JPS6459827A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6459827A JPS6459827A JP62216857A JP21685787A JPS6459827A JP S6459827 A JPS6459827 A JP S6459827A JP 62216857 A JP62216857 A JP 62216857A JP 21685787 A JP21685787 A JP 21685787A JP S6459827 A JPS6459827 A JP S6459827A
- Authority
- JP
- Japan
- Prior art keywords
- lsi chip
- wiring board
- substrate
- insulating film
- protruding electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE:To enhance a close contact force between an insulating resin and an LSI chip and a wiring board and to enhance reliability of moistureproofness and thermal resistance by a method wherein an insulating film chemically bonded to a substrate is installed on the surface of the LSI chip and the surface of the wiring board. CONSTITUTION:An insulating resin 4 is coated on a face having a conductor wiring part 2 of a wiring board 1 composed of glass or the like and having an insulating film 3 chemically bonded to a substrate. A protruding electrode 6 of an LSI chip 5 having the protruding electrode 6 and having an insulating film 7 chemically bonded to a substrate is aligned with the conductor wiring part 2; the LSI chip 5 is pressed to the wiring board 1 by using a pressurization tool 8. The LSI chip 5 is bonded firmly by the insulating resin 4; the protruding electrode 6 is connected electrically to the conductor wiring part 2 by contact due to a contractile force caused by hardening.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62216857A JPS6459827A (en) | 1987-08-31 | 1987-08-31 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62216857A JPS6459827A (en) | 1987-08-31 | 1987-08-31 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6459827A true JPS6459827A (en) | 1989-03-07 |
Family
ID=16694995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62216857A Pending JPS6459827A (en) | 1987-08-31 | 1987-08-31 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6459827A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7170145B2 (en) | 2003-04-28 | 2007-01-30 | Sharp Kabushiki Kaisha | Method of manufacturing semiconductor device, flexible substrate, and semiconductor device |
-
1987
- 1987-08-31 JP JP62216857A patent/JPS6459827A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7170145B2 (en) | 2003-04-28 | 2007-01-30 | Sharp Kabushiki Kaisha | Method of manufacturing semiconductor device, flexible substrate, and semiconductor device |
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