JPS646068U - - Google Patents
Info
- Publication number
- JPS646068U JPS646068U JP10058487U JP10058487U JPS646068U JP S646068 U JPS646068 U JP S646068U JP 10058487 U JP10058487 U JP 10058487U JP 10058487 U JP10058487 U JP 10058487U JP S646068 U JPS646068 U JP S646068U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- periphery
- covered
- solder resist
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 239000011889 copper foil Substances 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10058487U JPS646068U (pt) | 1987-06-30 | 1987-06-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10058487U JPS646068U (pt) | 1987-06-30 | 1987-06-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS646068U true JPS646068U (pt) | 1989-01-13 |
Family
ID=31328792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10058487U Pending JPS646068U (pt) | 1987-06-30 | 1987-06-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS646068U (pt) |
-
1987
- 1987-06-30 JP JP10058487U patent/JPS646068U/ja active Pending