JPS6457996A - Gold alloy filler metal - Google Patents
Gold alloy filler metalInfo
- Publication number
- JPS6457996A JPS6457996A JP21415987A JP21415987A JPS6457996A JP S6457996 A JPS6457996 A JP S6457996A JP 21415987 A JP21415987 A JP 21415987A JP 21415987 A JP21415987 A JP 21415987A JP S6457996 A JPS6457996 A JP S6457996A
- Authority
- JP
- Japan
- Prior art keywords
- filler metal
- gold alloy
- alloy filler
- flowability
- effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To lower a liquid phase temp. and to enable brazing at a low temp. by specifying the contents of Ag, Cu, Zn, Ga, and Sn in a gold alloy filler metal. CONSTITUTION:The component compsn. of the gold alloy filler metal is specified, by weight %, to 35-60wt.% Au, 8-35% Ag, 10-30% Cu, 5-15% Zn, 0.5-10% Ga, and 0.5-10% Sn. The reason for limiting the component compsn. is to confine Au to a 35-60wt.% range in order to obtain K9-K14 gold alloy filler metal. Ag contributes to an improvement in flowability and brazing strength. There is no effect at <8wt.% and the increase of the m.p. is high when the content exceeds 35wt.%. Zn lowers the m.p. of the gold alloy filler metal and improves the flowability thereof. The effect of lowering the m.p. is low at <5wt.% and the brazing strength is degraded if the content exceeds 15wt.%. Ga; Sn lower the m.p. of the gold alloy filler metal and improve the flowability thereof. There is no effect at <0.5wt.% and the embrittlement increases to degrade the strength when the content exceeds 10wt.%. 0.5-10% In is incorporated into this gold alloy filler metal at need.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21415987A JPS6457996A (en) | 1987-08-29 | 1987-08-29 | Gold alloy filler metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21415987A JPS6457996A (en) | 1987-08-29 | 1987-08-29 | Gold alloy filler metal |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6457996A true JPS6457996A (en) | 1989-03-06 |
Family
ID=16651209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21415987A Pending JPS6457996A (en) | 1987-08-29 | 1987-08-29 | Gold alloy filler metal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6457996A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4323227C1 (en) * | 1993-07-12 | 1994-07-28 | Degussa | Cadmium-free silver alloy used as solder at temps. below 630 deg.C. |
CN102211259A (en) * | 2011-05-20 | 2011-10-12 | 杭州普励精密器材有限公司 | Method for preparing environmentally-friendly copper-base compound surface skirting line |
EP2756914A1 (en) * | 2013-01-18 | 2014-07-23 | Umicore AG & Co. KG | Solder alloy |
JP2020105614A (en) * | 2018-12-28 | 2020-07-09 | 重靖 成瀬 | K10 gold alloy for jewelry |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52139620A (en) * | 1976-05-18 | 1977-11-21 | Ishifuku Metal Ind | Gold blazing alloy |
JPS5691999A (en) * | 1979-12-25 | 1981-07-25 | Mitsubishi Metal Corp | Hard gold-alloy soldering material |
JPS5698436A (en) * | 1979-12-11 | 1981-08-07 | Seiko Epson Corp | Gold solder |
JPS5722896A (en) * | 1980-07-11 | 1982-02-05 | Mitsubishi Metal Corp | Hard au alloy brazing material containing less au and having low melting point |
JPS58202995A (en) * | 1982-05-21 | 1983-11-26 | Sankin Kogyo Kk | Brazing alloy of low karat gold having golden color |
-
1987
- 1987-08-29 JP JP21415987A patent/JPS6457996A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52139620A (en) * | 1976-05-18 | 1977-11-21 | Ishifuku Metal Ind | Gold blazing alloy |
JPS5698436A (en) * | 1979-12-11 | 1981-08-07 | Seiko Epson Corp | Gold solder |
JPS5691999A (en) * | 1979-12-25 | 1981-07-25 | Mitsubishi Metal Corp | Hard gold-alloy soldering material |
JPS5722896A (en) * | 1980-07-11 | 1982-02-05 | Mitsubishi Metal Corp | Hard au alloy brazing material containing less au and having low melting point |
JPS58202995A (en) * | 1982-05-21 | 1983-11-26 | Sankin Kogyo Kk | Brazing alloy of low karat gold having golden color |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4323227C1 (en) * | 1993-07-12 | 1994-07-28 | Degussa | Cadmium-free silver alloy used as solder at temps. below 630 deg.C. |
CN102211259A (en) * | 2011-05-20 | 2011-10-12 | 杭州普励精密器材有限公司 | Method for preparing environmentally-friendly copper-base compound surface skirting line |
EP2756914A1 (en) * | 2013-01-18 | 2014-07-23 | Umicore AG & Co. KG | Solder alloy |
CN104411450A (en) * | 2013-01-18 | 2015-03-11 | 优美科股份公司及两合公司 | Alloys |
CN104411450B (en) * | 2013-01-18 | 2018-06-15 | 优美科股份公司及两合公司 | Alloy |
JP2020105614A (en) * | 2018-12-28 | 2020-07-09 | 重靖 成瀬 | K10 gold alloy for jewelry |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0858859A4 (en) | Solder for electronic part bonding electrodes, and soldering method | |
EP0116844A3 (en) | Copper alloys for suppressing growth of cu-al intermetallic compounds | |
PL342107A1 (en) | Cadmium-free brazing alloy and method of brazing hard metals | |
CA2135790A1 (en) | Low density, high strength al-li alloy having high toughness at elevated temperatures | |
JPS6457996A (en) | Gold alloy filler metal | |
JPS6462296A (en) | Gold brazing alloy | |
GB709527A (en) | Improvements relating to aluminium-base copper-containing alloys and the heat treatment thereof | |
WO1996013617B1 (en) | Machineable aluminum alloys containing in and sn and process for producing the same | |
JPS6457997A (en) | Gold alloy filler metal | |
US4252562A (en) | Alloy for brazing titanium | |
AU633644B2 (en) | Soldering alloy for dental and jewellery parts | |
CN85102207A (en) | In cast aluminium alloy, add the method for alloying element tellurium | |
JPS5770099A (en) | Gold brazing filler metal | |
JPS57108235A (en) | Copper alloy for lead frame | |
JPS6468440A (en) | Corrosion-resistant aluminum alloy | |
JPS5767142A (en) | Low-temperature aluminum solder | |
JPS54103764A (en) | Brazing material | |
JPS5698436A (en) | Gold solder | |
JPS6431591A (en) | Gold filler metal for brazing | |
JPS572858A (en) | Aluminum alloy for casting with high pressure resistance | |
JPS57127595A (en) | Silver solder | |
JPS57110646A (en) | High-purity aluminum alloy foil for anode of electrolytic capacitor | |
JPS558326A (en) | Submerged arc welding method of steel for cryogenic temperature service | |
St Amand | Preparation, thermal and structural properties of metallic glasses containing calcium. | |
JPS57115997A (en) | Low melting point cu-ag alloy brazing filler metal of good wettability |