JPWO2020144070A5 - - Google Patents

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JPWO2020144070A5
JPWO2020144070A5 JP2021539449A JP2021539449A JPWO2020144070A5 JP WO2020144070 A5 JPWO2020144070 A5 JP WO2020144070A5 JP 2021539449 A JP2021539449 A JP 2021539449A JP 2021539449 A JP2021539449 A JP 2021539449A JP WO2020144070 A5 JPWO2020144070 A5 JP WO2020144070A5
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Prior art keywords
flexible substrate
proximal portion
imaging device
distal portion
intraluminal imaging
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JP2021539449A
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JP7427006B2 (en
JP2022516360A (en
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Priority claimed from PCT/EP2019/086999 external-priority patent/WO2020144070A1/en
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Claims (18)

患者の体腔内に位置決めされる可撓性伸長部材であって、近位部分及び遠位部分を含む、可撓性伸長部材と、
前記可撓性伸長部材の前記遠位部分に配置された超音波イメージングアセンブリであって、
第１の表面から反対側の第２の表面まで可撓性基板を完全に通って延在する複数の凹部を含む近位部分、及び、
複数の音響素子を含む遠位部分を含む、可撓性基板、並びに、
支持部材の周りに前記可撓性基板の前記遠位部分が位置決めされる当該支持部材を含む、超音波イメージングアセンブリと、
前記可撓性伸長部材の長さに沿って延在する複数の導体であって、前記複数の音響素子と通信するように前記可撓性基板の前記近位部分に結合されている、複数の導体と、
を含む、管腔内イメージングデバイス。 a flexible elongate member positioned within a body cavity of a patient, the flexible elongate member including a proximal portion and a distal portion;
an ultrasound imaging assembly disposed on the distal portion of the flexible elongate member, comprising:
a proximal portion including a plurality of recesses extending completely through the flexible substrate from the first surface to the opposite second surface; and
a flexible substrate including a distal portion including a plurality of acoustic elements; and
an ultrasound imaging assembly including a support member about which the distal portion of the flexible substrate is positioned;
a plurality of conductors extending along the length of the flexible elongate member and coupled to the proximal portion of the flexible substrate in communication with the plurality of acoustic elements; a conductor of
An intraluminal imaging device, comprising: 前記可撓性基板の前記近位部分は第１の厚さを含み、前記第1の厚さは前記可撓性基板の前記遠位部分の第２の厚さよりも大きい、請求項１に記載の管腔内イメージングデバイス。 2. The method of claim 1, wherein said proximal portion of said flexible substrate includes a first thickness, said first thickness being greater than a second thickness of said distal portion of said flexible substrate. intraluminal imaging device. 前記可撓性基板の前記遠位部分は、第１の層を含み、前記可撓性基板の前記近位部分は、前記第１の層及び第２の層を含む、請求項２に記載の管腔内イメージングデバイス。 3. The method of claim 2, wherein the distal portion of the flexible substrate comprises a first layer and the proximal portion of the flexible substrate comprises the first layer and a second layer. Intraluminal imaging device. 前記第１の層は、前記第１の表面を含み、前記第２の層は、前記複数の凹部が前記第１の層及び前記第２の層を完全に通って延在するように、前記第２の表面を含む、請求項３に記載の管腔内イメージングデバイス。 The first layer includes the first surface and the second layer includes the surface such that the plurality of recesses extends completely through the first layer and the second layer. 4. The intraluminal imaging device of Claim 3, comprising a second surface. 前記第１の層及び前記第２の層は、同じ材料を含む、請求項３に記載の管腔内イメージングデバイス。 4. The intraluminal imaging device of Claim 3, wherein the first layer and the second layer comprise the same material. 前記可撓性基板の前記遠位部分は、
