JPWO2021038821A1 - - Google Patents
Info
- Publication number
- JPWO2021038821A1 JPWO2021038821A1 JP2021541916A JP2021541916A JPWO2021038821A1 JP WO2021038821 A1 JPWO2021038821 A1 JP WO2021038821A1 JP 2021541916 A JP2021541916 A JP 2021541916A JP 2021541916 A JP2021541916 A JP 2021541916A JP WO2021038821 A1 JPWO2021038821 A1 JP WO2021038821A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/035—Aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Robotics (AREA)
- Laser Beam Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023217886A JP2024026496A (ja) | 2019-08-30 | 2023-12-25 | 処理システム及びロボットシステム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/034089 WO2021038821A1 (ja) | 2019-08-30 | 2019-08-30 | 処理システム及びロボットシステム |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023217886A Division JP2024026496A (ja) | 2019-08-30 | 2023-12-25 | 処理システム及びロボットシステム |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021038821A1 true JPWO2021038821A1 (ja) | 2021-03-04 |
JPWO2021038821A5 JPWO2021038821A5 (ja) | 2022-08-02 |
JP7464055B2 JP7464055B2 (ja) | 2024-04-09 |
Family
ID=74683981
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021541916A Active JP7464055B2 (ja) | 2019-08-30 | 2019-08-30 | 処理システム及びロボットシステム |
JP2021542988A Pending JPWO2021039881A1 (ja) | 2019-08-30 | 2020-08-27 | |
JP2023217886A Pending JP2024026496A (ja) | 2019-08-30 | 2023-12-25 | 処理システム及びロボットシステム |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021542988A Pending JPWO2021039881A1 (ja) | 2019-08-30 | 2020-08-27 | |
JP2023217886A Pending JP2024026496A (ja) | 2019-08-30 | 2023-12-25 | 処理システム及びロボットシステム |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220331898A1 (ja) |
EP (1) | EP4023386A4 (ja) |
JP (3) | JP7464055B2 (ja) |
CN (1) | CN114222641A (ja) |
TW (1) | TW202109136A (ja) |
WO (2) | WO2021038821A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102254339B1 (ko) * | 2021-02-03 | 2021-05-21 | 주식회사 21세기 | 펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법 |
DE102022116927A1 (de) | 2022-07-07 | 2024-01-18 | Trumpf Laser Gmbh | Laserbearbeitungsmaschine mit frequenzkammbasiertem Abstandssensor sowie zugehöriges Verfahren mit frequenzkammbasierter Abstandsmessung |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005169397A (ja) * | 2003-12-05 | 2005-06-30 | Seiko Epson Corp | レーザ照射装置、液滴吐出装置、レーザ照射方法、液滴吐出方法及び位置制御装置 |
JP2007111763A (ja) * | 2005-10-21 | 2007-05-10 | Keyence Corp | 3次元加工データ設定装置、3次元加工データ設定方法、3次元加工データ設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工装置 |
JP2008212941A (ja) * | 2007-02-28 | 2008-09-18 | Sumitomo Heavy Ind Ltd | レーザ加工装置及びレーザ加工装置の制御方法 |
JP2016048188A (ja) * | 2014-08-27 | 2016-04-07 | 国立大学法人電気通信大学 | 距離測定装置 |
JP2018153842A (ja) * | 2017-03-17 | 2018-10-04 | トヨタ自動車株式会社 | 計測装置およびレーザ溶接装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2226970B (en) | 1989-01-11 | 1992-10-21 | British Aerospace | Methods of manufacture and surface treatment using laser radiation |
JPH03264177A (ja) * | 1990-03-12 | 1991-11-25 | Fuji Electric Co Ltd | レーザ刻印装置 |
