JPWO2018117232A1 - 電子素子搭載用基板、電子装置および電子モジュール - Google Patents
電子素子搭載用基板、電子装置および電子モジュール Download PDFInfo
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- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
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- GZWXHPJXQLOTPB-UHFFFAOYSA-N [Si].[Ni].[Cr] Chemical compound [Si].[Ni].[Cr] GZWXHPJXQLOTPB-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
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- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
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- 238000005530 etching Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 229910052863 mullite Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
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- WNUPENMBHHEARK-UHFFFAOYSA-N silicon tungsten Chemical compound [Si].[W] WNUPENMBHHEARK-UHFFFAOYSA-N 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
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- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
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- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
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Abstract
Description
第1の実施形態における電子素子搭載用基板1は、図1〜図4に示された例のように、第1基板11と第2基板12とを含んでいる。電子装置は、電子素子等用基板1と、電子素子搭載用基板の搭載部11aに搭載された電子素子2と、電子素子搭載用基板1が搭載された配線基板とを含んでいる。電子装置は、例えば電子モジュールを構成するモジュール用基板上の接続パッドに接合材を用いて接続される。
次に、第2の実施形態による電子素子搭載用基板について、図6〜図9を参照しつつ説明する。
次に、第3の実施形態による電子装置について、図10〜図13を参照しつつ説明する。
第2基板122(中間) :熱伝導率λy2≒熱伝導率λz2>>熱伝導率λx2
第2基板123(下面側) :熱伝導率λx3≒熱伝導率λz3>>熱伝導率λy3
第2基板121と第2基板123の熱伝導率λは、平面方向におけるX方向と厚み方向におけるZ方向とで同等であり、平面方向におけるY方向が異なっている。第2基板122の熱伝導率λは、平面方向におけるY方向と厚み方向におけるZ方向とで同等であり、平面方向におけるX方向が異なっている。例えば、第2基板121の熱伝導率λx1および熱伝導率λz1は、1000W/m・K程度であり、第2基板12の熱伝導率λy1は、4W/m・K程度である。第2基板122の熱伝導率λy2および熱伝導率λz2は、1000W/m・K程度であり、第2基板12の熱伝導率λx2は、4W/m・K程度である。第2基板123の熱伝導率λx3および熱伝導率λz3は、1000W/m・K程度であり、第2基板123の熱伝導率λy3は、4W/m・K程度である。
Claims (5)
- 第1主面を有し、該第1主面に位置し、長手方向の一端部が前記第1主面の外縁部に位置した矩形状である電子素子の搭載部を有する第1基板と、
前記第1主面と相対する第2主面に位置し、炭素材料からなり、該第2主面と対向する第3主面および該第3主面と相対する第4主面を有する第2基板とを有しており、
平面透視において、前記第3主面または前記第4主面は、前記搭載部の長手方向の熱伝導より前記搭載部の長手方向に垂直に交わる方向の熱伝導が大きいことを特徴とする電子素子搭載用基板。 - 平面透視において、前記第2基板は、前記一端部が位置した側に第1側面を有しており、
該第1側面は、前記第2基板の厚み方向に垂直に交わる方向より前記第2基板の厚み方向の熱伝導が大きいことを特徴とする請求項1に記載の電子素子搭載用基板。 - 前記第2基板は、前記第1側面と相対する第2側面を有しており、
該第2側面は、前記第2基板の厚み方向に垂直に交わる方向より前記第2基板の厚み方向の熱伝導が大きいことを特徴とする請求項2に記載の電子素子搭載用基板。 - 請求項1乃至請求項3のいずれかに記載の電子素子搭載用基板と、
該電子素子搭載用基板の前記搭載部に搭載された電子素子と、
前記電子素子搭載用基板が搭載された配線基板または電子素子収納用パッケージとを有していることを特徴とする電子装置。 - 請求項4に記載の電子装置と、
該電子装置が接続されたモジュール用基板とを有することを特徴とする電子モジュール。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016249415 | 2016-12-22 | ||
JP2016249415 | 2016-12-22 | ||
JP2017226902 | 2017-11-27 | ||
JP2017226902 | 2017-11-27 | ||
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CN110062955B (zh) | 2023-05-23 |
EP3561865A1 (en) | 2019-10-30 |
US11114365B2 (en) | 2021-09-07 |
EP3561865A4 (en) | 2020-08-19 |
CN110062955A (zh) | 2019-07-26 |
CN116544773A (zh) | 2023-08-04 |
JP6983178B2 (ja) | 2021-12-17 |
WO2018117232A1 (ja) | 2018-06-28 |
US20190311971A1 (en) | 2019-10-10 |
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