JPWO2019236236A5 - - Google Patents
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- JPWO2019236236A5 JPWO2019236236A5 JP2020567983A JP2020567983A JPWO2019236236A5 JP WO2019236236 A5 JPWO2019236236 A5 JP WO2019236236A5 JP 2020567983 A JP2020567983 A JP 2020567983A JP 2020567983 A JP2020567983 A JP 2020567983A JP WO2019236236 A5 JPWO2019236236 A5 JP WO2019236236A5
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Claims (17)
２つ以上の印刷ステーションを備え、
前記２つ以上の印刷ステーションの各々は、基板、１つ以上のキャリア装置、分配装置、圧縮装置、印刷装置、固定装置、流動化材料除去装置、組立装置、および１つ以上の移送装置の動作を制御するように構成された計算および制御装置を含み、
前記流動化材料除去装置は、前記固定装置に固定されずに、基板上に堆積して圧縮された流動化材料を除去するように構成され、
１つ以上の前記移送装置は、１つ以上の前記キャリア装置を介して２つ以上の印刷ステーションと連通し、
前記組立装置は、１つ以上の前記移送装置を介して２つ以上の印刷ステーションと連通し、
前記計算および制御装置は、２つ以上の印刷ステーション、組立装置、および１つ以上の移送装置の動作を制御するように構成され、
前記基板は、１以上のキャリア装置上に配置され、
前記キャリア装置は、前記基板を第１の位置から第２の位置へ移送し、
少なくとも１以上の移送装置は、取付装置を含むピックアップアセンブリを備え、
前記取付装置は、印刷層を前記基板上の前記第２の位置から持ち上げて、前記印刷層を前記組立装置へ移動させる、多材料三次元印刷装置。 It is a multi-material 3D printing device.
Equipped with two or more printing stations
Each of the two or more printing stations is a substrate, one or more carrier equipment, a distribution device, a compression device, a printing device, a fixing device , a fluidized material removing device , an assembly device, and one or more transfer devices. Includes computational and control devices configured to control operation
The fluidized material removing device is configured to remove the fluidized material deposited and compressed on the substrate without being fixed to the fixing device.
The one or more transfer devices communicate with the two or more printing stations via the one or more carrier devices.
The assembly device communicates with two or more printing stations via one or more of the transfer devices .
The calculator and control device is configured to control the operation of two or more printing stations, an assembly device, and one or more transfer devices.
The substrate is placed on one or more carrier devices and
The carrier device transfers the substrate from the first position to the second position.
At least one transfer device comprises a pickup assembly that includes a mounting device.
The mounting device is a multi-material three-dimensional printing device that lifts a print layer from the second position on the substrate and moves the print layer to the assembly device.
２つ以上の印刷ステーションを備え、
前記２つ以上の印刷ステーションの各々は、連続基板、１つ以上のキャリア装置、分配装置、圧縮装置、印刷装置、固定装置、流動化材料除去装置、組立装置、および１つ以上の移送装置の動作を制御するように構成された計算および制御装置を含み、
前記流動化材料除去装置は、前記固定装置に固定されずに、基板上に堆積して圧縮された流動化材料を除去するように構成され、
１つ以上の前記移送装置は、１つ以上の前記キャリア装置を介して２つ以上の印刷ステーションと連通し、
前記組立装置は、１つ以上の前記移送装置を介して２つ以上の印刷ステーションと連通し、
前記計算および制御装置は、２つ以上の印刷ステーション、組立装置、および１つ以上の移送装置の動作を制御するように構成され、
前記連続基板は、１以上のキャリア装置上に配置され、
前記キャリア装置は、前記連続基板を第１の位置から第２の位置へ移送し、
少なくとも１以上の移送装置は、可動取付装置を含むピックアップアセンブリを備え、
前記可動取付装置は、印刷層を前記連続基板上の前記第２の位置から取り除くように形成される、多材料三次元印刷装置。 It is a multi-material 3D printing device.
Equipped with two or more printing stations
Each of the two or more printing stations is a continuous substrate, one or more carrier equipment, a distribution device, a compression device, a printing device, a fixing device , a fluidized material removing device , an assembly device, and one or more transfer devices. Includes calculators and controls configured to control the operation of
The fluidized material removing device is configured to remove the fluidized material deposited and compressed on the substrate without being fixed to the fixing device.
The one or more transfer devices communicate with the two or more printing stations via the one or more carrier devices.
The assembly device communicates with two or more printing stations via one or more of the transfer devices.
The calculator and control device is configured to control the operation of two or more printing stations, an assembly device, and one or more transfer devices.
The continuous substrate is placed on one or more carrier devices and
The carrier device transfers the continuous substrate from the first position to the second position.
At least one transfer device comprises a pickup assembly that includes a movable mounting device.
The movable mounting device is a multi-material three-dimensional printing device formed so as to remove a printing layer from the second position on the continuous substrate .
