JPS646053U - - Google Patents
Info
- Publication number
- JPS646053U JPS646053U JP10126387U JP10126387U JPS646053U JP S646053 U JPS646053 U JP S646053U JP 10126387 U JP10126387 U JP 10126387U JP 10126387 U JP10126387 U JP 10126387U JP S646053 U JPS646053 U JP S646053U
- Authority
- JP
- Japan
- Prior art keywords
- polarizer
- light
- resin body
- incident side
- polarization plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000010287 polarization Effects 0.000 claims 2
- 230000003287 optical effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
第１図ａ，ｂは本考案の一実施例を示す光半導
体装置の一部切欠平面図及びＡ―Ａ′線断面図、
第２図は第１図ａ，ｂに示す一実施例の斜視図、
第３図は従来の光半導体装置の一例を示す断面図
である。
１……受光素子、２，３……リード線、４……
金線、５……光透過性樹脂体、６，７……偏光子
、８……パツケージ、９……レンズ、１０……光
透過性樹脂体、１１……キヤツプ。
FIGS. 1a and 1b are a partially cutaway plan view and a cross-sectional view taken along the line A-A' of an optical semiconductor device showing an embodiment of the present invention;
FIG. 2 is a perspective view of one embodiment shown in FIGS. 1a and b;
FIG. 3 is a sectional view showing an example of a conventional optical semiconductor device. 1... Light receiving element, 2, 3... Lead wire, 4...
Gold wire, 5... Light-transmitting resin body, 6, 7... Polarizer, 8... Package, 9... Lens, 10... Light-transmitting resin body, 11... Cap.
Claims (1)
前記光透過性樹脂体の光入射側に設けられた第１
の偏光子とを有するパツケージと、前記第１の偏
光子と相対する第２の偏光子を備え且つ前記第１
の偏光子の偏光面に対して前記第２の偏光子の偏
光面を回転できるように前記パツケージの光入射
側に取付けられた光透過性樹脂体からなるキヤツ
プとを含むことを特徴とする光半導体装置。 a light-transmissive resin body encapsulating a semiconductor light-receiving element;
a first provided on the light incident side of the light-transmissive resin body;
a second polarizer opposite to the first polarizer, and a second polarizer opposite to the first polarizer;
and a cap made of a light-transmitting resin body attached to the light incident side of the package so as to be able to rotate the polarization plane of the second polarizer with respect to the polarization plane of the polarizer. Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10126387U JPS646053U (en) | 1987-06-30 | 1987-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10126387U JPS646053U (en) | 1987-06-30 | 1987-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS646053U true JPS646053U (en) | 1989-01-13 |
Family
ID=31330099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10126387U Pending JPS646053U (en) | 1987-06-30 | 1987-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS646053U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001004878A (en) * | 1999-06-23 | 2001-01-12 | Sharp Corp | Optical transmission/reception module and optical cable and single core two-way optical communication system by using them |
| JP2002512436A (en) * | 1998-02-06 | 2002-04-23 | シェルケース リミティド | Integrated circuit device |
-
1987
- 1987-06-30 JP JP10126387U patent/JPS646053U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002512436A (en) * | 1998-02-06 | 2002-04-23 | シェルケース リミティド | Integrated circuit device |
| US9530945B2 (en) | 1998-02-06 | 2016-12-27 | Invensas Corporation | Integrated circuit device |
| JP2001004878A (en) * | 1999-06-23 | 2001-01-12 | Sharp Corp | Optical transmission/reception module and optical cable and single core two-way optical communication system by using them |