DE10207535B4 (de) * | 2002-02-22 | 2006-07-06 | Carl Zeiss | Vorrichtung zum Bearbeiten und Vermessen eines Objekts sowie Verfahren hierzu |
JP4922584B2 (ja) * | 2004-12-10 | 2012-04-25 | 株式会社安川電機 | ロボットシステム |
JP2007290931A (ja) * | 2006-04-27 | 2007-11-08 | Seiko Epson Corp | スクライブ装置 |
JP2010082663A (ja) * | 2008-09-30 | 2010-04-15 | Sunx Ltd | レーザ加工機 |
US9494411B2 (en) | 2012-12-06 | 2016-11-15 | 3Dragons, Llc | Three-dimensional shape measuring device, method for acquiring hologram image, and method for measuring three-dimensional shape |
PL2972479T3 (pl) * | 2013-03-13 | 2021-04-19 | Ipg Photonics (Canada) Inc. | Sposoby i układy do charakteryzacji właściwości obróbki laserem poprzez pomiar dynamiki kapilary z zastosowaniem interferometrii |
JP6148075B2 (ja) * | 2013-05-31 | 2017-06-14 | 株式会社ディスコ | レーザー加工装置 |
DE102013015656B4 (de) * | 2013-09-23 | 2016-02-18 | Precitec Optronik Gmbh | Verfahren zum Messen der Eindringtiefe eines Laserstrahls in ein Werkstück, Verfahren zum Bearbeiten eines Werkstücks sowie Laserbearbeitungsvorrichtung |
WO2015163365A1 (ja) | 2014-04-23 | 2015-10-29 | 独立行政法人科学技術振興機構 | ブレード複合型開放流路装置およびその接合体 |
CN106471332B (zh) | 2014-06-27 | 2019-07-09 | 株式会社基恩士 | 多波长共焦测量装置 |
DE102016001661B3 (de) * | 2016-02-12 | 2017-04-13 | Lessmüller Lasertechnik GmbH | Messvorrichtung und Verfahren zum Ermitteln einer relativen Neigung eines Werkstücks mittels optischer Kohärenztomographie bei einer Bearbeitung |
-
2019
- 2019-08-30 JP JP2021541916A patent/JP7464055B2/ja active Active
- 2019-08-30 WO PCT/JP2019/034089 patent/WO2021038821A1/ja active Application Filing
-
2020
- 2020-08-27 US US17/638,028 patent/US20220331898A1/en active Pending
- 2020-08-27 WO PCT/JP2020/032294 patent/WO2021039881A1/ja unknown
- 2020-08-27 CN CN202080057800.0A patent/CN114222641A/zh active Pending
- 2020-08-27 JP JP2021542988A patent/JPWO2021039881A1/ja active Pending
- 2020-08-27 EP EP20859129.7A patent/EP4023386A4/en active Pending
- 2020-08-27 TW TW109129351A patent/TW202109136A/zh unknown
-
2023
- 2023-12-25 JP JP2023217886A patent/JP2024026496A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005169397A (ja) * | 2003-12-05 | 2005-06-30 | Seiko Epson Corp | レーザ照射装置、液滴吐出装置、レーザ照射方法、液滴吐出方法及び位置制御装置 |
JP2007111763A (ja) * | 2005-10-21 | 2007-05-10 | Keyence Corp | 3次元加工データ設定装置、3次元加工データ設定方法、3次元加工データ設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工装置 |
JP2008212941A (ja) * | 2007-02-28 | 2008-09-18 | Sumitomo Heavy Ind Ltd | レーザ加工装置及びレーザ加工装置の制御方法 |
JP2016048188A (ja) * | 2014-08-27 | 2016-04-07 | 国立大学法人電気通信大学 | 距離測定装置 |
JP2018153842A (ja) * | 2017-03-17 | 2018-10-04 | トヨタ自動車株式会社 | 計測装置およびレーザ溶接装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2021039881A1 (ja) | 2021-03-04 |
JP2024026496A (ja) | 2024-02-28 |
TW202109136A (zh) | 2021-03-01 |
CN114222641A (zh) | 2022-03-22 |
EP4023386A1 (en) | 2022-07-06 |
US20220331898A1 (en) | 2022-10-20 |
JPWO2021039881A1 (ja) | 2021-03-04 |
EP4023386A4 (en) | 2023-10-04 |
WO2021038821A1 (ja) | 2021-03-04 |
JP7464055B2 (ja) | 2024-04-09 |
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