前記複数の音響素子と通信する複数の集積回路チップ、及び、
前記複数の集積回路チップと前記複数の音響素子との間の通信を提供する第１の複数の導電性トレースを含み、
前記可撓性基板の前記近位部分は、
前記複数の導体がそれぞれ結合される複数の導電性パッド、及び、
前記複数の導電性パッドと前記複数の集積回路チップとの間の通信を提供する第２の複数の導電性トレースを含む、請求項１に記載の管腔内イメージングデバイス。 the distal portion of the flexible substrate comprising:
a plurality of integrated circuit chips in communication with the plurality of acoustic elements; and
a first plurality of conductive traces providing communication between the plurality of integrated circuit chips and the plurality of acoustic elements;
the proximal portion of the flexible substrate comprising:
a plurality of conductive pads to which the plurality of conductors are respectively coupled; and
3. The intraluminal imaging device of claim 1, including a second plurality of conductive traces providing communication between the plurality of conductive pads and the plurality of integrated circuit chips. 前記複数の凹部は、前記可撓性基板の前記近位部分において、前記第２の複数の導電性トレース間で互いから離間されている、請求項６に記載の管腔内イメージングデバイス。 7. The intraluminal imaging device of Claim 6, wherein the plurality of recesses are spaced apart from each other between the second plurality of conductive traces in the proximal portion of the flexible substrate. 前記複数の凹部は、前記第２の複数の導電性トレースと同じ向きで配列されている、請求項６に記載の管腔内イメージングデバイス。 7. The intraluminal imaging device of Claim 6, wherein the plurality of recesses are arranged in the same orientation as the second plurality of conductive traces. 前記可撓性基板の前記近位部分は、１つ以上の電気的構成要素を含み、前記１つ以上の電気的構成要素の各々は、前記第２の複数の導電性トレースのそれぞれの導電性トレースの経路に沿って配置されている、請求項６に記載の管腔内イメージングデバイス。 The proximal portion of the flexible substrate includes one or more electrical components, each of the one or more electrical components being conductive for each of the second plurality of conductive traces. 7. The intraluminal imaging device of claim 6, disposed along the path of traces. 前記可撓性基板の前記近位部分は第１の幅を含み、前記第1の幅は前記可撓性基板の前記遠位部分の第２の幅未満である、請求項１に記載の管腔内イメージングデバイス。 2. The tube of claim 1, wherein said proximal portion of said flexible substrate includes a first width, said first width being less than a second width of said distal portion of said flexible substrate. Intraluminal imaging device. 前記可撓性基板の前記遠位部分は、前記支持部材の周りで円筒形構成を含み、前記可撓性基板の前記近位部分は、スパイラル構成を含む、請求項１に記載の管腔内イメージングデバイス。 3. The intraluminal of claim 1, wherein the distal portion of the flexible substrate includes a cylindrical configuration around the support member and the proximal portion of the flexible substrate includes a spiral configuration. imaging device. 前記可撓性伸長部材は、内側部材を含み、前記可撓性基板の前記近位部分は、前記内側部材の周りに前記スパイラル構成を含む、請求項１１に記載の管腔内イメージングデバイス。 12. The intraluminal imaging device of Claim 11, wherein the flexible elongate member includes an inner member and the proximal portion of the flexible substrate includes the spiral configuration around the inner member. 前記スパイラル構成は、熱又は圧縮のいずれか又は両方によって、前記可撓性基板の前記近位部分に仕立てられている、請求項１１に記載の管腔内イメージングデバイス。 12. The intraluminal imaging device of claim 11, wherein the spiral configuration is tailored to the proximal portion of the flexible substrate by either or both heat or compression. 前記可撓性基板の前記近位部分は、前記可撓性基板の前記遠位部分に対して斜角で延在している、請求項１に記載の管腔内イメージングデバイス。 2. The intraluminal imaging device of claim 1, wherein the proximal portion of the flexible substrate extends at an oblique angle to the distal portion of the flexible substrate. 管腔内イメージングデバイスを組み立てる方法であって、前記方法は、
