JPS6465120A - Liquid epoxy resin composition - Google Patents
Liquid epoxy resin compositionInfo
- Publication number
- JPS6465120A JPS6465120A JP22188887A JP22188887A JPS6465120A JP S6465120 A JPS6465120 A JP S6465120A JP 22188887 A JP22188887 A JP 22188887A JP 22188887 A JP22188887 A JP 22188887A JP S6465120 A JPS6465120 A JP S6465120A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- liquid epoxy
- resin composition
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To improve the heat cycle resistance and moisture resistance (especially, pressure cooker resistance), by mixing a xylene resin with an aromatic amine and a specified silicone resin. CONSTITUTION:A mixture obtained by adding an inorganic filler (B) such as (fused) silica to a normally liquid epoxy resin (A) such as a bisphenol A epoxy resin of an MW of 350-450 and a viscosity <=300P at 25 deg.C is mixed with 0.1-20wt.% xylene resin (C), 0.9-1.1 equivalent, per equivalent of component A, of an aromatic amine (D) as a curing agent (e.g., diaminodiphenylmethane) and 0.01-5wt.% silicone resin (E) of the formula (wherein R1-8 are each CH3 or phenyl, and 2-6 groups are present for each).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62221888A JPH0610247B2 (en) | 1987-09-07 | 1987-09-07 | Liquid epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62221888A JPH0610247B2 (en) | 1987-09-07 | 1987-09-07 | Liquid epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6465120A true JPS6465120A (en) | 1989-03-10 |
JPH0610247B2 JPH0610247B2 (en) | 1994-02-09 |
Family
ID=16773748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62221888A Expired - Lifetime JPH0610247B2 (en) | 1987-09-07 | 1987-09-07 | Liquid epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0610247B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104558616A (en) * | 2015-01-05 | 2015-04-29 | 郑州中原应用技术研究开发有限公司 | Silicone resin containing aryl and epoxy group, preparation method for silicone resin and epoxy resin adhesive containing silicone resin |
JP2017057410A (en) * | 1999-04-13 | 2017-03-23 | 日立化成株式会社 | Epoxy resin composition for sealing and electronic component device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57184242A (en) * | 1981-05-08 | 1982-11-12 | Matsushita Electric Works Ltd | Molding material for sealing electronic part |
JPS5964623A (en) * | 1982-10-04 | 1984-04-12 | Matsushita Electric Works Ltd | Epoxy resin casting material |
JPS6065020A (en) * | 1983-09-21 | 1985-04-13 | Hitachi Ltd | Resin composition for semiconductor sealing |
JPH0313250A (en) * | 1989-06-09 | 1991-01-22 | Asahi Tec Corp | Driving device for metallic mold |
-
1987
- 1987-09-07 JP JP62221888A patent/JPH0610247B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57184242A (en) * | 1981-05-08 | 1982-11-12 | Matsushita Electric Works Ltd | Molding material for sealing electronic part |
JPS5964623A (en) * | 1982-10-04 | 1984-04-12 | Matsushita Electric Works Ltd | Epoxy resin casting material |
JPS6065020A (en) * | 1983-09-21 | 1985-04-13 | Hitachi Ltd | Resin composition for semiconductor sealing |
JPH0313250A (en) * | 1989-06-09 | 1991-01-22 | Asahi Tec Corp | Driving device for metallic mold |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017057410A (en) * | 1999-04-13 | 2017-03-23 | 日立化成株式会社 | Epoxy resin composition for sealing and electronic component device |
CN104558616A (en) * | 2015-01-05 | 2015-04-29 | 郑州中原应用技术研究开发有限公司 | Silicone resin containing aryl and epoxy group, preparation method for silicone resin and epoxy resin adhesive containing silicone resin |
Also Published As
Publication number | Publication date |
---|---|
JPH0610247B2 (en) | 1994-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS56136816A (en) | Epoxy resin composition | |
JPS6429417A (en) | Epoxy resin composition | |
MY107113A (en) | Epoxy resin composition for semiconductor sealing. | |
JPS57131223A (en) | Resin composition | |
JPS6465120A (en) | Liquid epoxy resin composition | |
JPS5734122A (en) | Thermosetting resin composition | |
JPS5723620A (en) | Thermosetting resin composition | |
ES2100888T3 (en) | AN EPOXIDIC MATRIX WITH INCREASED TENACITY WITH IMPROVED DAMAGE TOLERANCE AND THERMAL PERFORMANCE. | |
ES2000138A6 (en) | Epoxy-phosphate ceramic compositions and methods of preparation. | |
JPS56157425A (en) | Curable resin composition | |
ATE133432T1 (en) | COMPOSITIONS OF EPOXIES AND AROMATIC POLYSILOXANES | |
JPS5659834A (en) | Thermosetting resin composition | |
JPS5710255A (en) | Epoxy resin composition and resin sealed type semiconductor device | |
JPS5755921A (en) | Water-resistant epoxy resin composition | |
JPS5742760A (en) | Epoxy resin composition | |
JPS6460658A (en) | Primer composition for electric and electronic component | |
JPS57192428A (en) | One-pack type epoxy resin composition | |
JPS5738851A (en) | Thermosetting resin composition | |
JPS57164118A (en) | Epoxy resin composition | |
JPS5531806A (en) | Silicone resin composition | |
SU765332A1 (en) | Adhesive composition | |
JPS5790014A (en) | Epoxy resin composition | |
JPS56136815A (en) | Epoxy resin composition | |
JPS57174315A (en) | Epoxy resin composition | |
JPS5725322A (en) | Epoxy resin composition |