JPS6473000A - Heat treatment of gallium arsenide single crystal - Google Patents

Heat treatment of gallium arsenide single crystal

Info

Publication number
JPS6473000A
JPS6473000A JP23169487A JP23169487A JPS6473000A JP S6473000 A JPS6473000 A JP S6473000A JP 23169487 A JP23169487 A JP 23169487A JP 23169487 A JP23169487 A JP 23169487A JP S6473000 A JPS6473000 A JP S6473000A
Authority
JP
Japan
Prior art keywords
ingot
single crystal
gallium arsenide
crystal
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23169487A
Other languages
Japanese (ja)
Inventor
Masazumi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP23169487A priority Critical patent/JPS6473000A/en
Publication of JPS6473000A publication Critical patent/JPS6473000A/en
Pending legal-status Critical Current

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  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PURPOSE:To uniformize the electrical characteristics of a gallium arsenide single crystal by heating the ingot of the gallium arsenide single crystal to a high temp. under specific heating conditions, then cooling the entire part of the crystal. CONSTITUTION:The ingot of the gallium arsenide single crystal is held for 2-20hr at 1,100-1,200 deg.C and is heated to the high temp., following which the entire part of the crystal is heat-treated. This heat treatment is executed by holding the single crystal for 2-20hr at 1,100-1,200 deg.C in a arsenic atmosphere in order to annihilate the defects which are formed during the growth of the ingot and are the cause for a dep energy level. Heating of the ingot to >=1,200 deg.C is undesirable as the ingot is heated nearly to the m.p. The deep energy level is generated again when the ingot heated to the high temp. is cooled. The entire part of the crystal is, therefore, heated uniformly and the rate of the cooling is preferably set at -20-200 deg.C/hr. The concn. of the defects which are the cause or the deep energy level is controlled by cooling the ingot at said cooling rate.
JP23169487A 1987-09-16 1987-09-16 Heat treatment of gallium arsenide single crystal Pending JPS6473000A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23169487A JPS6473000A (en) 1987-09-16 1987-09-16 Heat treatment of gallium arsenide single crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23169487A JPS6473000A (en) 1987-09-16 1987-09-16 Heat treatment of gallium arsenide single crystal

Publications (1)

Publication Number Publication Date
JPS6473000A true JPS6473000A (en) 1989-03-17

Family

ID=16927534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23169487A Pending JPS6473000A (en) 1987-09-16 1987-09-16 Heat treatment of gallium arsenide single crystal

Country Status (1)

Country Link
JP (1) JPS6473000A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02293399A (en) * 1989-05-08 1990-12-04 Showa Denko Kk Heat treatment of gaas ingot
WO2004001836A1 (en) * 2002-06-24 2003-12-31 Cree, Inc. Method for producing semi-insulating resistivity in high purity silicon carbide crystals
US8147991B2 (en) 2002-06-24 2012-04-03 Cree, Inc. One hundred millimeter single crystal silicon carbide wafer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02293399A (en) * 1989-05-08 1990-12-04 Showa Denko Kk Heat treatment of gaas ingot
WO2004001836A1 (en) * 2002-06-24 2003-12-31 Cree, Inc. Method for producing semi-insulating resistivity in high purity silicon carbide crystals
US6814801B2 (en) 2002-06-24 2004-11-09 Cree, Inc. Method for producing semi-insulating resistivity in high purity silicon carbide crystals
JP2005531145A (en) * 2002-06-24 2005-10-13 クリー インコーポレイテッド Method for producing semi-insulating resistivity in high purity silicon carbide crystals
US8147991B2 (en) 2002-06-24 2012-04-03 Cree, Inc. One hundred millimeter single crystal silicon carbide wafer
US9059118B2 (en) 2002-06-24 2015-06-16 Cree, Inc. Method for producing semi-insulating resistivity in high purity silicon carbide crystals
US9200381B2 (en) 2002-06-24 2015-12-01 Cree, Inc. Producing high quality bulk silicon carbide single crystal by managing thermal stresses at a seed interface

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