JPS645914Y2 - - Google Patents
Info
- Publication number
- JPS645914Y2 JPS645914Y2 JP1987134170U JP13417087U JPS645914Y2 JP S645914 Y2 JPS645914 Y2 JP S645914Y2 JP 1987134170 U JP1987134170 U JP 1987134170U JP 13417087 U JP13417087 U JP 13417087U JP S645914 Y2 JPS645914 Y2 JP S645914Y2
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- substrate
- board
- case
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 39
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000004323 axial length Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
Description
【考案の詳細な説明】
[考案の目的]
(産業上の利用分野)
本考案は、放熱性を兼ねたアルミニウムなどの
金属板を主体とし、複数の貫通孔を有するハイブ
リツドIC用基板を収納するためのケースに関す
る。[Detailed description of the invention] [Purpose of the invention] (Field of industrial application) This invention is a device that houses a hybrid IC substrate that is mainly made of a metal plate such as aluminum that also has heat dissipation properties and has multiple through holes. Regarding the case for.
(従来の技術)
ハイブリツドIC用基板は、基板本体にトラン
ジスタ、抵抗、コンデンサ、ダイオード、トライ
アツク等の各種電子部品及び出力端子を取付ける
パターンと配線を形成した構造になつている。こ
の基板に用いられる基板本体は、最近、セラミツ
ク板に代わり放熱性の優れた金属板、例えばアル
ミニウム板が使用されている。また、かかるハイ
ブリツドIC用基板はマウントされたトランジス
タ等の電子部品を保護するためにケースに収納さ
れるが、このケースは内外部との電気絶縁を確保
するために金属に代つて合成樹脂で形成されてい
る。(Prior Art) A hybrid IC substrate has a structure in which patterns and wiring are formed on the substrate body to attach various electronic components such as transistors, resistors, capacitors, diodes, and triacs, as well as output terminals. Recently, a metal plate with excellent heat dissipation properties, such as an aluminum plate, has been used instead of a ceramic plate for the main body of the substrate. In addition, such hybrid IC boards are housed in a case to protect mounted electronic components such as transistors, but this case is made of synthetic resin instead of metal to ensure electrical insulation between the inside and outside. has been done.
ところで、従来の収納ケースは第11図に示す
ように一方が開口された六角形状のケース本体1
と、このケース本体1の左右端に植設された取付
穴付ピン2a,2bと、前記ケース本体1に設け
られ、ハイブリツドIC用基板を固定するための
枠状段差部3とから構成されている。このような
構成のケース4に各種電子部品がマウントされた
ハイブリツド用基板を収納するには、同第11図
に示すように枠状に打抜いたエポキシ樹脂接着シ
ート5をケース4の枠状段差部3の水平面に固定
し、更に接着シート5にハイブリツドIC用基板
6の部品マウント面側を当接させ、この状態で加
圧しながら150〜160℃で3〜5時間保持して基板
6を接着シート5を介してケース4に固定、収納
する。しかしながら、こうした収納手段では以下
に示す種々の問題があつた。 By the way, a conventional storage case has a hexagonal case body 1 with one side open, as shown in FIG.
It consists of pins with mounting holes 2a and 2b planted in the left and right ends of the case body 1, and a frame-shaped step part 3 provided in the case body 1 for fixing the hybrid IC board. There is. In order to store a hybrid board on which various electronic components are mounted in the case 4 having such a structure, as shown in FIG. 3, and then the component mounting side of the hybrid IC board 6 is brought into contact with the adhesive sheet 5. In this state, the board 6 is bonded by holding it at 150 to 160°C for 3 to 5 hours while applying pressure. It is fixed and stored in the case 4 via the seat 5. However, these storage means have had various problems as described below.
接着シートの貼着、硬化処理等の繁雑な工程
を必要とするため、収納に多大な時間を要す
る。 Since it requires complicated steps such as pasting adhesive sheets and curing, it takes a lot of time to store it.
接着シートを熱硬化する工程が必要であるた
め、収納完了後のケースの変形が大きく、基板
をも変形し、ひいては基板にマウントされた各
種電子部品の接続信頼性に悪影響を及ぼす。 Since a step of thermosetting the adhesive sheet is required, the case is significantly deformed after storage, and the board is also deformed, which in turn adversely affects the connection reliability of various electronic components mounted on the board.
