JPWO2005004182A1 - グリーンシートの積層方法と積層セラミック電子部品の製造方法 - Google Patents
グリーンシートの積層方法と積層セラミック電子部品の製造方法 Download PDFInfo
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- H—ELECTRICITY
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- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/308—Stacked capacitors made by transfer techniques
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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Abstract
Description
支持シートの表面に、電極層および/またはグリーンシートから成る積層単位を積層し、積層単位付き支持シートを形成する工程と、
前記積層単位付き支持シートを巻き取り、ロール体を形成する工程と、
前記ロール体を巻き解し、前記積層単位付き支持シートを、積層すべき層の上に置き、前記支持シートを前記積層単位から引きはがし、前記積層単位を積層する工程とを有するグリーンシートの積層方法であって、
前記支持シートの裏面には、前記積層単位の幅と同等以上の幅の剥離容易化表面処理が成されており、しかも、剥離容易化表面処理が成されていない粘着可能部分が形成してあることを特徴とする。
上記に記載のグリーンシートの積層方法を用いて積層された積層体を、脱バインダ処理して焼成することを特徴とする。本発明に係るグリーンシートの積層方法を用いて、積層セラミック電子部品を製造することで、誘電体層および/または内部電極層の薄層化および多層化を容易に実現することができる。
まず、本発明に係るグリーンシートの積層方法を用いて製造される電子部品の一実施形態として、積層セラミックコンデンサの全体構成について説明する。
誘電体塗料は、誘電体原料(セラミック粉体)と有機ビヒクルとを混練して得られる有機溶剤系塗料で構成される。
保持温度:200〜400℃、特に250〜350℃、
保持時間:0.5〜20時間、特に1〜10時間、
雰囲気:加湿したN2とH2との混合ガス。
昇温速度:50〜500℃/時間、特に200〜300℃/時間、
保持温度:1100〜1300℃、特に1150〜1250℃、
保持時間:0.5〜8時間、特に1〜3時間、
冷却速度:50〜500℃/時間、特に200〜300℃/時間、
雰囲気ガス:加湿したN2とH2との混合ガス等。
冷却速度:50〜500℃/時間、特に100〜300℃/時間、
雰囲気用ガス:加湿したN2ガス等。
このようにして製造された本発明の積層セラミックコンデンサは、ハンダ付等によりプリント基板上などに実装され、各種電子機器等に使用される。
たとえば、本発明の方法は、積層セラミックコンデンサの製造方法に限らず、その他の積層型電子部品の製造方法としても適用することが可能である。
また、上述した実施形態では、図6および図7に示すように、キャリアシート20の表面に形成される積層単位U1が5層であるが、本発明では、積層単位U1は、5層に限らず、何層であっても良い。また、キャリアシート20の表面に形成される積層単位U1は、グリーンシート10aの単層、内部電極層12aの単層、接着層28の単層、あるいはこれらの組合せであっても良い。
Claims (10)
- 支持シートの表面に、電極層および/またはグリーンシートから成る積層単位を積層し、積層単位付き支持シートを形成する工程と、
前記積層単位付き支持シートを巻き取り、ロール体を形成する工程と、
前記ロール体を巻き解し、前記積層単位付き支持シートを、積層すべき層の上に置き、前記支持シートを前記積層単位から引きはがし、前記積層単位を積層する工程とを有するグリーンシートの積層方法であって、
前記支持シートの裏面には、前記積層単位の幅と同等以上の幅の剥離容易化表面処理が成されており、しかも、剥離容易化表面処理が成されていない粘着可能部分が形成してあることを特徴とするグリーンシートの積層方法。 - 前記粘着可能部分が、前記支持シートの裏面に、支持シートの長手方向に沿って連続的または断続的に形成してある請求項1に記載のグリーンシートの積層方法。
- 前記剥離容易化表面処理が施してある部分が、前記支持シートの裏面に長手方向に沿って連続的に形成してある請求項1に記載のグリーンシートの積層方法。
- 前記粘着可能部分が、前記支持シートの裏面に、支持シートの幅方向片側または両側に形成してある請求項1〜3のいずれかに記載のグリーンシートの積層方法。
- 前記支持シートの表面に、裏面の剥離容易化表面処理の幅と同等以上の剥離容易化表面処理が施してある請求項1〜4のいずれかに記載のグリーンシートの積層方法。
- 前記積層単位の表面には、接着層が積層されることを特徴とする請求項1〜5のいずれかに記載のグリーンシートの積層方法。
- 前記支持シートの裏面に、粘着シートを貼り付け、この粘着シートを用いて、前記支持シートを前記積層単位から引きはがすことを特徴とする請求項1〜6のいずれかに記載のグリーンシートの積層方法。
- 前記ロール体を巻き解し、前記積層単位付き支持シートを切断し、切断された前記積層単位付き支持シートを、積層すべき層の上に置き、前記支持シートを前記積層単位から引きはがし、前記積層単位を積層する請求項1〜7のいずれかに記載のグリーンシートの積層方法。
- 前記積層単位が、所定パターンの電極層と、その所定パターンの電極層の間の余白部分に形成してある余白パターン層とを有する請求項1〜8のいずれかに記載のグリーンシートの積層方法。
- 請求項1〜9のいずれかに記載のグリーンシートの積層方法を用いて積層された積層体を、脱バインダ処理して焼成することを特徴とする積層セラミック電子部品の製造方法。
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JP2003176546 | 2003-06-20 | ||
PCT/JP2004/008530 WO2005004182A2 (ja) | 2003-06-20 | 2004-06-17 | グリーンシートの積層方法と積層セラミック電子部品の製造方法 |
