JPWO2010007715A1 - 部品内蔵モジュールの製造方法 - Google Patents
部品内蔵モジュールの製造方法 Download PDFInfo
- Publication number
- JPWO2010007715A1 JPWO2010007715A1 JP2010520736A JP2010520736A JPWO2010007715A1 JP WO2010007715 A1 JPWO2010007715 A1 JP WO2010007715A1 JP 2010520736 A JP2010520736 A JP 2010520736A JP 2010520736 A JP2010520736 A JP 2010520736A JP WO2010007715 A1 JPWO2010007715 A1 JP WO2010007715A1
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- circuit component
- component
- main surface
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
4 本体
6a,6b 端子電極
10 樹脂シート
11 樹脂基板
12 樹脂層(第1の樹脂層)
14 金属箔
14a,14b,14s,14t 配線パターン
14p,14q 薄膜
20 樹脂シート
22 樹脂層(第2の樹脂層)
24 金属箔
30,32 仮固定部材
50 部品内蔵モジュール
Claims (10)
- 熱可塑性樹脂を含み、その一方主面に配線パターンを有する第1の樹脂層と、
熱可塑性樹脂を含む第2の樹脂層と、
端子電極を有する回路部品と、
を準備する第1の工程と、
前記第1の樹脂層の前記一方主面と前記第2の樹脂層との間に前記回路部品を配置した状態で、前記第1の樹脂層と前記第2の樹脂層とを積層し、加熱・圧着する第2の工程とを備え、
前記第2の工程において、前記第1の樹脂層と前記第2の樹脂層とを圧着させると同時に、前記第1の樹脂層の前記一方主面の前記配線パターンと前記回路部品の前記端子電極とを固相拡散接合させ、前記第1の樹脂層の前記一方主面の前記配線パターンと前記回路部品の前記端子電極とを互いに固着させることを特徴とする、部品内蔵モジュールの製造方法。 - 前記第2の工程において、前記第1の樹脂層の前記一方主面の前記配線パターンに対する前記回路部品の位置を固定した状態で、前記第1の樹脂層と前記第2の樹脂層とを積層することを特徴とする、請求項1に記載の部品内蔵モジュールの製造方法。
- 前記第2の工程において、仮固定部材を用いて前記第1の樹脂層の前記一方主面の前記配線パターンに対する前記回路部品の位置を固定した状態で、前記第1の樹脂層と前記第2の樹脂層とを積層し、該仮固定部材は、前記第1の樹脂層と前記第2の樹脂層とを積層した後、加熱・圧着する前に消失させることを特徴とする、請求項2に記載の部品内蔵モジュールの製造方法。
- 前記仮固定部材は有機溶剤であることを特徴とする、請求項3に記載の部品内蔵モジュールの製造方法。
- 前記第2の樹脂層は、貫通孔又は凹部を有するキャビティ付き樹脂層を含み、
前記第2の工程において、前記キャビティ付き樹脂層の前記貫通孔又は前記凹部に前記回路部品が収納された状態で、前記第1の樹脂層と前記第2の樹脂層とを積層し、加熱・圧着することを特徴とする、請求項4に記載の部品内蔵モジュールの製造方法。 - 前記第1の樹脂層がその前記一方主面に有する前記配線パターンは、前記第1の樹脂層の前記一方主面に配置された金属箔が加工されてなることを特徴とする、請求項1乃至5のいずれか一つに記載の部品内蔵モジュールの製造方法。
- 前記第1の樹脂層がその前記一方主面に有する前記配線パターンの表面が、前記回路部品の前記端子電極の表面とは異なる金属で被覆されていることを特徴とする、請求項6に記載の部品内蔵モジュールの製造方法。
- 前記第1の樹脂層がその前記一方主面に有する前記配線パターンの表面が、前記回路部品の前記端子電極の表面と同一の金属で被覆されていることを特徴とする、請求項6に記載の部品内蔵モジュールの製造方法。
- 前記回路部品の前記端子電極の表面を被覆する前記金属が金であることを特徴とする、請求項8に記載の部品内蔵モジュールの製造方法。
- 前記熱可塑性樹脂が液晶ポリマーであることを特徴とする、請求項1乃至9のいずれか一つに記載の部品内蔵モジュールの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010520736A JP5110163B2 (ja) | 2008-07-17 | 2009-04-29 | 部品内蔵モジュールの製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008186392 | 2008-07-17 | ||
JP2008186392 | 2008-07-17 | ||
PCT/JP2009/001942 WO2010007715A1 (ja) | 2008-07-17 | 2009-04-29 | 部品内蔵モジュールの製造方法 |
JP2010520736A JP5110163B2 (ja) | 2008-07-17 | 2009-04-29 | 部品内蔵モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010007715A1 true JPWO2010007715A1 (ja) | 2012-01-05 |
JP5110163B2 JP5110163B2 (ja) | 2012-12-26 |
Family
ID=41550127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010520736A Active JP5110163B2 (ja) | 2008-07-17 | 2009-04-29 | 部品内蔵モジュールの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110100549A1 (ja) |
JP (1) | JP5110163B2 (ja) |
CN (1) | CN102100132A (ja) |
