JPS6465120A - Liquid epoxy resin composition - Google Patents

Liquid epoxy resin composition

Info

Publication number
JPS6465120A
JPS6465120A JP22188887A JP22188887A JPS6465120A JP S6465120 A JPS6465120 A JP S6465120A JP 22188887 A JP22188887 A JP 22188887A JP 22188887 A JP22188887 A JP 22188887A JP S6465120 A JPS6465120 A JP S6465120A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
liquid epoxy
resin composition
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22188887A
Other languages
Japanese (ja)
Other versions
JPH0610247B2 (en
Inventor
Takazo Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP62221888A priority Critical patent/JPH0610247B2/en
Publication of JPS6465120A publication Critical patent/JPS6465120A/en
Publication of JPH0610247B2 publication Critical patent/JPH0610247B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the heat cycle resistance and moisture resistance (especially, pressure cooker resistance), by mixing a xylene resin with an aromatic amine and a specified silicone resin. CONSTITUTION:A mixture obtained by adding an inorganic filler (B) such as (fused) silica to a normally liquid epoxy resin (A) such as a bisphenol A epoxy resin of an MW of 350-450 and a viscosity <=300P at 25 deg.C is mixed with 0.1-20wt.% xylene resin (C), 0.9-1.1 equivalent, per equivalent of component A, of an aromatic amine (D) as a curing agent (e.g., diaminodiphenylmethane) and 0.01-5wt.% silicone resin (E) of the formula (wherein R1-8 are each CH3 or phenyl, and 2-6 groups are present for each).
JP62221888A 1987-09-07 1987-09-07 Liquid epoxy resin composition Expired - Lifetime JPH0610247B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62221888A JPH0610247B2 (en) 1987-09-07 1987-09-07 Liquid epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62221888A JPH0610247B2 (en) 1987-09-07 1987-09-07 Liquid epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS6465120A true JPS6465120A (en) 1989-03-10
JPH0610247B2 JPH0610247B2 (en) 1994-02-09

Family

ID=16773748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62221888A Expired - Lifetime JPH0610247B2 (en) 1987-09-07 1987-09-07 Liquid epoxy resin composition

Country Status (1)

Country Link
JP (1) JPH0610247B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104558616A (en) * 2015-01-05 2015-04-29 郑州中原应用技术研究开发有限公司 Silicone resin containing aryl and epoxy group, preparation method for silicone resin and epoxy resin adhesive containing silicone resin
JP2017057410A (en) * 1999-04-13 2017-03-23 日立化成株式会社 Epoxy resin composition for sealing and electronic component device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57184242A (en) * 1981-05-08 1982-11-12 Matsushita Electric Works Ltd Molding material for sealing electronic part
JPS5964623A (en) * 1982-10-04 1984-04-12 Matsushita Electric Works Ltd Epoxy resin casting material
JPS6065020A (en) * 1983-09-21 1985-04-13 Hitachi Ltd Resin composition for semiconductor sealing
JPH0313250A (en) * 1989-06-09 1991-01-22 Asahi Tec Corp Driving device for metallic mold

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57184242A (en) * 1981-05-08 1982-11-12 Matsushita Electric Works Ltd Molding material for sealing electronic part
JPS5964623A (en) * 1982-10-04 1984-04-12 Matsushita Electric Works Ltd Epoxy resin casting material
JPS6065020A (en) * 1983-09-21 1985-04-13 Hitachi Ltd Resin composition for semiconductor sealing
JPH0313250A (en) * 1989-06-09 1991-01-22 Asahi Tec Corp Driving device for metallic mold

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017057410A (en) * 1999-04-13 2017-03-23 日立化成株式会社 Epoxy resin composition for sealing and electronic component device
CN104558616A (en) * 2015-01-05 2015-04-29 郑州中原应用技术研究开发有限公司 Silicone resin containing aryl and epoxy group, preparation method for silicone resin and epoxy resin adhesive containing silicone resin

Also Published As

Publication number Publication date
JPH0610247B2 (en) 1994-02-09

Similar Documents

Publication Publication Date Title
JPS56136816A (en) Epoxy resin composition
JPS6429417A (en) Epoxy resin composition
MY107113A (en) Epoxy resin composition for semiconductor sealing.
JPS57131223A (en) Resin composition
JPS6465120A (en) Liquid epoxy resin composition
JPS5734122A (en) Thermosetting resin composition
JPS5723620A (en) Thermosetting resin composition
ES2100888T3 (en) AN EPOXIDIC MATRIX WITH INCREASED TENACITY WITH IMPROVED DAMAGE TOLERANCE AND THERMAL PERFORMANCE.
ES2000138A6 (en) Epoxy-phosphate ceramic compositions and methods of preparation.
JPS56157425A (en) Curable resin composition
ATE133432T1 (en) COMPOSITIONS OF EPOXIES AND AROMATIC POLYSILOXANES
JPS5659834A (en) Thermosetting resin composition
JPS5710255A (en) Epoxy resin composition and resin sealed type semiconductor device
JPS5755921A (en) Water-resistant epoxy resin composition
JPS5742760A (en) Epoxy resin composition
JPS6460658A (en) Primer composition for electric and electronic component
JPS57192428A (en) One-pack type epoxy resin composition
JPS5738851A (en) Thermosetting resin composition
JPS57164118A (en) Epoxy resin composition
JPS5531806A (en) Silicone resin composition
SU765332A1 (en) Adhesive composition
JPS5790014A (en) Epoxy resin composition
JPS56136815A (en) Epoxy resin composition
JPS57174315A (en) Epoxy resin composition
JPS5725322A (en) Epoxy resin composition