JPWO2020122261A1 - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
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- JPWO2020122261A1 JPWO2020122261A1 JP2020552055A JP2020552055A JPWO2020122261A1 JP WO2020122261 A1 JPWO2020122261 A1 JP WO2020122261A1 JP 2020552055 A JP2020552055 A JP 2020552055A JP 2020552055 A JP2020552055 A JP 2020552055A JP WO2020122261 A1 JPWO2020122261 A1 JP WO2020122261A1
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- 239000000758 substrate Substances 0.000 claims abstract description 109
- 230000002093 peripheral effect Effects 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims description 8
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 6
- 229920005668 polycarbonate resin Polymers 0.000 claims description 5
- 239000004431 polycarbonate resin Substances 0.000 claims description 5
- 239000002952 polymeric resin Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 238000001816 cooling Methods 0.000 description 6
- 239000000498 cooling water Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K39/00—Medicinal preparations containing antigens or antibodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Medicinal Chemistry (AREA)
- Animal Behavior & Ethology (AREA)
- Chemical & Material Sciences (AREA)
- Microbiology (AREA)
- Mycology (AREA)
- Pharmacology & Pharmacy (AREA)
- Epidemiology (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
Description
また、金型の構造が複雑になる為、溶融樹脂の熱量を吸収する為に金型内に冷却水を循環させる金型の冷却回路を、最適な位置に最適な回路として形成することが難くなり、冷却時間が延びるという問題が生ずる。
図1は、基板収納容器1に基板Wが収納された様子を示す分解斜視図である。図2Aは、基板収納容器1を示す右側面図である。図2Bは、基板収納容器1を示す底面図である。図3は、基板収納容器1の容器本体2を示す正面図である。
図4は、基板収納容器1の容器本体2に設けられた中央被固定部材6の前部を示す分解斜視図である。図5は、基板収納容器1の容器本体2に設けられた中央被固定部材6の後部を示す分解斜視図である。図6Aは、基板収納容器1の容器本体2に設けられた中央被固定部材6の後部を示す斜視図である。図6Bは、基板収納容器1の容器本体2に設けられた中央被固定部材6の前部を示す斜視図である。
また、金型の構造が複雑になることを回避することが可能となり、溶融樹脂の熱量を吸収する為に金型内に冷却水を循環させる金型の冷却回路を、最適な位置に最適な回路として形成することが可能となる。この結果、冷却時間が延びることを回避することが可能となる。
例えば、容器本体及び蓋体の形状、容器本体に収納可能な基板Wの枚数や寸法は、本実施形態における容器本体2及び蓋体3の形状、容器本体2に収納可能な基板Wの枚や寸法に限定されない。例えば、中央被固定部材等の形状等の構成は、本実施形態における中央被固定部材6の形状等の構成に限定されない。
2 容器本体
3 蓋体
6 中央被固定部材
20 壁部
21 容器本体開口部
22 奥壁
23 上壁
24 下壁(底部)
25 第1側壁
26 第2側壁
27 基板収納空間
61 部材前部
62 部材後部
W 基板
Claims (6)
- 一端部に容器本体開口部が形成された開口周縁部を有し、他端部が閉塞された筒状の壁部を備え、前記壁部の内面によって、基板を収納可能であり前記容器本体開口部に連通する基板収納空間が形成された容器本体と、
前記開口周縁部に対して着脱可能であり、前記開口周縁部によって取り囲まれる位置関係で前記容器本体開口部を閉塞可能な蓋体と、
前記蓋体に取り付けられ、前記蓋体及び前記開口周縁部に当接可能であり、前記開口周縁部と前記蓋体との間に介在して前記開口周縁部及び前記蓋体に密着して当接することにより、前記蓋体と共に前記容器本体開口部を閉塞するシール部材と、を備え、
前記容器本体の壁部には、前記基板収納空間に収納された基板を処理装置に搬送するためのロードポートに設けられた位置合わせ部に係止されて固定される中央被固定部材が前記容器本体の壁部に対して着脱可能に設けられている基板収納容器。 - 前記中央被固定部材は、前記容器本体の壁部に対して嵌め込み構造により固定される請求項1に記載の基板収納容器。
- 前記中央被固定部材は、
前記容器本体の一端部側の前記中央被固定部材の部分を構成する長円形状の部材前部と、
前記容器本体の他端部側の前記中央被固定部材の部分を構成する長方形状の部材後部と、を有する請求項2に記載の基板収納容器。 - 前記部材前部は1箇所で前記容器本体に係合して固定され、前記部材後部は2箇所で前記容器本体に係合して固定されて、前記中央被固定部材は、前記容器本体の壁部に対して嵌め込まれている請求項3に記載の基板収納容器。
- 前記中央被固定部材は、ポリカーボネート樹脂を材料として構成されている請求項1〜請求項4のいずれかに記載の基板収納容器。
- 前記中央被固定部材は、シクロオレフィンポリマー樹脂を材料として構成されている請求項1〜請求項4のいずれかに記載の基板収納容器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/014929 WO2020122261A2 (ja) | 2020-03-31 | 2020-03-31 | 基板収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6805400B2 JP6805400B2 (ja) | 2020-12-23 |
JPWO2020122261A1 true JPWO2020122261A1 (ja) | 2021-02-15 |
Family
ID=71076861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020552055A Active JP6805400B2 (ja) | 2020-03-31 | 2020-03-31 | 基板収納容器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230141959A1 (ja) |
JP (1) | JP6805400B2 (ja) |
KR (1) | KR102418353B1 (ja) |
CN (1) | CN115428138A (ja) |
