JPWO2020250267A1 - - Google Patents

Info

Publication number: JPWO2020250267A1
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP2021525408A

Other languages

Japanese (ja)

Other versions

JPWO2020250267A5 (en

JP7313728B2 (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-06-10

Filing date

2019-06-10

Publication date

2020-12-17

2019-06-10 Application filed filed Critical

2020-12-17 Publication of JPWO2020250267A1 publication Critical patent/JPWO2020250267A1/ja

2022-02-14 Publication of JPWO2020250267A5 publication Critical patent/JPWO2020250267A5/ja

2023-07-25 Application granted granted Critical

2023-07-25 Publication of JP7313728B2 publication Critical patent/JP7313728B2/en

Status Active legal-status Critical Current

2039-06-10 Anticipated expiration legal-status Critical

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
- B65B57/10—Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B2220/00—Specific aspects of the packaging operation
- B65B2220/16—Packaging contents into primary and secondary packaging

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Supplying Of Containers To The Packaging Station (AREA)
Closing Of Containers (AREA)

JP2021525408A 2019-06-10 2019-06-10 Shipment inspection device, packaging device and packaging system having same Active JP7313728B2 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/JP2019/022875 WO2020250267A1 (en)	2019-06-10	2019-06-10	Shipping inspection device, packaging device having shipping inspection device, and packaging system

Publications (3)

Publication Number	Publication Date
JPWO2020250267A1 true JPWO2020250267A1 (en)	2020-12-17
JPWO2020250267A5 JPWO2020250267A5 (en)	2022-02-14
JP7313728B2 JP7313728B2 (en)	2023-07-25

Family

ID=73782135

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2021525408A Active JP7313728B2 (en)	2019-06-10	2019-06-10	Shipment inspection device, packaging device and packaging system having same

Country Status (4)

Country	Link
JP (1)	JP7313728B2 (en)
KR (1)	KR20220018043A (en)
CN (1)	CN114007942B (en)
WO (1)	WO2020250267A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN114379830B (en) *	2022-03-23	2022-06-10	南京伟测半导体科技有限公司	Wafer position detection device in wafer carrier
EP4273910A1 (en) *	2022-05-05	2023-11-08	Siltronic AG	Device for packaging wafer cassettes
CN114889866B (en) *	2022-05-13	2024-04-26	漳州佳龙科技股份有限公司	Bag pushing mechanism and working method thereof
CN114889867A (en) *	2022-05-13	2022-08-12	漳州佳龙科技股份有限公司	Vacuum packaging secondary bagging machine and working method thereof
JP2024033435A (en) *	2022-08-30	2024-03-13	オリオン機械工業株式会社	Method of sealing gusset bag

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63253205A (en) *	1987-04-09	1988-10-20	Nichizou Tec:Kk	Abnormality detector for tube seal or the like
JPH04142231A (en) *	1990-09-21	1992-05-15	Anritsu Corp	Packaging machine
JP2005064515A (en) *	2003-08-15	2005-03-10	Asm Internatl Nv	Method and equipment for mapping of wafer arranged inside closed wafer cassette
JP2015058958A (en) *	2013-09-19	2015-03-30	ミクロ技研株式会社	Packaging device and packaging system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102576687B (en) *	2009-11-17	2015-11-25	昕芙旎雅有限公司	Wafer detecting apparatus
JP5407961B2 (en)	2010-03-18	2014-02-05	信越半導体株式会社	Container packaging equipment
JP5639958B2 (en) *	2011-05-27	2014-12-10	日東電工株式会社	Semiconductor wafer mounting method and semiconductor wafer mounting apparatus
JP2017037910A (en) *	2015-08-07	2017-02-16	日東電工株式会社	Semiconductor wafer transfer method and semiconductor wafer transfer device

2019
- 2019-06-10 JP JP2021525408A patent/JP7313728B2/en active Active
- 2019-06-10 CN CN201980097122.8A patent/CN114007942B/en active Active
- 2019-06-10 KR KR1020227000712A patent/KR20220018043A/en not_active Application Discontinuation
- 2019-06-10 WO PCT/JP2019/022875 patent/WO2020250267A1/en active Application Filing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63253205A (en) *	1987-04-09	1988-10-20	Nichizou Tec:Kk	Abnormality detector for tube seal or the like
JPH04142231A (en) *	1990-09-21	1992-05-15	Anritsu Corp	Packaging machine
JP2005064515A (en) *	2003-08-15	2005-03-10	Asm Internatl Nv	Method and equipment for mapping of wafer arranged inside closed wafer cassette
JP2015058958A (en) *	2013-09-19	2015-03-30	ミクロ技研株式会社	Packaging device and packaging system

Also Published As

Publication number	Publication date
KR20220018043A (en)	2022-02-14
CN114007942B (en)	2024-07-05
JP7313728B2 (en)	2023-07-25
CN114007942A (en)	2022-02-01
WO2020250267A1 (en)	2020-12-17

Legal Events

Date	Code	Title	Description
2021-11-15	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211115
2021-11-15	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211115
2022-11-30	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221130
2023-01-25	A601	Written request for extension of time	Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20230125
2023-03-28	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230328
2023-06-07	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230607
2023-06-12	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230612
2023-06-23	TRDD	Decision of grant or rejection written
2023-06-29	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230629
2023-07-07	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230705
2023-07-14	R150	Certificate of patent or registration of utility model	Ref document number: 7313728 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150

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