 (en) * | 2006-03-03 | 2013-09-11 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
| US8173519B2 (en) * | 2006-03-03 | 2012-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| CN102596565B (en) * | 2009-08-27 | 2014-09-10 | 旭硝子株式会社 | Multilayer structure with flexible base material and support, panel for use in electronic device provided with support and production method for panel for use in electronic device |
| CN102208547B (en) * | 2011-04-18 | 2013-11-20 | 电子科技大学 | Substrate for flexible photoelectronic device and preparation method thereof |
| KR102009727B1 (en) * | 2012-11-26 | 2019-10-22 | 삼성디스플레이 주식회사 | Display device, method of manufacturing display device and carrier glass |
| TWI654251B (en) * | 2014-03-12 | 2019-03-21 | 日商日鐵化學材料股份有限公司 | Display device and method for producing the same, and polyimide film for display device |
| JP2016038556A (en) * | 2014-08-11 | 2016-03-22 | 株式会社ジャパンディスプレイ | Manufacturing method of flexible display device |
| TW201618625A (en) * | 2014-11-14 | 2016-05-16 | Wisechip Semiconductor Inc | Manufacturing method of flexible substrate with electronic components |
| WO2016200122A1 (en) * | 2015-06-08 | 2016-12-15 | 주식회사 엘지화학 | Laminated body comprising metal wire layer, and manufacturing method therefor |
| CN105336873B (en) * | 2015-11-05 | 2018-12-07 | 广州竞择微电子技术有限公司 | A kind of base board for flexible optoelectronic part and preparation method thereof |
| CN111630584B (en) * | 2018-01-25 | 2022-09-27 | Ａｇｃ株式会社 | Transparent display device and laminated glass provided with same |
| CN109343307A (en) * | 2018-11-19 | 2019-02-15 | 中国科学技术大学 | Metal pattern transfer method and system based on nano-imprint lithography |
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2020
- 2020-12-18 WO PCT/JP2020/047563 patent/WO2021132106A1/en active Application Filing
- 2020-12-18 CN CN202080085332.8A patent/CN114762024A/en active Pending
- 2020-12-18 JP JP2021567414A patent/JPWO2021132106A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021132106A1 (en) | 2021-07-01 |
| CN114762024A (en) | 2022-07-15 |