JPS6489396A - Cooling device for electronic circuit - Google Patents
Cooling device for electronic circuitInfo
- Publication number
- JPS6489396A JPS6489396A JP24500187A JP24500187A JPS6489396A JP S6489396 A JPS6489396 A JP S6489396A JP 24500187 A JP24500187 A JP 24500187A JP 24500187 A JP24500187 A JP 24500187A JP S6489396 A JPS6489396 A JP S6489396A
- Authority
- JP
- Japan
- Prior art keywords
- cooling air
- package
- vanes
- constitution
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
PURPOSE:To allow a certain, optimal control of cooling air with a simple constitution by controlling with upper and lower bars on a link mechanism the opening and closing operation of vanes of a vane mechanism arranged between package guides. CONSTITUTION:When an electronic circuit package 1 is not inserted into a package guide, vanes 6 of a vane mechanism 3 are closed with a lower bar 8 being pulled by a spring 16, whereby the flow of cooling air is blocked. Upon insertion of the package 1, a guide pin 5 thereof presses a connecting part 15 of an upper bar 7 to rotate the vanes 6 to an opening position, whereby cooling air is introduced to the package 1. At this point, cooling air flow volume is adjusted by rotating angle of the vanes 6 being changed in function of the mounting position of the pin 5. According to the constitution, cooling air can be controlled optimally without fail with a simple constitution which requires no dummy module or cover plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24500187A JPS6489396A (en) | 1987-09-29 | 1987-09-29 | Cooling device for electronic circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24500187A JPS6489396A (en) | 1987-09-29 | 1987-09-29 | Cooling device for electronic circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6489396A true JPS6489396A (en) | 1989-04-03 |
JPH0563117B2 JPH0563117B2 (en) | 1993-09-09 |
Family
ID=17127103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24500187A Granted JPS6489396A (en) | 1987-09-29 | 1987-09-29 | Cooling device for electronic circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6489396A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5528455A (en) * | 1995-04-26 | 1996-06-18 | Tektronix, Inc. | Modular instrument chassis |
US6381147B1 (en) * | 1998-05-15 | 2002-04-30 | Hybricon Corporation | Card guide including air deflector means |
GB2369249B (en) * | 2000-11-06 | 2004-06-09 | 3Com Corp | Cooling apparatus including a flow guide |
JP2009170649A (en) * | 2008-01-16 | 2009-07-30 | Nec Corp | Information processor, electronic apparatus, and housing unit |
-
1987
- 1987-09-29 JP JP24500187A patent/JPS6489396A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5528455A (en) * | 1995-04-26 | 1996-06-18 | Tektronix, Inc. | Modular instrument chassis |
US6381147B1 (en) * | 1998-05-15 | 2002-04-30 | Hybricon Corporation | Card guide including air deflector means |
GB2369249B (en) * | 2000-11-06 | 2004-06-09 | 3Com Corp | Cooling apparatus including a flow guide |
JP2009170649A (en) * | 2008-01-16 | 2009-07-30 | Nec Corp | Information processor, electronic apparatus, and housing unit |
Also Published As
Publication number | Publication date |
---|---|
JPH0563117B2 (en) | 1993-09-09 |
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