JPWO2020250267A1 - - Google Patents
Info
- Publication number
- JPWO2020250267A1 JPWO2020250267A1 JP2021525408A JP2021525408A JPWO2020250267A1 JP WO2020250267 A1 JPWO2020250267 A1 JP WO2020250267A1 JP 2021525408 A JP2021525408 A JP 2021525408A JP 2021525408 A JP2021525408 A JP 2021525408A JP WO2020250267 A1 JPWO2020250267 A1 JP WO2020250267A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
- B65B57/10—Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B2220/00—Specific aspects of the packaging operation
- B65B2220/16—Packaging contents into primary and secondary packaging
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supplying Of Containers To The Packaging Station (AREA)
- Closing Of Containers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/022875 WO2020250267A1 (en) | 2019-06-10 | 2019-06-10 | Shipping inspection device, packaging device having shipping inspection device, and packaging system |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2020250267A1 true JPWO2020250267A1 (en) | 2020-12-17 |
JPWO2020250267A5 JPWO2020250267A5 (en) | 2022-02-14 |
JP7313728B2 JP7313728B2 (en) | 2023-07-25 |
Family
ID=73782135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021525408A Active JP7313728B2 (en) | 2019-06-10 | 2019-06-10 | Shipment inspection device, packaging device and packaging system having same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7313728B2 (en) |
KR (1) | KR20220018043A (en) |
CN (1) | CN114007942B (en) |
WO (1) | WO2020250267A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114379830B (en) * | 2022-03-23 | 2022-06-10 | 南京伟测半导体科技有限公司 | Wafer position detection device in wafer carrier |
EP4273910A1 (en) * | 2022-05-05 | 2023-11-08 | Siltronic AG | Device for packaging wafer cassettes |
CN114889866B (en) * | 2022-05-13 | 2024-04-26 | 漳州佳龙科技股份有限公司 | Bag pushing mechanism and working method thereof |
CN114889867A (en) * | 2022-05-13 | 2022-08-12 | 漳州佳龙科技股份有限公司 | Vacuum packaging secondary bagging machine and working method thereof |
JP2024033435A (en) * | 2022-08-30 | 2024-03-13 | オリオン機械工業株式会社 | Method of sealing gusset bag |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63253205A (en) * | 1987-04-09 | 1988-10-20 | Nichizou Tec:Kk | Abnormality detector for tube seal or the like |
JPH04142231A (en) * | 1990-09-21 | 1992-05-15 | Anritsu Corp | Packaging machine |
JP2005064515A (en) * | 2003-08-15 | 2005-03-10 | Asm Internatl Nv | Method and equipment for mapping of wafer arranged inside closed wafer cassette |
JP2015058958A (en) * | 2013-09-19 | 2015-03-30 | ミクロ技研株式会社 | Packaging device and packaging system |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102576687B (en) * | 2009-11-17 | 2015-11-25 | 昕芙旎雅有限公司 | Wafer detecting apparatus |
JP5407961B2 (en) | 2010-03-18 | 2014-02-05 | 信越半導体株式会社 | Container packaging equipment |
JP5639958B2 (en) * | 2011-05-27 | 2014-12-10 | 日東電工株式会社 | Semiconductor wafer mounting method and semiconductor wafer mounting apparatus |
JP2017037910A (en) * | 2015-08-07 | 2017-02-16 | 日東電工株式会社 | Semiconductor wafer transfer method and semiconductor wafer transfer device |
-
2019
- 2019-06-10 JP JP2021525408A patent/JP7313728B2/en active Active
- 2019-06-10 CN CN201980097122.8A patent/CN114007942B/en active Active
- 2019-06-10 KR KR1020227000712A patent/KR20220018043A/en not_active Application Discontinuation
- 2019-06-10 WO PCT/JP2019/022875 patent/WO2020250267A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63253205A (en) * | 1987-04-09 | 1988-10-20 | Nichizou Tec:Kk | Abnormality detector for tube seal or the like |
JPH04142231A (en) * | 1990-09-21 | 1992-05-15 | Anritsu Corp | Packaging machine |
JP2005064515A (en) * | 2003-08-15 | 2005-03-10 | Asm Internatl Nv | Method and equipment for mapping of wafer arranged inside closed wafer cassette |
JP2015058958A (en) * | 2013-09-19 | 2015-03-30 | ミクロ技研株式会社 | Packaging device and packaging system |
Also Published As
Publication number | Publication date |
---|---|
KR20220018043A (en) | 2022-02-14 |
CN114007942B (en) | 2024-07-05 |
JP7313728B2 (en) | 2023-07-25 |
CN114007942A (en) | 2022-02-01 |
WO2020250267A1 (en) | 2020-12-17 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211115 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211115 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221130 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20230125 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230328 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230607 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230612 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230629 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230705 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7313728 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |