JPS6457792A - Forming method for small-diameter through hole with fine land of printed board - Google Patents

Forming method for small-diameter through hole with fine land of printed board

Info

Publication number
JPS6457792A
JPS6457792A JP21613087A JP21613087A JPS6457792A JP S6457792 A JPS6457792 A JP S6457792A JP 21613087 A JP21613087 A JP 21613087A JP 21613087 A JP21613087 A JP 21613087A JP S6457792 A JPS6457792 A JP S6457792A
Authority
JP
Japan
Prior art keywords
land
hole
small
diameter
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21613087A
Other languages
Japanese (ja)
Inventor
Keiichi Asakawa
Shinichi Niijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP21613087A priority Critical patent/JPS6457792A/en
Publication of JPS6457792A publication Critical patent/JPS6457792A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE:To reduce a land shape by filling ink in a small-diameter through hole having a fine land to enhance development resistance and etching property, then forming the shape of the land in a deformed elliptical or triangular shape, and providing a contact reinforced part of a photosensitive resin film for a board. CONSTITUTION:Ink 5 is filled in a small-diameter through hole 2 formed in the material 1 of a printed board, a copper foil 9 before molding a land pattern on the surface of the material 1 is coated with a photosensitive resin film 4, a circular protrusion 7 is formed on the circular land 6 on an original picture mask pattern to be formed in a deformed elliptical shape, or the protrusion 7 or an inner curved part 8 is formed to be in a deformed triangular shape, and an original picture mask pattern formed in advance with the contact rein forced part 7 of the film 4 is printed on the printed board. Even if the land area is very small, the hole 2 is protected therein by the ink 5, and the contact of the land 3 is strengthened. Accordingly, it can endure against solution spraying in developing and etching works, and the hole 2 having the land 3 can be formed.
JP21613087A 1987-08-28 1987-08-28 Forming method for small-diameter through hole with fine land of printed board Pending JPS6457792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21613087A JPS6457792A (en) 1987-08-28 1987-08-28 Forming method for small-diameter through hole with fine land of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21613087A JPS6457792A (en) 1987-08-28 1987-08-28 Forming method for small-diameter through hole with fine land of printed board

Publications (1)

Publication Number Publication Date
JPS6457792A true JPS6457792A (en) 1989-03-06

Family

ID=16683731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21613087A Pending JPS6457792A (en) 1987-08-28 1987-08-28 Forming method for small-diameter through hole with fine land of printed board

Country Status (1)

Country Link
JP (1) JPS6457792A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5832599A (en) * 1995-03-15 1998-11-10 Northrop Grumman Corporation Method of interfacing detector array layers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56140696A (en) * 1980-04-04 1981-11-04 Sony Corp Method of manufacturing circuit board
JPS574263B2 (en) * 1978-03-31 1982-01-25
JPS58100493A (en) * 1981-12-10 1983-06-15 東京応化工業株式会社 Method of producing through hole printed circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574263B2 (en) * 1978-03-31 1982-01-25
JPS56140696A (en) * 1980-04-04 1981-11-04 Sony Corp Method of manufacturing circuit board
JPS58100493A (en) * 1981-12-10 1983-06-15 東京応化工業株式会社 Method of producing through hole printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5832599A (en) * 1995-03-15 1998-11-10 Northrop Grumman Corporation Method of interfacing detector array layers

Similar Documents

Publication Publication Date Title
US3438127A (en) Manufacture of circuit modules using etched molds
JPS57161743A (en) Method of applying resist pattern on substrate and resist material mixture
JPS6457792A (en) Forming method for small-diameter through hole with fine land of printed board
KR940005202A (en) Manufacturing method of printed wiring board
KR950016485A (en) Metal mask and manufacturing method thereof
JPS5538051A (en) Through-hole forming method of resin film
JPS57136652A (en) Manufacture of sealing material
KR970032314A (en) Circuit Board Manufacturing Method
JPS649696A (en) Resin molding with circuit
JPS57178810A (en) Manufacture of molding die
JP3290907B2 (en) Method for manufacturing surface convex printed body
JPS57185981A (en) Manufacture of die for molding
JPS56156792A (en) Thickly plating method
JPS56144773A (en) Production of floor material
JPS5532662A (en) Stamp compound
JPS6447476A (en) Method for imparting electric conductivity to plastic molded body
JPH04174586A (en) Printed wiring board
JPS5586769A (en) Ink jet recording head
JPS556429A (en) Selective ethching method
JPH0782232B2 (en) Printing resin letterpress material and method for producing letterpress using the same
JPS6469094A (en) Pattern forming method
JPS5728637A (en) Manufacture of die for circuit punching
KR900005919A (en) Cosmetic Filling Container
JPS55141733A (en) Method for coating film-carrier part installed on printed circuit board
JPS6449299A (en) Manufacture of printed-circuit board