TW (1) | TWI796660B (ja) |
WO (1) | WO2020122261A2 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004214269A (ja) * | 2002-12-27 | 2004-07-29 | Miraial Kk | 薄板支持容器 |
JP2008010574A (ja) * | 2006-06-28 | 2008-01-17 | Vantec Co Ltd | ウエハ容器の位置決め構造 |
WO2014196011A1 (ja) * | 2013-06-03 | 2014-12-11 | ミライアル株式会社 | 基板収納容器 |
JP2017092172A (ja) * | 2015-11-06 | 2017-05-25 | 信越ポリマー株式会社 | 基板収納容器 |
WO2019031142A1 (ja) * | 2017-08-10 | 2019-02-14 | 信越ポリマー株式会社 | 基板収納容器及びその製造方法 |
Family Cites Families (17)
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US6216874B1 (en) * | 1998-07-10 | 2001-04-17 | Fluoroware, Inc. | Wafer carrier having a low tolerance build-up |
JP3916342B2 (ja) * | 1999-04-20 | 2007-05-16 | 信越ポリマー株式会社 | 基板収納容器 |
US20030188990A1 (en) * | 2001-11-14 | 2003-10-09 | Bhatt Sanjiv M. | Composite kinematic coupling |
US6851170B2 (en) * | 2001-12-14 | 2005-02-08 | Applied Materials, Inc. | Method and apparatus for alignment of carriers, carrier handlers and semiconductor handling equipment |
KR101029434B1 (ko) * | 2003-03-04 | 2011-04-14 | 신에츠 폴리머 가부시키가이샤 | 정밀 기판 수납 용기 |
US7669717B2 (en) * | 2004-05-17 | 2010-03-02 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container and positioning method of the same |
JP4373316B2 (ja) * | 2004-10-14 | 2009-11-25 | ミライアル株式会社 | 薄板支持容器用クランプ装置 |
KR101212482B1 (ko) * | 2005-05-06 | 2012-12-17 | 신에츠 폴리머 가부시키가이샤 | 기판 수납용기 및 그 제조 방법 |
KR20070034654A (ko) | 2005-09-26 | 2007-03-29 | (주)에프알텍 | 양방향 단일 광섬유 전송을 위한 필터 조대(粗大) 파장분할 다중화용 광송수신모듈 및 광신호 전송 방법 |
US7422107B2 (en) * | 2006-01-25 | 2008-09-09 | Entegris, Inc. | Kinematic coupling with textured contact surfaces |
KR20070088064A (ko) | 2006-02-24 | 2007-08-29 | (주) 에이치에스정보기술 | 웹 기반의 기업 정보관리 방법 |
US8827695B2 (en) | 2008-06-23 | 2014-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer's ambiance control |
JP5318800B2 (ja) * | 2010-03-04 | 2013-10-16 | 信越ポリマー株式会社 | 基板収納容器 |
WO2015025410A1 (ja) * | 2013-08-22 | 2015-02-26 | ミライアル株式会社 | 基板収納容器 |
US11309200B2 (en) * | 2017-02-27 | 2022-04-19 | Miraial Co., Ltd. | Substrate storage container |
KR102477834B1 (ko) * | 2017-11-15 | 2022-12-16 | 신에츠 폴리머 가부시키가이샤 | 기판 수납 용기 |
WO2022009430A1 (ja) * | 2020-07-10 | 2022-01-13 | ミライアル株式会社 | 基板収納容器 |
-
2020
- 2020-03-31 KR KR1020217001763A patent/KR102418353B1/ko active IP Right Grant
- 2020-03-31 WO PCT/JP2020/014929 patent/WO2020122261A2/ja active Application Filing
- 2020-03-31 JP JP2020552055A patent/JP6805400B2/ja active Active
- 2020-03-31 US US17/915,904 patent/US20230141959A1/en active Pending
- 2020-03-31 CN CN202080099201.5A patent/CN115428138A/zh active Pending
-
2021
- 2021-03-26 TW TW110111104A patent/TWI796660B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004214269A (ja) * | 2002-12-27 | 2004-07-29 | Miraial Kk | 薄板支持容器 |
JP2008010574A (ja) * | 2006-06-28 | 2008-01-17 | Vantec Co Ltd | ウエハ容器の位置決め構造 |
WO2014196011A1 (ja) * | 2013-06-03 | 2014-12-11 | ミライアル株式会社 | 基板収納容器 |
JP2017092172A (ja) * | 2015-11-06 | 2017-05-25 | 信越ポリマー株式会社 | 基板収納容器 |
WO2019031142A1 (ja) * | 2017-08-10 | 2019-02-14 | 信越ポリマー株式会社 | 基板収納容器及びその製造方法 |
Also Published As
Publication number | Publication date |
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JP6805400B2 (ja) | 2020-12-23 |
TWI796660B (zh) | 2023-03-21 |
KR102418353B1 (ko) | 2022-07-06 |
TW202140359A (zh) | 2021-11-01 |
WO2020122261A2 (ja) | 2020-06-18 |
WO2020122261A3 (ja) | 2020-08-13 |
CN115428138A (zh) | 2022-12-02 |
US20230141959A1 (en) | 2023-05-11 |
KR20210122767A (ko) | 2021-10-12 |
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