基板が収納されたケースを該基板側がシヤー
シ等に当接するように設置し、ケースの取付穴
付ピンから貫通させたネジによりシヤーシに取
付けた場合、基板の変形や反りにより該基板の
表面をシヤーシの表面全体に密接できなくなる
ため、充分な放熱性を確保できなくなる。 If a case containing a board is installed so that the board side is in contact with a chassis, etc., and is attached to the chassis using screws passed through the case's mounting hole pins, the surface of the board may be damaged due to deformation or warping of the board. Since the entire surface of the heat sink cannot be brought into close contact with the entire surface, sufficient heat dissipation cannot be ensured.
接着剤が基板のマウント面と反対側の面に回
る恐れがあり、基板の放熱性を阻害する。 There is a risk that the adhesive will spread to the surface of the board opposite to the mounting surface, which will impede the heat dissipation of the board.
基板をケースに対して比較的広い幅の接着シ
ートを介して収納するため、該シートが接着さ
れる基板周縁がデツドスペースとなり、基板上
のパターンとして使用できる領域が狭くなる。 Since the substrate is housed in the case via a relatively wide adhesive sheet, the periphery of the substrate to which the sheet is adhered becomes a dead space, and the area on the substrate that can be used as a pattern becomes narrow.
(考案が解決しようとする問題点)
本考案は、上記従来の問題点を一挙に解決する
ためになされたもので、接着シートを使用せず、
しかもハイブリツドIC用基板の変形を招くこと
なく簡単かつ確実に該基板を収納し得るケースを
提供しようとするものである。(Problems to be solved by the invention) The present invention was made to solve all of the above conventional problems at once.
Moreover, it is an object of the present invention to provide a case in which a hybrid IC substrate can be easily and reliably housed without causing deformation of the substrate.
[考案の構成]
(問題点を解決するための手段)
本考案は、放熱性を兼ねた金属板を主体とし、
複数の貫通孔を有するハイブリツドIC用基板を
収納するケースにおいて、一方が開口した断面コ
字形の合成樹脂製ケース本体と、このケース本体
の開口部と対向する内面に一体的にかつ互いに対
峙するように植設された複数の取付穴付ピンとを
具備し、前記各取付穴付ピンは前記ハイブリツド
IC用基板の貫通孔が圧入される先端部を他の部
分より小径にして該先端部とそれより下方の部分
の境界に段差部が形成され、更に前記先端部の外
周側面に前記基板の圧入時にその貫通孔内周面と
接触する少なくとも3つ以上の突起部を該先端部
の軸心に対して放射状にかつ該先端部の軸方向全
長に亙るように形成した構造としたことを特徴と
するハイブリツドIC用基板の収納ケースである。[Structure of the invention] (Means for solving the problems) The invention mainly consists of a metal plate that also has heat dissipation properties,
In a case for storing a hybrid IC board having multiple through holes, a synthetic resin case body with a U-shaped cross section with an opening on one side and an inner surface facing the opening of this case body are arranged so that they are integrated and facing each other. and a plurality of pins with mounting holes planted in the hybrid
The tip portion into which the through hole of the IC substrate is press-fitted is made smaller in diameter than other portions, and a stepped portion is formed at the boundary between the tip portion and the portion below it, and the substrate is further press-fitted into the outer circumferential side of the tip portion. It is characterized by having a structure in which at least three protrusions that contact the inner circumferential surface of the through hole are formed radially with respect to the axis of the tip and over the entire axial length of the tip. This is a storage case for hybrid IC boards.