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JP (1) | JP4340657B2 (ja) |
KR (1) | KR100766184B1 (ja) |
CN (1) | CN100557733C (ja) |
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WO (1) | WO2005004182A2 (ja) |
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KR100848436B1 (ko) * | 2002-12-27 | 2008-07-28 | 티디케이가부시기가이샤 | 적층형 전자 부품의 제조 방법 |
CN1791952A (zh) * | 2003-04-18 | 2006-06-21 | Tdk株式会社 | 用于制造多层电子组件的多层单元的方法 |
KR100749796B1 (ko) * | 2003-04-18 | 2007-08-16 | 티디케이가부시기가이샤 | 적층 전자 부품용 적층체 유닛의 제조방법 |
EP2471128B1 (en) | 2009-08-24 | 2020-03-25 | Sion Power Corporation | Release system for electrochemical cells |
KR101716344B1 (ko) * | 2011-06-28 | 2017-03-15 | 조인셋 주식회사 | 페라이트 시트 어셈블리 및 그 제조방법 |
JP2016511527A (ja) | 2013-03-15 | 2016-04-14 | シオン・パワー・コーポレーション | 保護電極構造および方法 |
WO2014140198A1 (en) | 2013-03-15 | 2014-09-18 | Basf Se | Protected electrode structures |
US9653750B2 (en) | 2014-02-19 | 2017-05-16 | Sion Power Corporation | Electrode protection using a composite comprising an electrolyte-inhibiting ion conductor |
US10490796B2 (en) | 2014-02-19 | 2019-11-26 | Sion Power Corporation | Electrode protection using electrolyte-inhibiting ion conductor |
TWI660376B (zh) * | 2017-08-09 | 2019-05-21 | 日商創想意沃股份有限公司 | 電子部件的製造方法及裝置以及電子部件 |
KR20220141858A (ko) * | 2020-03-04 | 2022-10-20 | 티디케이가부시기가이샤 | 박리 필름 롤, 세라믹 부품 시트 및 그 제조 방법과 세라믹 부품 및 그 제조 방법 |
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US4297522A (en) * | 1979-09-07 | 1981-10-27 | Tme, Inc. | Cable shield |
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JPH01167577A (ja) * | 1987-12-24 | 1989-07-03 | Daido Steel Co Ltd | アーク溶解装置 |
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JPH1167577A (ja) * | 1997-08-21 | 1999-03-09 | Matsushita Electric Ind Co Ltd | 積層型セラミック電子部品の製造方法 |
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US6245171B1 (en) * | 1998-11-23 | 2001-06-12 | International Business Machines Corporation | Multi-thickness, multi-layer green sheet lamination and method thereof |
JP2001044064A (ja) * | 1999-07-28 | 2001-02-16 | Matsushita Electric Ind Co Ltd | セラミック電子部品の製造方法 |
JP2003095740A (ja) * | 2001-09-20 | 2003-04-03 | Nippon Electric Glass Co Ltd | ガラスセラミック誘電体材料および焼結体 |
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- 2004-06-17 WO PCT/JP2004/008530 patent/WO2005004182A2/ja active Application Filing
- 2004-06-17 CN CNB2004800237172A patent/CN100557733C/zh not_active Expired - Fee Related
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US7234215B2 (en) | 2007-06-26 |
TW200509164A (en) | 2005-03-01 |
WO2005004182A3 (ja) | 2005-04-14 |
CN1839452A (zh) | 2006-09-27 |
WO2005004182A2 (ja) | 2005-01-13 |
KR20060026878A (ko) | 2006-03-24 |
TWI237279B (en) | 2005-08-01 |
CN100557733C (zh) | 2009-11-04 |
US20060130320A1 (en) | 2006-06-22 |
KR100766184B1 (ko) | 2007-10-10 |
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