JPS6479248A - Transparent heat-resistant resin composition - Google Patents

Transparent heat-resistant resin composition

Info

Publication number
JPS6479248A
JPS6479248A JP23624787A JP23624787A JPS6479248A JP S6479248 A JPS6479248 A JP S6479248A JP 23624787 A JP23624787 A JP 23624787A JP 23624787 A JP23624787 A JP 23624787A JP S6479248 A JPS6479248 A JP S6479248A
Authority
JP
Japan
Prior art keywords
monomer
average
copolymer
weight
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23624787A
Other languages
Japanese (ja)
Inventor
Nobuyuki Hayashi
Tetsuo Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP23624787A priority Critical patent/JPS6479248A/en
Publication of JPS6479248A publication Critical patent/JPS6479248A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To obtain the title composition excellent in moldability and mechanical strengths and suitable for optical elements, by mixing an alkyl methacrylate (co)polymer of a specified weight-average MW with a copolymer of a monomer such as an alkyl methacrylate or N-phenylmaleimide with another monomer, having a specified weight-average MW. CONSTITUTION:50-100wt.% alkyl methacrylate monomer (a) of formula I (wherein R is a 1C or higher alkyl) and 50-0wt.% monomer (b) copolymerizable therewith [e.g., (alpha-methyl)styrene] are (co)polymerized to obtain a copolymer (A) of a weight-average MW of 10<5>-3X10<5>. 20-95wt.% component A is mixed with 80-5% copolymer (B) of a weight-average MW of 10<4>-1.5X10<5>, obtained by copolymerizing 30-95wt.% component (a) with 1-60wt.% monomer (c) of formula II (wherein X is at least one substituent which is any one of H, R and a halogen), e.g., N-phenylmaleimide, and 0-60wt.% monomer copolymerizable therewith (d) [e.g., (alpha-methyl)styrene].
JP23624787A 1987-09-22 1987-09-22 Transparent heat-resistant resin composition Pending JPS6479248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23624787A JPS6479248A (en) 1987-09-22 1987-09-22 Transparent heat-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23624787A JPS6479248A (en) 1987-09-22 1987-09-22 Transparent heat-resistant resin composition

Publications (1)

Publication Number Publication Date
JPS6479248A true JPS6479248A (en) 1989-03-24

Family

ID=16997956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23624787A Pending JPS6479248A (en) 1987-09-22 1987-09-22 Transparent heat-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS6479248A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5314950A (en) * 1993-01-22 1994-05-24 Cytec Technology Corp. Heat resistant resin composition comprising polymers of N-(substituted) maleimides and improved process for the preparation of said maleimides
WO2013005634A1 (en) 2011-07-01 2013-01-10 旭化成ケミカルズ株式会社 Acrylic thermoplastic resin composition and molded article thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61162509A (en) * 1985-01-10 1986-07-23 Nippon Shokubai Kagaku Kogyo Co Ltd Thermoplastic resin and thermoplastic resin composition containing the same
JPS6210157A (en) * 1985-07-08 1987-01-19 Mitsubishi Rayon Co Ltd Heat-resistant methacrylate resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61162509A (en) * 1985-01-10 1986-07-23 Nippon Shokubai Kagaku Kogyo Co Ltd Thermoplastic resin and thermoplastic resin composition containing the same
JPS6210157A (en) * 1985-07-08 1987-01-19 Mitsubishi Rayon Co Ltd Heat-resistant methacrylate resin composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5314950A (en) * 1993-01-22 1994-05-24 Cytec Technology Corp. Heat resistant resin composition comprising polymers of N-(substituted) maleimides and improved process for the preparation of said maleimides
WO2013005634A1 (en) 2011-07-01 2013-01-10 旭化成ケミカルズ株式会社 Acrylic thermoplastic resin composition and molded article thereof
JP5190564B2 (en) * 2011-07-01 2013-04-24 旭化成ケミカルズ株式会社 Acrylic thermoplastic resin composition and molded article thereof
US10030134B2 (en) 2011-07-01 2018-07-24 Asahi Kasei Kabushiki Kaisha Acrylic thermoplastic resin composition and molded article thereof

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