(作用)
本考案によれば、合成樹脂製ケース本体の開口
部と対向する内面に複数の取付穴付ピンを一体的
にかつ互いに対峙するように植設し、各取付穴付
ピンの先端部を他の部分より小径にして該先端部
とそれより下方の部分の境界に段差部を形成し、
更に該先端部の外周側面に少なくとも3つ以上の
突起部を該先端部の軸心に対して放射状にかつ該
先端部の軸方向全長に亙るように形成し、前記取
付穴付ピンの突起部が形成された先端部にハイブ
リツドIC用基板の貫通孔を圧入することによつ
て、接着シートを使用せず、かつハイブリツド
IC用基板の変形を招くことなく簡単かつ確実に
基板を収納でき、しかも熱影響による合成樹脂製
のケースと基板との熱膨張係数の差に伴う該基板
の変形や反り発生を防止できる。(Function) According to the present invention, a plurality of pins with mounting holes are implanted integrally and facing each other on the inner surface facing the opening of the synthetic resin case body, and the tip of each pin with mounting holes is is made smaller in diameter than other parts, and a stepped part is formed at the boundary between the tip part and a part below it;
Furthermore, at least three or more protrusions are formed on the outer circumferential surface of the tip end radially with respect to the axis of the tip end and over the entire axial length of the tip end, and the protrusion portions of the pin with a mounting hole are formed. By press-fitting the through hole of the hybrid IC board into the tip where the
The IC board can be easily and reliably stored without deforming the board, and furthermore, the board can be prevented from being deformed or warped due to the difference in thermal expansion coefficient between the synthetic resin case and the board due to thermal effects.
(実施例)
以下、本考案の実施例を第1図〜第6図を参照
して詳細に説明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to FIGS. 1 to 6.
図中の11は、一方が開口された断面コ字形の
合成樹脂、例えばエポキシ樹脂からなるケース本
体である。このケース本体11における開口部1
2の縁部13には、収納されるハイブリツドIC
用基板の厚さと同高さの段差が形成されている。
前記ケース本体11の一側壁面には、収納される
ハイブリツドIC用基板の一端側を延出するため
の切欠部14が形成されている。前記ケース本体
11の開口部12と対向する内側壁面の短縁部付
近には、2つの取付穴付ピン151,152が該ケ
ース本体11に一体的にかつ互いに対峙するよう
に植設されている。これら取付穴付ピン151,
152は、第3図及び第4図に示すようにハイブ
リツド用基板の貫通孔が圧入される先端部161,
162を他の部分より小径にして前記本体11の
縁部13の段差部と同レベルとなる段差部171,
172が形成されている。前記先端部161,16
2の外周側面には、ハイブリツドIC用基板の貫通
孔内周面と接触される4つの突起部181,182
が該先端部161,162の軸心に対して放射状に
かつ該先端部161,162の軸方向の全長に亙る
ように形成されている。なお、各突起部181,
182における前記先端部161,162の外周側
面と反対側の端面は、該先端部161,162の接
線と平行となるように平坦となつている。 Reference numeral 11 in the figure is a case body made of synthetic resin, such as epoxy resin, and having a U-shaped cross section with one side open. Opening 1 in this case body 11
The hybrid IC to be stored is on the edge 13 of 2.
A step with the same height as the thickness of the substrate is formed.
A notch 14 is formed in one side wall surface of the case body 11 for extending one end of the hybrid IC substrate to be accommodated. Two pins with mounting holes 15 1 and 15 2 are implanted in the case body 11 integrally and facing each other near the short edge of the inner wall surface facing the opening 12 of the case body 11. ing. These pins with mounting holes 15 1 ,
15 2 is a tip portion 16 1 into which the through hole of the hybrid substrate is press-fitted, as shown in FIGS. 3 and 4.
16 2 is made smaller in diameter than the other portions, and a stepped portion 17 1 is at the same level as the stepped portion of the edge 13 of the main body 11;
17 2 is formed. The tip portions 16 1 , 16
Four protrusions 18 1 , 18 2 are provided on the outer circumferential side of the hybrid IC substrate 2 to make contact with the inner circumferential surface of the through hole of the hybrid IC substrate.
are formed radially with respect to the axes of the tip portions 16 1 , 16 2 and over the entire length of the tip portions 16 1 , 16 2 in the axial direction. In addition, each protrusion 18 1 ,
The end surfaces of the tip portions 16 1 , 16 2 at 18 2 on the side opposite to the outer circumferential surfaces are flat so as to be parallel to the tangents of the tip portions 16 1 , 16 2 .
また、前記ケース本体11の開口部と対向する
内側壁面のコーナ部付近には前記取付穴付ピン1
51,152より小径の4本の無空ピン191,1
94が該ケース本体11に一体的に植設されてい
る。これら無空ピン191〜194は、第5図及び
第6図に示すようにハイブリツドIC用基板の貫
通孔が圧入される先端部201,202〜204を
他の部分より小径にして前記本体11の縁部13
の段差部と同レベルとなる段差部211,212〜
214が形成されている。 Further, the mounting hole pin 1 is provided near the corner of the inner wall surface facing the opening of the case body 11.
5 1 , 4 empty pins with smaller diameter than 15 2 19 1 , 1
9 4 is integrally implanted in the case body 11. These hollow pins 19 1 to 19 4 have tip portions 20 1 , 20 2 to 20 4 into which the through holes of the hybrid IC substrate are press-fitted, as shown in FIGS. 5 and 6, with a smaller diameter than other portions. The edge 13 of the main body 11
The stepped portions 21 1 , 21 2 to be at the same level as the stepped portions of
21 4 is formed.
前記先端部201,202〜204の外周側面に
は、ハイブリツドIC用基板の貫通孔内周面と接
触される4つの突起部221,222〜224が該
先端部201,202〜204の軸心に対して放射
状にかつ該先端部201,202〜204の軸方向
の全長に亙るように形成されている。なお、各突
起部221,222〜224における前記先端部2
01,202〜204の外周側面と反対側の端面は、
該先端部201,202〜204の接線と平行とな
るように平坦となつている。 Four protrusions 22 1 , 22 2 - 22 4 that come into contact with the inner circumferential surface of the through hole of the hybrid IC substrate are provided on the outer circumferential side of the tip parts 20 1 , 20 2 - 20 4 . It is formed radially with respect to the axes 20 2 to 20 4 and over the entire length of the tip portions 20 1 and 20 2 to 20 4 in the axial direction. Note that the tip portion 2 of each protrusion 22 1 , 22 2 to 22 4
The end surface opposite to the outer peripheral side surface of 0 1 , 20 2 to 20 4 is
The tip portions 20 1 , 20 2 to 20 4 are flat and parallel to tangents.
しかして、本考案の収納ケースにハイブリツド
IC用基板を収納する手順を説明すると、まず、
第7図に示すハイブリツドIC用基板26を用意
する。このハイブリツドIC用基板26は、表面
にトランジスタ等の各種電子部品及び出力端子を
取付けるパターン23と配線(図示せず)が形成
され、かつケース本体11の取付穴付ピン151,
152に対応する箇所に夫々大貫通孔241,24
2が穿設され、ケース本体11の無空ピン191〜
194に対応する箇所に夫々小貫通孔251〜25
4が穿設された構造になつている。こうしたハイ
ブリツドIC用基板26のパターン23に所定の
各種電子部品をマウントし、基板26の周縁部を
ケース本体11の縁部13の段差部に該基板のパ
ターン23側がケース本体11の内側に位置する
ように当接させると共に、該基板26の大貫通孔
241,242をケース本体11の取付穴付ピン1
51,152の先端部161,162に、同基板26
の小貫通孔251〜254をケース本体11の無空
ピン191〜194の先端部201,202〜204に
夫々圧入すると、第8図に示すように基板26が
ケースに収納される。なお、ハイブリツドIC用
基板26をケースに収納することにより、ケース
本体11の切欠部14から基板26の一端側が延
出されるため、この延出部に図示しない端子が取
付けられる。 However, the storage case of this invention has a hybrid design.
To explain the procedure for storing IC boards, first,
A hybrid IC substrate 26 shown in FIG. 7 is prepared. This hybrid IC board 26 has a pattern 23 and wiring (not shown) for mounting various electronic components such as transistors and output terminals on its surface, and also has mounting hole pins 15 1 of the case body 11,
Large through holes 24 1 and 24 at locations corresponding to 15 2 , respectively.
2 are bored, and the empty pins 19 1 to 1 of the case body 11
Small through holes 25 1 to 25 at locations corresponding to 19 4
4 is perforated. Various predetermined electronic components are mounted on the pattern 23 of the hybrid IC board 26, and the peripheral edge of the board 26 is placed on the stepped part of the edge 13 of the case body 11, so that the pattern 23 side of the board is located inside the case body 11. At the same time, the large through holes 24 1 and 24 2 of the board 26 are brought into contact with the mounting hole pins 1 of the case body 11.
The same substrate 26 is attached to the tip portions 16 1 and 16 2 of 5 1 and 15 2 .
