JPS6457996A - Gold alloy filler metal - Google Patents

Gold alloy filler metal

Info

Publication number
JPS6457996A
JPS6457996A JP21415987A JP21415987A JPS6457996A JP S6457996 A JPS6457996 A JP S6457996A JP 21415987 A JP21415987 A JP 21415987A JP 21415987 A JP21415987 A JP 21415987A JP S6457996 A JPS6457996 A JP S6457996A
Authority
JP
Japan
Prior art keywords
filler metal
gold alloy
alloy filler
flowability
effect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21415987A
Other languages
Japanese (ja)
Inventor
Takashi Nara
Takashi Daigo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuriki Honten Co Ltd
Original Assignee
Tokuriki Honten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuriki Honten Co Ltd filed Critical Tokuriki Honten Co Ltd
Priority to JP21415987A priority Critical patent/JPS6457996A/en
Publication of JPS6457996A publication Critical patent/JPS6457996A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To lower a liquid phase temp. and to enable brazing at a low temp. by specifying the contents of Ag, Cu, Zn, Ga, and Sn in a gold alloy filler metal. CONSTITUTION:The component compsn. of the gold alloy filler metal is specified, by weight %, to 35-60wt.% Au, 8-35% Ag, 10-30% Cu, 5-15% Zn, 0.5-10% Ga, and 0.5-10% Sn. The reason for limiting the component compsn. is to confine Au to a 35-60wt.% range in order to obtain K9-K14 gold alloy filler metal. Ag contributes to an improvement in flowability and brazing strength. There is no effect at <8wt.% and the increase of the m.p. is high when the content exceeds 35wt.%. Zn lowers the m.p. of the gold alloy filler metal and improves the flowability thereof. The effect of lowering the m.p. is low at <5wt.% and the brazing strength is degraded if the content exceeds 15wt.%. Ga; Sn lower the m.p. of the gold alloy filler metal and improve the flowability thereof. There is no effect at <0.5wt.% and the embrittlement increases to degrade the strength when the content exceeds 10wt.%. 0.5-10% In is incorporated into this gold alloy filler metal at need.
JP21415987A 1987-08-29 1987-08-29 Gold alloy filler metal Pending JPS6457996A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21415987A JPS6457996A (en) 1987-08-29 1987-08-29 Gold alloy filler metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21415987A JPS6457996A (en) 1987-08-29 1987-08-29 Gold alloy filler metal

Publications (1)

Publication Number Publication Date
JPS6457996A true JPS6457996A (en) 1989-03-06

Family

ID=16651209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21415987A Pending JPS6457996A (en) 1987-08-29 1987-08-29 Gold alloy filler metal

Country Status (1)

Country Link
JP (1) JPS6457996A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4323227C1 (en) * 1993-07-12 1994-07-28 Degussa Cadmium-free silver alloy used as solder at temps. below 630 deg.C.
CN102211259A (en) * 2011-05-20 2011-10-12 杭州普励精密器材有限公司 Method for preparing environmentally-friendly copper-base compound surface skirting line
EP2756914A1 (en) * 2013-01-18 2014-07-23 Umicore AG & Co. KG Solder alloy
JP2020105614A (en) * 2018-12-28 2020-07-09 重靖 成瀬 K10 gold alloy for jewelry

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139620A (en) * 1976-05-18 1977-11-21 Ishifuku Metal Ind Gold blazing alloy
JPS5691999A (en) * 1979-12-25 1981-07-25 Mitsubishi Metal Corp Hard gold-alloy soldering material
JPS5698436A (en) * 1979-12-11 1981-08-07 Seiko Epson Corp Gold solder
JPS5722896A (en) * 1980-07-11 1982-02-05 Mitsubishi Metal Corp Hard au alloy brazing material containing less au and having low melting point
JPS58202995A (en) * 1982-05-21 1983-11-26 Sankin Kogyo Kk Brazing alloy of low karat gold having golden color

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139620A (en) * 1976-05-18 1977-11-21 Ishifuku Metal Ind Gold blazing alloy
JPS5698436A (en) * 1979-12-11 1981-08-07 Seiko Epson Corp Gold solder
JPS5691999A (en) * 1979-12-25 1981-07-25 Mitsubishi Metal Corp Hard gold-alloy soldering material
JPS5722896A (en) * 1980-07-11 1982-02-05 Mitsubishi Metal Corp Hard au alloy brazing material containing less au and having low melting point
JPS58202995A (en) * 1982-05-21 1983-11-26 Sankin Kogyo Kk Brazing alloy of low karat gold having golden color

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4323227C1 (en) * 1993-07-12 1994-07-28 Degussa Cadmium-free silver alloy used as solder at temps. below 630 deg.C.
CN102211259A (en) * 2011-05-20 2011-10-12 杭州普励精密器材有限公司 Method for preparing environmentally-friendly copper-base compound surface skirting line
EP2756914A1 (en) * 2013-01-18 2014-07-23 Umicore AG & Co. KG Solder alloy
CN104411450A (en) * 2013-01-18 2015-03-11 优美科股份公司及两合公司 Alloys
CN104411450B (en) * 2013-01-18 2018-06-15 优美科股份公司及两合公司 Alloy
JP2020105614A (en) * 2018-12-28 2020-07-09 重靖 成瀬 K10 gold alloy for jewelry

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