JPWO2021112039A1 - - Google Patents

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Publication number
JPWO2021112039A1
JPWO2021112039A1 JP2021562634A JP2021562634A JPWO2021112039A1 JP WO2021112039 A1 JPWO2021112039 A1 JP WO2021112039A1 JP 2021562634 A JP2021562634 A JP 2021562634A JP 2021562634 A JP2021562634 A JP 2021562634A JP WO2021112039 A1 JPWO2021112039 A1 JP WO2021112039A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021562634A
Other languages
Japanese (ja)
Other versions
JPWO2021112039A5 (en
JP7291804B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021112039A1 publication Critical patent/JPWO2021112039A1/ja
Publication of JPWO2021112039A5 publication Critical patent/JPWO2021112039A5/ja
Application granted granted Critical
Publication of JP7291804B2 publication Critical patent/JP7291804B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/02Carriages for supporting the welding or cutting element
    • B23K37/0211Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B23K37/0235Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/18Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/406Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by monitoring or safety
    • G05B19/4069Simulating machining process on screen
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/18Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4097Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/18Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/41Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by interpolation, e.g. the computation of intermediate points between programmed end points to define the path to be followed and the rate of travel along that path
    • G05B19/4103Digital interpolation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/18Sheet panels
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/36Nc in input of data, input key till input tape
    • G05B2219/36199Laser cutting
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45041Laser cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computing Systems (AREA)
  • Theoretical Computer Science (AREA)
  • Laser Beam Processing (AREA)
JP2021562634A 2019-12-02 2020-11-30 Coordinate pattern file creation device, trajectory pattern creation device, and control method for laser processing machine Active JP7291804B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019217739 2019-12-02
JP2019217739 2019-12-02
PCT/JP2020/044510 WO2021112039A1 (en) 2019-12-02 2020-11-30 Coordinate pattern file creating device, trajectory pattern creating device, and method for controlling laser processing machine

Publications (3)

Publication Number Publication Date
JPWO2021112039A1 true JPWO2021112039A1 (en) 2021-06-10
JPWO2021112039A5 JPWO2021112039A5 (en) 2022-07-28
JP7291804B2 JP7291804B2 (en) 2023-06-15

Family

ID=76221633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021562634A Active JP7291804B2 (en) 2019-12-02 2020-11-30 Coordinate pattern file creation device, trajectory pattern creation device, and control method for laser processing machine

Country Status (5)

Country Link
US (1) US20220410313A1 (en)
EP (1) EP4070909B1 (en)
JP (1) JP7291804B2 (en)
CN (1) CN114746206B (en)
WO (1) WO2021112039A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7470764B1 (en) 2022-10-14 2024-04-18 株式会社アマダ Laser processing machine, laser processing method, processing program creation method, and processing program configuration method
CN116483025B (en) * 2023-04-23 2024-03-22 赛诺威盛科技(北京)股份有限公司 Data acquisition system and method in flying focus mode, electronic equipment and medium

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005279730A (en) * 2004-03-30 2005-10-13 Nippon Steel Corp Laser cutting method and device
JP2012218030A (en) * 2011-04-08 2012-11-12 Yaskawa Electric Corp Robot system
JP2019141868A (en) * 2018-02-19 2019-08-29 ファナック株式会社 Laser processing device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2787883B2 (en) * 1992-12-28 1998-08-20 三菱電機株式会社 Simulation equipment for three-dimensional laser processing machines
JPH09108863A (en) * 1995-10-16 1997-04-28 Fanuc Ltd Laser beam processing system
JP3287225B2 (en) * 1996-06-10 2002-06-04 松下電器産業株式会社 Interpolation device and interpolation method for numerical controller for laser beam machine
JPH1147966A (en) * 1997-08-04 1999-02-23 Amada Co Ltd Laser beam machining method and controller therefor
KR20120113245A (en) * 2009-12-30 2012-10-12 지에스아이 그룹 코포레이션 Link processing with high speed beam deflection
CN105834578B (en) * 2016-04-07 2017-12-01 武汉菲仕运动控制***有限公司 A kind of Biaxial synchronous laser cutting machine control system
DE102016111455B4 (en) * 2016-06-22 2019-07-25 Trumpf Laser- Und Systemtechnik Gmbh Method for determining a reference focus position and machine tool
JP6325646B1 (en) * 2016-12-12 2018-05-16 ファナック株式会社 Laser processing robot system for performing laser processing using robot and control method of laser processing robot
US11179803B2 (en) * 2017-08-25 2021-11-23 Canon Kabushiki Kaisha Laser processing apparatus, control apparatus, laser processing method, and method of producing image forming apparatus
JP6638011B2 (en) * 2018-03-12 2020-01-29 株式会社アマダホールディングス Laser processing machine and laser processing method
JP6943225B2 (en) 2018-06-22 2021-09-29 沖電気工業株式会社 Exposure head, image forming device, reading head and reading device
JP6592563B1 (en) 2018-07-06 2019-10-16 株式会社アマダホールディングス Laser processing machine and laser processing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005279730A (en) * 2004-03-30 2005-10-13 Nippon Steel Corp Laser cutting method and device
JP2012218030A (en) * 2011-04-08 2012-11-12 Yaskawa Electric Corp Robot system
JP2019141868A (en) * 2018-02-19 2019-08-29 ファナック株式会社 Laser processing device

Also Published As

Publication number Publication date
EP4070909A4 (en) 2023-01-18
EP4070909B1 (en) 2024-04-03
CN114746206A (en) 2022-07-12
US20220410313A1 (en) 2022-12-29
CN114746206B (en) 2024-03-19
WO2021112039A1 (en) 2021-06-10
EP4070909A1 (en) 2022-10-12
JP7291804B2 (en) 2023-06-15

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