When the small through-holes 25 1 to 25 4 are press-fitted into the tips 20 1 and 20 2 to 20 4 of the empty pins 19 1 to 19 4 of the case body 11, respectively, the board 26 is attached to the case as shown in FIG. It will be stored. By housing the hybrid IC board 26 in the case, one end of the board 26 extends from the notch 14 of the case body 11, and a terminal (not shown) is attached to this extended part.
上述したハイブリツドIC用基板26の収納に
際して、ケース本体11の取付穴付ピン151,
152及び無空ピン191〜194は夫々ハイブリ
ツドIC用基板26の厚さと同一の高さの段差部
171,172,211,212〜214を有するた
め、該基板26はケース本体11の縁部13から
突出することなく、基板26面と縁部13の端面
とが面一な状態でケース本体11に収納できる。 When storing the hybrid IC board 26 described above, the mounting hole pins 15 1 ,
15 2 and empty pins 19 1 to 19 4 each have stepped portions 17 1 , 17 2 , 21 1 , 21 2 to 21 4 having the same height as the thickness of the hybrid IC substrate 26, so that the substrate 26 is The substrate 26 can be stored in the case body 11 in a state where the surface of the board 26 and the end face of the edge 13 are flush without protruding from the edge 13 of the case body 11.
また、ケース本体11の取付穴付ピン151,
152における先端部161,162の外周側面に
はその接線と平行した4つの平坦な突起部181,
182が設けられ、かつ無空ピン191〜194に
おける先端部201,202〜204の外周側面に
その接線と平行した4つの平坦な突起部221,
222〜224が設けられている。しかるに、ケー
ス本体11の取付穴付ピン151,152の先端部
161,162にハイブリツドIC用基板26の大貫
通孔241,242を、無空ピン191〜194の先
端部201,202〜204に該基板26の小貫通
孔251〜254を、夫々圧入すると、第9図及び
第10図に示すように各貫通孔241,242,2
51〜254の内周面は各ピン151,152,191
〜194の先端部161,162,201,202〜2
04に設けられた突起部181,182,221,2
22〜224に接触されるため、これら突起部18
1,182,221,222〜224の弾性作用により
各ピン151,152,191〜194と貫通孔24
1,242,251〜254との食付きが増大し、基
板26をケースに強固に収納できる。事実、ケー
ス本体11に植設した取付穴付ピン151,15
2、無空ピン191〜194の位置精度を±0.1mm、
基板26の大貫通孔241,242、小貫通孔25
1〜254野位置精度を±0.15mmにした場合、各貫
通孔241,242,251〜254に対する各ピン
151,152,191〜194の突起部181,18
2,221,222〜224を含んだ先端部161,1
62,201,202〜204の径を0〜0.1mm程度と
すれば充分な強度でハイブリツドIC用基板26
をケースに収納できた。 In addition, a pin with a mounting hole 15 1 of the case body 11,
On the outer circumferential side of the tips 16 1 and 16 2 in 15 2 , there are four flat protrusions 18 1 parallel to the tangents thereof.
18 2 , and four flat protrusions 22 1 parallel to the tangents on the outer peripheral side surfaces of the tips 20 1 , 20 2 to 20 4 of the empty pins 19 1 to 19 4 ,
22 2 to 22 4 are provided. However, the large through holes 24 1 , 24 2 of the hybrid IC board 26 are inserted into the tips 16 1 , 16 2 of the pins 15 1 , 15 2 with mounting holes of the case body 11 , and the tips of the empty pins 19 1 to 19 4 are inserted into the large through holes 24 1 , 24 2 of the hybrid IC board 26 . When the small through holes 25 1 to 25 4 of the substrate 26 are press-fitted into the parts 20 1 , 20 2 to 20 4 , the through holes 24 1 , 24 2 , 2 are formed as shown in FIGS. 9 and 10.
