JPS6473090A - Local etching method - Google Patents

Local etching method

Info

Publication number
JPS6473090A
JPS6473090A JP22727187A JP22727187A JPS6473090A JP S6473090 A JPS6473090 A JP S6473090A JP 22727187 A JP22727187 A JP 22727187A JP 22727187 A JP22727187 A JP 22727187A JP S6473090 A JPS6473090 A JP S6473090A
Authority
JP
Japan
Prior art keywords
etchant
circuit board
laser beam
time
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22727187A
Other languages
Japanese (ja)
Inventor
Kuniyuki Fukuzawa
Fumitaka Hayata
Hiroyuki Ogino
Shinichi Wai
Masahiro Wanami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Ltd
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Plant Technologies Ltd filed Critical Hitachi Ltd
Priority to JP22727187A priority Critical patent/JPS6473090A/en
Publication of JPS6473090A publication Critical patent/JPS6473090A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits

Landscapes

  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To shorten etching time and to efficiently carry out local etching, by using an aqueous solution of ferric chloride as an etchant at the time of supplying an etchant to the desired position on a printed circuit board to apply laser beam irradiation to the position. CONSTITUTION:When a copper pattern 2 provided on a printed circuit board 1 has a short-circuit defect 3 shown by a broken line, a droplet 4 of an aqueous solution of FeCl2 (about 37% concentration) as an etchant is supplied to the part to be removed. Simultaneously, the circuit board 1 is moved while applying a YAG laser beam 5 to the above part to carry out etching. At this time, as to the above YAG laser beam 5, pulse duration and pulse intensity are regulated to several tens-100-odd ms and 10<8>-10<9>w/cm<2>, respectively, and the frequency of laser generation is also regulated to several P.P.S per mu/s scanning speed. By this method, soil due to etchants in the area outside the part to be etched can be prevented.
JP22727187A 1987-09-10 1987-09-10 Local etching method Pending JPS6473090A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22727187A JPS6473090A (en) 1987-09-10 1987-09-10 Local etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22727187A JPS6473090A (en) 1987-09-10 1987-09-10 Local etching method

Publications (1)

Publication Number Publication Date
JPS6473090A true JPS6473090A (en) 1989-03-17

Family

ID=16858206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22727187A Pending JPS6473090A (en) 1987-09-10 1987-09-10 Local etching method

Country Status (1)

Country Link
JP (1) JPS6473090A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011137897A3 (en) * 2010-05-04 2011-12-29 Lpkf Laser & Electronics Ag Method for introducing electrical insulations in printed circuit boards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011137897A3 (en) * 2010-05-04 2011-12-29 Lpkf Laser & Electronics Ag Method for introducing electrical insulations in printed circuit boards

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