JPS6459887A - Superconductive circuit board - Google Patents
Superconductive circuit boardInfo
- Publication number
- JPS6459887A JPS6459887A JP62217002A JP21700287A JPS6459887A JP S6459887 A JPS6459887 A JP S6459887A JP 62217002 A JP62217002 A JP 62217002A JP 21700287 A JP21700287 A JP 21700287A JP S6459887 A JPS6459887 A JP S6459887A
- Authority
- JP
- Japan
- Prior art keywords
- metal conductive
- layer
- conductive layer
- superconductive
- oxide superconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Landscapes
- Superconductors And Manufacturing Methods Therefor (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Structure Of Printed Boards (AREA)
Abstract
PURPOSE:To realize a superconductive circuit board which is superb in coherency and does not produce cracks and peeling even if cooling/heating cycle is repeated by forming an oxide superconductive layer on a metal conductive layer which is formed on a ceramic substrate. CONSTITUTION:A metal conductive layer 2 consisting of copper is formed by performing plasma flame spraying of copper powder onto sand blast processed surface of a nitrided aluminum substrate 1 in argon gas atmosphere through a masking plate 4. Then, plasma flame spraying is performed on the metal conductive layer 2 in argon gas atmosphere through the masking plate 4 using oxide superconductive powder to form a oxide superconductive layer 3 and to obtain the desired superconductive circuit board. A metal conductive layer between a ceramic substrate and oxide superconductive layer prevents the generation of heat stress due to difference in heat expansion coefficients between the oxide superconductive layer and ceramic substrate, enhances coupling strength, and improves reliability for cooling/heating cycle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62217002A JPS6459887A (en) | 1987-08-31 | 1987-08-31 | Superconductive circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62217002A JPS6459887A (en) | 1987-08-31 | 1987-08-31 | Superconductive circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6459887A true JPS6459887A (en) | 1989-03-07 |
Family
ID=16697280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62217002A Pending JPS6459887A (en) | 1987-08-31 | 1987-08-31 | Superconductive circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6459887A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5648123A (en) * | 1992-04-02 | 1997-07-15 | Hoechst Aktiengesellschaft | Process for producing a strong bond between copper layers and ceramic |
-
1987
- 1987-08-31 JP JP62217002A patent/JPS6459887A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5648123A (en) * | 1992-04-02 | 1997-07-15 | Hoechst Aktiengesellschaft | Process for producing a strong bond between copper layers and ceramic |
JP2944215B2 (en) * | 1992-04-02 | 1999-08-30 | ヘキスト・アクチェンゲゼルシャフト | How to create a strong bond between a copper layer and a ceramic |
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