The inner peripheral surfaces of 5 1 to 25 4 are each pin 15 1 , 15 2 , 19 1
〜19 4 tip portions 16 1 , 16 2 , 20 1 , 20 2 〜2
Projections 18 1 , 18 2 , 22 1 , 2 provided on 0 4
2 2 to 22 4 , these protrusions 18
Each pin 15 1 , 15 2 , 19 1 to 19 4 and the through hole 24 due to the elastic action of 1 , 18 2 , 22 1 , 22 2 to 22 4
1 , 24 2 , 25 1 to 25 4 is increased, and the board 26 can be firmly housed in the case. In fact, the pins with mounting holes 15 1 , 15 implanted in the case body 11
2. The positional accuracy of empty pins 191 to 194 is ±0.1mm,
Large through holes 24 1 , 24 2 and small through holes 25 of substrate 26
When the position accuracy of 1 to 25 4 is ±0.15 mm, the projections 18 1 , 18 of each pin 15 1 , 15 2 , 19 1 to 19 4 for each through hole 24 1 , 24 2 , 25 1 to 25 4
Tip part 16 1 , 1 including 2 , 22 1 , 22 2 to 22 4
If the diameter of 6 2 , 20 1 , 20 2 to 20 4 is about 0 to 0.1 mm, the hybrid IC substrate 26 will have sufficient strength.
could be stored in the case.
更に、収納完了後のハイブリツドICの自己発
熱による温度サイクル変化を受けた場合、熱膨張
係数の異なるアルミニウム製の基板26とエポキ
シ樹脂製のケースとが膨張するが、ケース本体1
1に植設した取付穴付ピン151,152、無空ピ
ン191〜194はそれ自体弾力性を有すると共
に、各ピン151,152,191〜194の先端部
161,162,201,202〜204の外周側面に
は突起部181,182,221,222〜224が設
けられ、各ピン151,152,191〜194の先
端部161,162,201,202〜204とこれら
先端部161,162,201,202〜204に圧入
された基板26の大貫通孔241,242、小貫通
孔251〜254の間には前記突起部181,18
2,221,222〜224の介在により隙間が形成
されている。その結果、前記基板26とケースと
の間の熱膨張差を、各ピン151,152,191
〜194の弾性力及び各ピン151,152,191
〜194の先端部161,162,201,202〜2
04と各貫通孔241,242,251〜254の間の
隙間で吸収でき、基板26の変形、反り発生等を
防止できる。事実、130℃、1000時間の加熱冷却
テスト〔(−30℃;30分間)・(25℃;5分間)・
(130℃;30分間)〕において、基板26の変形、
反り発生等の異常は全く認められなかつた。 Furthermore, when the hybrid IC undergoes a temperature cycle change due to self-heating after storage is completed, the aluminum substrate 26 and the epoxy resin case, which have different coefficients of thermal expansion, expand, but the case body 1
The pins with mounting holes 15 1 , 15 2 and empty pins 19 1 to 19 4 implanted in 1 have elasticity themselves, and the tip portions 16 1 of each pin 15 1 , 15 2 , 19 1 to 19 4 , 16 2 , 20 1 , 20 2 to 20 4 are provided with projections 18 1 , 18 2 , 22 1 , 22 2 to 22 4 on the outer circumferential side surfaces of each pin 15 1 , 15 2 , 19 1 to 19 4 . and the large through holes 24 1 , 24 2 of the substrate 26 press-fitted into the tip portions 16 1 , 16 2 , 20 1 , 20 2 to 20 4 and the tip portions 16 1 , 16 2 , 20 1 , 20 2 to 20 4 , the projections 18 1 , 18 are located between the small through holes 25 1 to 25 4 .
2 , 22 1 , 22 2 to 22 4 are interposed to form gaps. As a result, the difference in thermal expansion between the substrate 26 and the case can be reduced by each pin 15 1 , 15 2 , 19 1
~19 4 elastic force and each pin 15 1 , 15 2 , 19 1
〜19 4 tip portions 16 1 , 16 2 , 20 1 , 20 2 〜2
0 4 and each of the through holes 24 1 , 24 2 , 25 1 to 25 4 can absorb the heat, thereby preventing the substrate 26 from deforming or warping. In fact, heating and cooling tests at 130℃ for 1000 hours [(-30℃; 30 minutes), (25℃; 5 minutes),
(130°C; 30 minutes)], deformation of the substrate 26,
No abnormalities such as occurrence of warping were observed.
従つて、本考案のハイブリツドIC用基板の収
納ケースは次のように種々の効果を奏する。 Therefore, the hybrid IC substrate storage case of the present invention has various effects as described below.
(イ) 接着シートを使用せずに圧入方式によりハイ
ブリツドIC用基板をケースに収納できるため、
ケース、収納操作を著しく簡便にできると共
に、ケース、基板の回収も可能となる。(a) The hybrid IC board can be stored in the case by press-fitting without using an adhesive sheet.
