JPWO2021033775A1 - - Google Patents
Info
- Publication number
- JPWO2021033775A1 JPWO2021033775A1 JP2021540993A JP2021540993A JPWO2021033775A1 JP WO2021033775 A1 JPWO2021033775 A1 JP WO2021033775A1 JP 2021540993 A JP2021540993 A JP 2021540993A JP 2021540993 A JP2021540993 A JP 2021540993A JP WO2021033775 A1 JPWO2021033775 A1 JP WO2021033775A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/40—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character is selected from a number of characters arranged one beside the other, e.g. on a common carrier plate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019152295 | 2019-08-22 | ||
JP2019152295 | 2019-08-22 | ||
PCT/JP2020/031717 WO2021033775A1 (ja) | 2019-08-22 | 2020-08-21 | 両面表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021033775A1 true JPWO2021033775A1 (ja) | 2021-02-25 |
JP7238142B2 JP7238142B2 (ja) | 2023-03-13 |
Family
ID=74661160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021540993A Active JP7238142B2 (ja) | 2019-08-22 | 2020-08-21 | 両面表示装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220293834A1 (ja) |
JP (1) | JP7238142B2 (ja) |
CN (1) | CN114270518A (ja) |
WO (1) | WO2021033775A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114203749B (zh) * | 2021-12-10 | 2023-08-01 | 深圳市华星光电半导体显示技术有限公司 | 双面显示面板和双面显示装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005227762A (ja) * | 2004-01-14 | 2005-08-25 | Semiconductor Energy Lab Co Ltd | 表示装置、電子機器 |
JP2011129392A (ja) * | 2009-12-18 | 2011-06-30 | Seiko Epson Corp | 表示装置 |
JP2013115088A (ja) * | 2011-11-25 | 2013-06-10 | Citizen Holdings Co Ltd | 半導体発光装置 |
US20140209931A1 (en) * | 2013-01-25 | 2014-07-31 | Hsu-Wen Liao | Led board structure and method of manufacturing same |
US20140209945A1 (en) * | 2013-01-29 | 2014-07-31 | Nthdegree Technologies Worldwide Inc. | Transparent led lamp for bidirectional lighting |
JP2014165490A (ja) * | 2013-02-27 | 2014-09-08 | Wistron Corp | 発光ダイオードバックライトモジュール |
JP2019009192A (ja) * | 2017-06-21 | 2019-01-17 | スタンレー電気株式会社 | 発光機能を備えた光透過プレート |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105144387B (zh) * | 2013-03-15 | 2018-03-13 | 苹果公司 | 具有冗余方案的发光二极管显示器和利用集成的缺陷检测测试来制造发光二极管显示器的方法 |
JP2017212384A (ja) * | 2016-05-27 | 2017-11-30 | ソニー株式会社 | 発光素子及び表示装置 |
JP2019134025A (ja) * | 2018-01-30 | 2019-08-08 | 大日本印刷株式会社 | 発光ダイオード表示装置および発光ダイオード表示装置用基板 |
-
2020
- 2020-08-21 WO PCT/JP2020/031717 patent/WO2021033775A1/ja active Application Filing
- 2020-08-21 JP JP2021540993A patent/JP7238142B2/ja active Active
- 2020-08-21 CN CN202080058693.3A patent/CN114270518A/zh active Pending
- 2020-08-21 US US17/636,192 patent/US20220293834A1/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005227762A (ja) * | 2004-01-14 | 2005-08-25 | Semiconductor Energy Lab Co Ltd | 表示装置、電子機器 |
JP2011129392A (ja) * | 2009-12-18 | 2011-06-30 | Seiko Epson Corp | 表示装置 |
JP2013115088A (ja) * | 2011-11-25 | 2013-06-10 | Citizen Holdings Co Ltd | 半導体発光装置 |
US20140209931A1 (en) * | 2013-01-25 | 2014-07-31 | Hsu-Wen Liao | Led board structure and method of manufacturing same |
US20140209945A1 (en) * | 2013-01-29 | 2014-07-31 | Nthdegree Technologies Worldwide Inc. | Transparent led lamp for bidirectional lighting |
JP2014165490A (ja) * | 2013-02-27 | 2014-09-08 | Wistron Corp | 発光ダイオードバックライトモジュール |
JP2019009192A (ja) * | 2017-06-21 | 2019-01-17 | スタンレー電気株式会社 | 発光機能を備えた光透過プレート |
Also Published As
Publication number | Publication date |
---|---|
WO2021033775A1 (ja) | 2021-02-25 |
CN114270518A (zh) | 2022-04-01 |
JP7238142B2 (ja) | 2023-03-13 |
US20220293834A1 (en) | 2022-09-15 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220218 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221122 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230120 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230131 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230301 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7238142 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |