JPS6486528A - Semiconductor inspection device - Google Patents

Semiconductor inspection device

Info

Publication number
JPS6486528A
JPS6486528A JP62242608A JP24260887A JPS6486528A JP S6486528 A JPS6486528 A JP S6486528A JP 62242608 A JP62242608 A JP 62242608A JP 24260887 A JP24260887 A JP 24260887A JP S6486528 A JPS6486528 A JP S6486528A
Authority
JP
Japan
Prior art keywords
section
inspection
optical
station
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62242608A
Other languages
Japanese (ja)
Inventor
Masayoshi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP62242608A priority Critical patent/JPS6486528A/en
Publication of JPS6486528A publication Critical patent/JPS6486528A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE:To attain the shortening of the inspection time, the reduction of overlapping sections, etc., and to realize the inspection of a novel content, in which light and heat corresponding to conditions of electrical application are measured, by providing a means conducting optical discrimination and inspection under a noncontact state, a means for electrically inspecting characteristics through contact and a control means capable of simultaneously controlling both means. CONSTITUTION:A semiconductor integrated circuit 6 is connected to a test-station-head section 3 through an electrically connected contact while being set so as to be optically coupled with noncontacting optical light source section 8 and optical light-receiving section 9. When the starting of an inspection program is indicated to an inspection processing control section 1 from a station-controller 4, an electric measuring module section 2 and a picture information processing section 7 are controlled simultaneously so that inspection conditions according to the inspection program are applied, and the electric measuring module section 2 applies various electric signals under electrical applying conditions to the semiconductor integrated circuit 6 through the test-station- head section 3. The picture information processing section 7 irradiates the semiconductor integrated circuit 6 with an optical signal under optical applying conditions through the optical light source section 8.
JP62242608A 1987-09-29 1987-09-29 Semiconductor inspection device Pending JPS6486528A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62242608A JPS6486528A (en) 1987-09-29 1987-09-29 Semiconductor inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62242608A JPS6486528A (en) 1987-09-29 1987-09-29 Semiconductor inspection device

Publications (1)

Publication Number Publication Date
JPS6486528A true JPS6486528A (en) 1989-03-31

Family

ID=17091581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62242608A Pending JPS6486528A (en) 1987-09-29 1987-09-29 Semiconductor inspection device

Country Status (1)

Country Link
JP (1) JPS6486528A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002513204A (en) * 1998-04-30 2002-05-08 ケーエルエー−テンカー コーポレイション System and method for inspecting semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002513204A (en) * 1998-04-30 2002-05-08 ケーエルエー−テンカー コーポレイション System and method for inspecting semiconductor wafer

Similar Documents

Publication Publication Date Title
DE69029060D1 (en) Biosensors that use electrical, optical and mechanical signals
EP0198759A3 (en) Apparatus for the measurement of the luminosity of the skin
JPS55108782A (en) Solid pickup device
DE3882689D1 (en) TEST SAMPLE FOR ELECTRICAL SIGNALS.
DE59108405D1 (en) Multimeter with at least three input connections
ES523793A0 (en) IMPROVEMENTS IN A MEASUREMENT VALUE SENSOR.
DE3875165D1 (en) MECHANICAL PROBE FOR OPTICAL MEASUREMENT OF ELECTRICAL SIGNALS.
JPS6486528A (en) Semiconductor inspection device
NO173047C (en) DEVICE FOR PARTIAL DETERMINATION OF TENSIONS OR CHARGES BY A HUMAN OR ANIMAL, AND TO DERIVATE SUCH TENSIONS OR CHARGES
JP4403701B2 (en) Circuit board inspection equipment
JPS6246541A (en) Semiconductor integrated circuit
JPH01287482A (en) Semiconductor device measurement system
ATE30641T1 (en) ARRANGEMENT FOR MEASURING POTENTIAL DIFFERENCES.
JPH0787211B2 (en) Integrated circuit test equipment
JP2002014131A (en) Method and device for inspecting circuit board
JPS6420422A (en) Method and apparatus for measuring fiber optic temperature
JPS54105973A (en) Axis matching device for electron beam device
EP0388065A3 (en) Flame detection apparatus and method
JPS57118202A (en) Sticking method of color filter to solid-state image sensor
JPS55101063A (en) Detecting method for defect part of power cable
JPS56115932A (en) Measuring method for distribution of stress
JP2005172730A (en) Apparatus for inspecting disconnection of wire of circuit board
SU586320A1 (en) Method of metal article surface quality control
JPS57201040A (en) Semiconductor device
JPS56126748A (en) Optical detecting device