The case and storage operation can be made extremely simple, and the case and the board can also be collected.
(ロ) 収納完了後の熱影響による基板の変形を防止
でき、基板にマウントされたトランジスタ等の
電子部品の接続信頼性を向上できる。(b) It is possible to prevent deformation of the board due to thermal effects after storage is completed, and it is possible to improve the connection reliability of electronic components such as transistors mounted on the board.
(ハ) ハイブリツドIC用基板が収納されたケース
をシヤーシ等に該基板の表面(各種電子部品の
マウント面と反対側の面)ががいシヤーシ表面
に当接するように設置し、ケース本体の取付穴
付ピンから貫通させたネジによりシヤーシに取
付けた場合、基板がケース本体の縁部端面と面
一で変形や反りもないため、基板をシヤーシ表
面全体に密接でき、良好な放熱性を確保でき
る。(c) Place the case containing the hybrid IC board on a chassis, etc., so that the surface of the board (the surface opposite to the mounting surface of various electronic components) is in contact with the chassis surface, and make the mounting holes in the case body. When attached to the chassis with screws passed through the attached pins, the board is flush with the edge end face of the case body and does not deform or warp, so the board can be closely attached to the entire chassis surface and good heat dissipation can be ensured.
(ニ) ケース本体に植設された取付穴付ピン及び無
空ピンの先端部に、ハイブリツドIC用基板の
貫通孔に圧入して収納するため、ケース本体の
開口部の縁部に形成された段差の幅を狭くでき
るため、基板の周縁部がケース本体に当接する
面積(デツドスペース)を縮小でき、基板上の
パターンとして使用できる領域を広くできる。(d) The tips of the pins with mounting holes and the empty pins embedded in the case body are press-fitted into the through-holes of the hybrid IC board, and the pins are formed at the edge of the opening of the case body. Since the width of the step can be narrowed, the area where the peripheral edge of the board contacts the case body (dead space) can be reduced, and the area on the board that can be used as a pattern can be expanded.
なお、上記実施例ではケース本体に植設した取
付穴付ピン及び無空ピンの先端部の外周側面に4
つの突起部を設けたが、これに限定されず、3つ
又は5つ以上設けてもよい。また、突起部の形状
については球状、三角柱状等任意でよい。 In addition, in the above embodiment, there are
Although three protrusions are provided, the present invention is not limited to this, and three or five or more protrusions may be provided. Further, the shape of the protrusion may be arbitrary, such as spherical or triangular prism.
[考案の効果]
以上詳述した如く、本考案のハイブリツドIC
用基板の収納ケースによれば接着シートを使用せ
ず、ハイブリツド用基板の変形を招くことなく簡
便かつ確実に該基板を収納できると共に、収納完
了後の熱影響による基板の変形、反りを防止で
き、シヤーシ等への取付け時に該基板をシヤーシ
の表面全体に密接することが可能となり良好な放
熱性を確保できる等顕著な効果を有する。[Effects of the invention] As detailed above, the hybrid IC of the invention
According to the storage case for the hybrid circuit board, it is possible to store the hybrid circuit board simply and reliably without using an adhesive sheet, without causing deformation of the hybrid circuit board, and to prevent the board from deforming or warping due to heat effects after storage is completed. , when attached to a chassis etc., it is possible to bring the substrate into close contact with the entire surface of the chassis, resulting in remarkable effects such as ensuring good heat dissipation.
第1図は本考案の一実施例を示すハイブリツド
IC用基板の収納ケースを示す平面図、第2図は
第1図の収納ケースの側面図、第3図は第1図の
−線に沿う断面図、第4図は第3図の取付穴
付ピンの平面図、第5図は第1図の−線に沿
う断面図、第6図は第5図の無空ピンの平面図、
第7図は収納されるべきハイブリツドIC用基板
を示す平面図、第8図はケースにハイブリツド
IC用基板を収納した状態を示す斜視図、第9図
は第8図の−線に沿う断面図、第10図は第
8図の−線に沿う断面図、第11図は従来の
ケースにハイブリツドIC用基板を収納した状態
を示す斜視図である。
11……エポキシ樹脂製のケース本体、12…
…開口部、151,152……取付穴付ピン、16
1,162,201,202〜204……先端部、17
1,172,211,212〜214……段差部、18
1,182,221,222〜224……突起部、19
1〜194……無空ピン、241,242……大貫通
孔、251〜254……小貫通孔、26……ハイブ
リツドIC用基板。
Figure 1 shows a hybrid system showing an embodiment of the present invention.
