JPS6475740A - Water closet - Google Patents

Water closet

Info

Publication number
JPS6475740A
JPS6475740A JP23344487A JP23344487A JPS6475740A JP S6475740 A JPS6475740 A JP S6475740A JP 23344487 A JP23344487 A JP 23344487A JP 23344487 A JP23344487 A JP 23344487A JP S6475740 A JPS6475740 A JP S6475740A
Authority
JP
Japan
Prior art keywords
water closet
drain
piping
main body
opened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23344487A
Other languages
Japanese (ja)
Inventor
Yoshio Kai
Toshifumi Yoneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Priority to JP23344487A priority Critical patent/JPS6475740A/en
Publication of JPS6475740A publication Critical patent/JPS6475740A/en
Pending legal-status Critical Current

Links

Landscapes

  • Sanitary Device For Flush Toilet (AREA)

Abstract

PURPOSE: To install drain piping other than an underfloor space by opening a drain outlet of a water closet produced by forming the main unit of the water closet and a washing water tank together in one united body on upper peripheral side surface above the lower end of the main body of water closet. CONSTITUTION: An inlet 9 of a trap drain path 8 is opened in the bottom portion of a ball portion 2. Also at the rear surface of the main body A of a water closet, a drain outlet 1 of a drain path 8 is opened almost at a middle position between the lower end of a washing water tank B and the lower end of the main body A, and both holes 9, 1 are communicated and formed almost to an inverted S shape. Thus, piping to other than the underfloor of drain piping such as piping to the rear side of a wall can be realized even though for a low silhouette type, one-piece type water closet.
JP23344487A 1987-09-16 1987-09-16 Water closet Pending JPS6475740A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23344487A JPS6475740A (en) 1987-09-16 1987-09-16 Water closet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23344487A JPS6475740A (en) 1987-09-16 1987-09-16 Water closet

Publications (1)

Publication Number Publication Date
JPS6475740A true JPS6475740A (en) 1989-03-22

Family

ID=16955138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23344487A Pending JPS6475740A (en) 1987-09-16 1987-09-16 Water closet

Country Status (1)

Country Link
JP (1) JPS6475740A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03128774U (en) * 1990-04-06 1991-12-25
US5348614A (en) * 1993-06-22 1994-09-20 Lsi Logic Corporation Process for dynamic control of the concentration of one or more reactants in a plasma-enhanced process for formation of integrated circuit structures
US5374327A (en) * 1992-04-28 1994-12-20 Tokyo Electron Limited Plasma processing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5038156B2 (en) * 1972-10-06 1975-12-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5038156B2 (en) * 1972-10-06 1975-12-08

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03128774U (en) * 1990-04-06 1991-12-25
US5374327A (en) * 1992-04-28 1994-12-20 Tokyo Electron Limited Plasma processing method
US5348614A (en) * 1993-06-22 1994-09-20 Lsi Logic Corporation Process for dynamic control of the concentration of one or more reactants in a plasma-enhanced process for formation of integrated circuit structures

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