JPWO2020184583A1 - - Google Patents

Info

Publication number
JPWO2020184583A1
JPWO2020184583A1 JP2021505092A JP2021505092A JPWO2020184583A1 JP WO2020184583 A1 JPWO2020184583 A1 JP WO2020184583A1 JP 2021505092 A JP2021505092 A JP 2021505092A JP 2021505092 A JP2021505092 A JP 2021505092A JP WO2020184583 A1 JPWO2020184583 A1 JP WO2020184583A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021505092A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020184583A1 publication Critical patent/JPWO2020184583A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
JP2021505092A 2019-03-13 2020-03-10 Pending JPWO2020184583A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019046430 2019-03-13
PCT/JP2020/010385 WO2020184583A1 (en) 2019-03-13 2020-03-10 Adhesive film for circuit connection, manufacturing method thereof, manufacturing method of circuit connection structure, and adhesive film accommodating set

Publications (1)

Publication Number Publication Date
JPWO2020184583A1 true JPWO2020184583A1 (en) 2020-09-17

Family

ID=72427519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021505092A Pending JPWO2020184583A1 (en) 2019-03-13 2020-03-10

Country Status (5)

Country Link
JP (1) JPWO2020184583A1 (en)
KR (1) KR20210141953A (en)
CN (1) CN113613892A (en)
TW (1) TW202045650A (en)
WO (1) WO2020184583A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230068406A (en) * 2020-09-15 2023-05-17 가부시끼가이샤 레조낙 Adhesive film for circuit connection, manufacturing method thereof, and manufacturing method of circuit connection structure
JPWO2022102573A1 (en) * 2020-11-10 2022-05-19
CN116685652A (en) * 2020-11-12 2023-09-01 株式会社力森诺科 Adhesive film for circuit connection, method for producing same, connection structure, and method for producing same
WO2023136221A1 (en) * 2022-01-12 2023-07-20 Tdk株式会社 Wiring body and display device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6762249B1 (en) * 1999-08-25 2004-07-13 Hitachi Chemical Company, Ltd. Wiring-connecting material and process for producing circuit board with the same
KR100709640B1 (en) 2003-12-04 2007-04-24 아사히 가세이 일렉트로닉스 가부시끼가이샤 Anisotropic conductive adhesive sheet and connecting structure
JP4880533B2 (en) * 2007-07-03 2012-02-22 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive film, method for producing the same, and joined body
JP5293779B2 (en) * 2010-07-20 2013-09-18 日立化成株式会社 Adhesive composition, circuit connection structure, semiconductor device and solar cell module
CN102449096A (en) * 2010-07-26 2012-05-09 日立化成工业株式会社 Adhesive composition, connection structure, connection structure manufacturing method and application of adhesive composition
CN202481798U (en) * 2010-12-27 2012-10-10 日立化成工业株式会社 Drying agent container and adhesive tape reel
KR20120080385A (en) * 2011-01-07 2012-07-17 삼성전자주식회사 Composition for patternable adhesive film, patternable adhesive film having the same and method for packaging semiconductor using the same
JP2014149918A (en) * 2011-06-06 2014-08-21 Hitachi Chemical Co Ltd Film-like circuit connection material and circuit connection structure
WO2013024544A1 (en) * 2011-08-18 2013-02-21 日立化成工業株式会社 Adhesive material reel
CN202481529U (en) * 2012-02-06 2012-10-10 苏州斯迪克新材料科技股份有限公司 Rubber belt packaging structure
US9585247B2 (en) * 2012-08-03 2017-02-28 Dexerials Corporation Anisotropic conductive film and method of producing the same
WO2017090659A1 (en) * 2015-11-25 2017-06-01 日立化成株式会社 Adhesive composition for circuit connection, and structure
JP2017135065A (en) * 2016-01-29 2017-08-03 デクセリアルズ株式会社 Anisotropic conductive film, connection method and conjugate
JP7172991B2 (en) * 2017-03-29 2022-11-16 昭和電工マテリアルズ株式会社 Adhesive composition and structure

Also Published As

Publication number Publication date
KR20210141953A (en) 2021-11-23
WO2020184583A1 (en) 2020-09-17
CN113613892A (en) 2021-11-05
TW202045650A (en) 2020-12-16

Similar Documents

Publication Publication Date Title
BR112019017762A2 (en)
BR112021017339A2 (en)
BR112021013854A2 (en)
BR112021018450A2 (en)
BR112021017939A2 (en)
BR112021017892A2 (en)
BR112019016141A2 (en)
AU2020104490A4 (en)
BR112021017738A2 (en)
BR112021017782A2 (en)
BR112019016142A2 (en)
BR112019016138A2 (en)
BR112021018168A2 (en)
JPWO2020184583A1 (en)
BR112021017728A2 (en)
BR112021008711A2 (en)
BR112021017355A2 (en)
BR112021017637A2 (en)
BR112021018452A2 (en)
BR112021012348A2 (en)
BR112021018250A2 (en)
BR112021018084A2 (en)
BR112021018093A2 (en)
BR112021017703A2 (en)
BR112021013944A2 (en)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230112

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240206

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20240408