A plan view showing the IC board storage case, Figure 2 is a side view of the storage case shown in Figure 1, Figure 3 is a sectional view taken along the - line in Figure 1, and Figure 4 shows the mounting holes shown in Figure 3. A plan view of the attached pin, FIG. 5 is a sectional view taken along the - line in FIG. 1, and FIG. 6 is a plan view of the empty pin in FIG. 5.
Figure 7 is a plan view showing the hybrid IC board to be stored, and Figure 8 is the hybrid IC board to be stored in the case.
A perspective view showing the state in which the IC board is housed, Figure 9 is a sectional view taken along the - line in Figure 8, Figure 10 is a sectional view taken along the - line in Figure 8, and Figure 11 is a conventional case. FIG. 2 is a perspective view showing a state in which a hybrid IC substrate is housed. 11... Case body made of epoxy resin, 12...
…Opening, 15 1 , 15 2 … Pin with mounting hole, 16
1 , 16 2 , 20 1 , 20 2 to 20 4 ... tip, 17
1 , 17 2 , 21 1 , 21 2 to 21 4 ... step portion, 18
1 , 18 2 , 22 1 , 22 2 to 22 4 ...Protrusion, 19
1 to 19 4 ... blank pin, 24 1 , 24 2 ... large through hole, 25 1 to 25 4 ... small through hole, 26 ... hybrid IC substrate.
Claims (1)
孔を有するハイブリツドIC用基板を収納するケ
ースにおいて、一方が開口した断面コ字形の合成
樹脂製ケース本体と、このケース本体の開口部と
対向する内面に一体的にかつ互いに対峙するよう
に植設された複数の取付穴付ピンとを具備し、前
記各取付穴付ピンは前記ハイブリツドIC用基板
の貫通孔が圧入される先端部を他の部分より小径
にして該先端部とそれより下方の部分の境界に段
差部が形成され、更に前記先端部の外周側面に前
記基板の圧入時にその貫通孔内周面と接触する少
なくとも3つ以上の突起部を該先端部の軸心に対
して放射状にかつ該先端部の軸方向全長に亙るよ
うに形成した構造としたことを特徴とするハイブ
リツドIC用基板の収納ケース。 In a case that houses a hybrid IC board that is mainly made of a metal plate that also serves as a heat dissipator and has multiple through holes, a synthetic resin case body with a U-shaped cross section with an opening on one side faces the opening of the case body. A plurality of pins with mounting holes are embedded integrally and facing each other on the inner surface of the hybrid IC substrate, and each of the pins with mounting holes has a tip portion into which a through hole of the hybrid IC substrate is press-fitted. A stepped portion is formed at the boundary between the tip portion and a portion below the tip portion, and furthermore, at least three step portions are formed on the outer circumferential side of the tip portion to be in contact with the inner circumferential surface of the through hole when the substrate is press-fitted. 1. A storage case for a hybrid IC substrate, characterized in that the protrusion is formed radially with respect to the axis of the tip and extends over the entire length of the tip in the axial direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987134170U JPS645914Y2 (en) | 1987-09-02 | 1987-09-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987134170U JPS645914Y2 (en) | 1987-09-02 | 1987-09-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6349286U JPS6349286U (en) | 1988-04-04 |
JPS645914Y2 true JPS645914Y2 (en) | 1989-02-14 |
Family
ID=31035163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987134170U Expired JPS645914Y2 (en) | 1987-09-02 | 1987-09-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS645914Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6459687B2 (en) * | 2015-03-24 | 2019-01-30 | 日本精機株式会社 | In-vehicle display device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4873250U (en) * | 1971-12-15 | 1973-09-12 | ||
JPS5418606Y2 (en) * | 1975-01-30 | 1979-07-12 | ||
JPS51160526U (en) * | 1975-06-14 | 1976-12-21 |
-
1987
- 1987-09-02 JP JP1987134170U patent/JPS645914Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6349286U (en) | 1988-04-04 |
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