平坦な構成にある可撓性基板を含む超音波イメージングアセンブリを提供するステップであって、前記可撓性基板は、
複数の音響素子を含む遠位部分、及び、
前記可撓性基板の第１の表面から前記可撓性基板の反対側の第２の表面まで前記可撓性基板を完全に通って延在する複数の凹部を含む近位部分を含む、提供するステップと、
前記可撓性基板を前記平坦な構成から丸められた構成に移行させるステップであって、前記複数の凹部は、前記近位部分が前記丸められた構成に移行するために前記近位部分の可撓性を増大させる、移行させるステップと、
前記超音波イメージングアセンブリを、患者の体腔内に挿入される可撓性伸長部材の遠位部分に結合するステップと、
前記複数の音響素子と前記可撓性伸長部材の長さに沿って延在する複数の電気導体との間の通信を確立するステップと、
を含み、
前記通信を確立するステップは、前記複数の電気導体を前記可撓性基板の前記近位部分に結合するステップを含む、方法。 A method of assembling an intraluminal imaging device, the method comprising:
providing an ultrasound imaging assembly including a flexible substrate in a flat configuration, the flexible substrate comprising:
a distal portion including a plurality of acoustic elements; and
a proximal portion including a plurality of recesses extending completely through the flexible substrate from a first surface of the flexible substrate to an opposite second surface of the flexible substrate; and
transitioning the flexible substrate from the flat configuration to a rolled configuration, wherein the plurality of recesses are formed in the proximal portion for transitioning the proximal portion to the rolled configuration; increasing flexibility, transitioning;
coupling the ultrasound imaging assembly to a distal portion of a flexible elongated member for insertion into a body cavity of a patient;
establishing communication between the plurality of acoustic elements and a plurality of electrical conductors extending along the length of the flexible elongate member;
including
The method wherein establishing communication includes coupling the plurality of electrical conductors to the proximal portion of the flexible substrate. 前記移行させるステップは、
前記可撓性基板の前記遠位部分を円筒形構成に丸めるステップと、
前記可撓性基板の前記近位部分をスパイラル構成に丸めるステップと、
を含む、請求項１５に記載の方法。 The transitioning step includes:
rolling the distal portion of the flexible substrate into a cylindrical configuration;
rolling the proximal portion of the flexible substrate into a spiral configuration;
16. The method of claim 15, comprising: 前記移行させるステップは、
前記スパイラル構成を保持するために前記可撓性基板の前記近位部分を仕立てるステップを含む、請求項１６に記載の方法。 The transitioning step includes:
17. The method of claim 16, comprising tailoring the proximal portion of the flexible substrate to retain the spiral configuration. 前記仕立てるステップは、
前記可撓性基板の前記近位部分を熱収縮モールドに挿入するステップと、
前記熱収縮モールドが前記可撓性基板の前記近位部分を前記スパイラル構成に圧縮するように熱を加えるステップと、
を含む、請求項１７に記載の方法。 The tailoring step includes:
inserting the proximal portion of the flexible substrate into a heat shrink mold;
applying heat such that the heat shrink mold compresses the proximal portion of the flexible substrate into the spiral configuration;
18. The method of claim 17, comprising:
JP2021539449A 2019-01-07 2019-12-24 Substrate with increased flexibility for intraluminal ultrasound imaging assemblies Active JP7427006B2 (en)

Applications Claiming Priority (3)

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US201962789099P 2019-01-07 2019-01-07
US62/789,099 2019-01-07
PCT/EP2019/086999 WO2020144070A1 (en) 2019-01-07 2019-12-24 Increased flexibility substrate for intraluminal ultrasound imaging assembly

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JP2022516360A JP2022516360A (en) 2022-02-25
JPWO2020144070A5 true JPWO2020144070A5 (en) 2023-01-05
JP7427006B2 JP7427006B2 (en) 2024-02-02

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