JPS649171U - - Google Patents
Info
- Publication number
- JPS649171U JPS649171U JP10407987U JP10407987U JPS649171U JP S649171 U JPS649171 U JP S649171U JP 10407987 U JP10407987 U JP 10407987U JP 10407987 U JP10407987 U JP 10407987U JP S649171 U JPS649171 U JP S649171U
- Authority
- JP
- Japan
- Prior art keywords
- spring
- rod
- stopper
- separators
- coming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004308 accommodation Effects 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Packages (AREA)
Description
図面はこの考案の一実施例を示し、第1図はス
プリング収容具の前方斜視図、第2図は収容動作
を示す収容具の側面斜視図、第3図はスプリング
を収容した収容具の側面斜視図である。
2…スプリング、3…通し棒、3a…ストツパ
、9…セパレータ、9a…挿通孔、12…抜止め
キヤツプ。
The drawings show an embodiment of this invention, with Fig. 1 being a front perspective view of the spring accommodating device, Fig. 2 being a side perspective view of the accommodating device showing the accommodation operation, and Fig. 3 being a side view of the accommodating device housing the spring. FIG. 2...Spring, 3...Threading rod, 3a...Stopper, 9...Separator, 9a...Insertion hole, 12...Removal prevention cap.
Claims (1)
部にスプリング抜止め用のストツパを形成し、該
通し棒に、所定形状にコイリングされたスプリン
グと、該スプリングより若干大きいセパレータと
を交互に複数個挿嵌したスプリング収容具。 A stopper for preventing the spring from coming off is formed at the base end of a through rod having a smaller diameter than the small diameter annular portion of the spring, and a plurality of springs coiled into a predetermined shape and separators slightly larger than the spring are alternately arranged on the through rod. Insert spring housing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10407987U JPS649171U (en) | 1987-07-06 | 1987-07-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10407987U JPS649171U (en) | 1987-07-06 | 1987-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS649171U true JPS649171U (en) | 1989-01-18 |
Family
ID=31335479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10407987U Pending JPS649171U (en) | 1987-07-06 | 1987-07-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS649171U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0338051A (en) * | 1989-06-29 | 1991-02-19 | Applied Materials Inc | Handling method and device for semiconductor wafer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS628979B2 (en) * | 1981-09-29 | 1987-02-25 | Fujitsu Ltd |
-
1987
- 1987-07-06 JP JP10407987U patent/JPS649171U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS628979B2 (en) * | 1981-09-29 | 1987-02-25 | Fujitsu Ltd |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0338051A (en) * | 1989-06-29 | 1991-02-19 | Applied Materials Inc | Handling method and device for semiconductor wafer |
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