DE (1) | DE112009001736T5 (ja) |
WO (1) | WO2010007715A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5110163B2 (ja) * | 2008-07-17 | 2012-12-26 | 株式会社村田製作所 | 部品内蔵モジュールの製造方法 |
JP2011168663A (ja) * | 2010-02-17 | 2011-09-01 | Sumitomo Bakelite Co Ltd | 有機基板の仮固定剤及びそれを用いた半導体装置の製造方法 |
JP2012033780A (ja) * | 2010-07-30 | 2012-02-16 | Dainippon Printing Co Ltd | 部品内蔵配線板 |
JP2014195124A (ja) * | 2014-06-30 | 2014-10-09 | Dainippon Printing Co Ltd | 部品内蔵配線板の製造方法 |
CN210124036U (zh) * | 2016-08-23 | 2020-03-03 | 株式会社村田制作所 | 树脂多层基板 |
KR20190142382A (ko) | 2017-05-25 | 2019-12-26 | 가부시키가이샤 신가와 | 구조체의 제조 방법 및 구조체 |
WO2019163575A1 (ja) * | 2018-02-23 | 2019-08-29 | 富士フイルム株式会社 | 接合体の製造方法、仮固定部材、および積層体 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3666588A (en) * | 1970-01-26 | 1972-05-30 | Western Electric Co | Method of retaining and bonding articles |
US4292116A (en) * | 1978-04-18 | 1981-09-29 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on a printed circuit board |
JP2536274B2 (ja) * | 1990-10-25 | 1996-09-18 | 日本電気株式会社 | ポリイミド多層配線基板の製造方法 |
JP3512225B2 (ja) * | 1994-02-28 | 2004-03-29 | 株式会社日立製作所 | 多層配線基板の製造方法 |
US6156860A (en) * | 1997-02-18 | 2000-12-05 | Dainippon Ink And Chemicals, Inc. | Surface active agent containing fluorine and coating compositions using the same |
JPH11204943A (ja) * | 1998-01-08 | 1999-07-30 | Hitachi Ltd | 電子回路基板およびその製造方法 |
JP2000049450A (ja) * | 1998-05-25 | 2000-02-18 | Matsushita Electric Ind Co Ltd | 電子部品の半田付け方法 |
JP3495913B2 (ja) * | 1998-05-28 | 2004-02-09 | シャープ株式会社 | 半導体装置実装用樹脂シート |
JP4326105B2 (ja) * | 2000-03-17 | 2009-09-02 | シチズン電子株式会社 | フリップチップ実装方法 |
JP3882540B2 (ja) | 2001-07-04 | 2007-02-21 | 株式会社デンソー | プリント基板の製造方法およびその製造方法によって形成されるプリント基板 |
JP2005045117A (ja) * | 2003-07-24 | 2005-02-17 | Denso Corp | 電子部品のプリント配線基板への実装構造 |
JP2006049536A (ja) * | 2004-08-04 | 2006-02-16 | Sohki:Kk | 多層回路基板 |
JP2008141007A (ja) * | 2006-12-01 | 2008-06-19 | Denso Corp | 多層基板の製造方法 |
CN102100131A (zh) * | 2008-07-17 | 2011-06-15 | 株式会社村田制作所 | 元器件内置模块及其制造方法 |
JP5110163B2 (ja) * | 2008-07-17 | 2012-12-26 | 株式会社村田製作所 | 部品内蔵モジュールの製造方法 |
-
2009
- 2009-04-29 JP JP2010520736A patent/JP5110163B2/ja active Active
- 2009-04-29 WO PCT/JP2009/001942 patent/WO2010007715A1/ja active Application Filing
- 2009-04-29 DE DE112009001736T patent/DE112009001736T5/de not_active Withdrawn
- 2009-04-29 CN CN2009801283772A patent/CN102100132A/zh active Pending
-
2011
- 2011-01-14 US US13/006,467 patent/US20110100549A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2010007715A1 (ja) | 2010-01-21 |
DE112009001736T5 (de) | 2012-01-26 |
CN102100132A (zh) | 2011-06-15 |
US20110100549A1 (en) | 2011-05-05 |
JP5110163B2 (ja) | 2012-12-26 |
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