多材料対象物体のデザインを少なくとも２つの印刷厚さ層に分割するステップと、
前記少なくとも２つの印刷厚さ層の各々を少なくとも１つの単一材料パターンに分離するステップと、
前記少なくとも１つの単一材料パターンを多材料三次元印刷装置内の印刷ステーションに送るステップと、
基板上の少なくとも１つの単一材料パターンの材料を分散するステップと、
分散された材料を圧縮装置に移動させるために基板を割り出し、前記圧縮装置で材料を圧縮するステップと、
圧縮された材料を印刷装置に移動させるために基板を割り出し、前記印刷装置でバインダを圧縮された材料上に所定のパターンで分散するステップと、
パターン化された材料を固定装置に移動させるために基板を割り出し、前記固定装置で前記バインダのパターンを固定放射線で固定させるステップと、
固定されたパターンを流動化材料除去装置に移動させるために基板を割り出し、前記流動化材料除去装置でバインダによって定位置に固定されていない圧縮材料を除去するステップと、
パターン化されて固定された材料を移送ステーションに移動させるために基板を割り出し、前記移送ステーションで印刷層をビルド基板または既に位置決めされている層の積層体の上面に移送するステップと、を備える多材料三次元印刷装置を用いて２つ以上の材料の構造を作製する方法。 A method of producing the structure of two or more materials using a multi-material 3D printing device.
Steps to divide the design of a multi-material object into at least two print thickness layers,
A step of separating each of the at least two print thickness layers into at least one single material pattern.
The step of sending at least one single material pattern to a printing station in a multi-material 3D printing device,
With the step of dispersing the material of at least one single material pattern on the substrate,
A step of indexing a substrate to move the dispersed material to a compression device and compressing the material with the compression device.
A step of indexing a substrate to move the compressed material to a printing device and dispersing the binder on the compressed material in a predetermined pattern in the printing device.
A step of indexing the substrate to move the patterned material to the fixing device and fixing the pattern of the binder with the fixing device with fixed radiation.
A step of indexing the substrate to move the fixed pattern to the fluidizing material removing device and removing the compressed material that is not fixed in place by the binder in the fluidizing material removing device.
Many include the steps of indexing the substrate to transfer the patterned and fixed material to the transfer station and transferring the printed layer to the top surface of the build substrate or laminate of layers already positioned at the transfer station. Material A method of producing the structure of two or more materials using a three-dimensional printing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023125260A JP2023145643A (en) | 2018-06-07 | 2023-08-01 | Method for manufacturing structure made of two or more materials |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862682067P | 2018-06-07 | 2018-06-07 | |
| US62/682,067 | 2018-06-07 | ||
| US16/167,088 US11273608B2 (en) | 2018-06-07 | 2018-10-22 | Multi-material three-dimensional printer |
| US16/167,088 | 2018-10-22 | ||
| PCT/US2019/031171 WO2019236236A1 (en) | 2018-06-07 | 2019-05-07 | Multi-material three-dimensional printer |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023125260A Division JP2023145643A (en) | 2018-06-07 | 2023-08-01 | Method for manufacturing structure made of two or more materials |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021526985A JP2021526985A (en) | 2021-10-11 |
| JPWO2019236236A5 true JPWO2019236236A5 (en) | 2022-04-20 |
| JP7329859B2 JP7329859B2 (en) | 2023-08-21 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020567983A Active JP7329859B2 (en) | 2018-06-07 | 2019-05-07 | Multi-material three-dimensional printing device and method for making structures of two or more materials |
| JP2023125260A Pending JP2023145643A (en) | 2018-06-07 | 2023-08-01 | Method for manufacturing structure made of two or more materials |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023125260A Pending JP2023145643A (en) | 2018-06-07 | 2023-08-01 | Method for manufacturing structure made of two or more materials |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11273608B2 (en) |
| EP (1) | EP3802131A4 (en) |
| JP (2) | JP7329859B2 (en) |
| KR (1) | KR20210041542A (en) |
| CN (1) | CN112262044A (en) |
| WO (1) | WO2019236236A1 (en) |
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-
2018
- 2018-10-22 US US16/167,088 patent/US11273608B2/en active Active
-
2019
- 2019-05-07 EP EP19814917.1A patent/EP3802131A4/en active Pending
- 2019-05-07 CN CN201980038425.2A patent/CN112262044A/en active Pending
- 2019-05-07 JP JP2020567983A patent/JP7329859B2/en active Active
- 2019-05-07 KR KR1020207038127A patent/KR20210041542A/en active IP Right Grant
- 2019-05-07 WO PCT/US2019/031171 patent/WO2019236236A1/en unknown
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2022
- 2022-02-03 US US17/592,297 patent/US11504913B2/en active Active
- 2022-10-20 US US17/970,347 patent/US11806937B2/en active Active
-
2023
- 2023-08-01 JP JP2023125260A patent/JP2023145643A/en active Pending
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