JPS6457736A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS6457736A
JPS6457736A JP21431187A JP21431187A JPS6457736A JP S6457736 A JPS6457736 A JP S6457736A JP 21431187 A JP21431187 A JP 21431187A JP 21431187 A JP21431187 A JP 21431187A JP S6457736 A JPS6457736 A JP S6457736A
Authority
JP
Japan
Prior art keywords
wiring
integrated circuit
system clock
chip
whole surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21431187A
Other languages
Japanese (ja)
Inventor
Takashi Totoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21431187A priority Critical patent/JPS6457736A/en
Publication of JPS6457736A publication Critical patent/JPS6457736A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To lay out wirings for other signals easily by assigning a wiring as an uppermost layer formed onto approximately the whole surface of a chip as a wiring for an arbitrary signal such as a system clock in a semiconductor integrated circuit with multilayer metallic interconnections. CONSTITUTION:In a CMOS integrated circuit having three-layer aluminum wiring structure, an aluminum wiring 21 as an uppermost layer is evaporated and formed onto approximately the whole surface on a chip, assigned as a wiring such as a system clock wiring, and brought into contact with a signal wiring 19 requiring clock supply in second layer wirings. Since the wiring resistance of the metallic wiring 21 shaped onto approximately the whole surface on the chip is reduced extremely, the metallic wiring 21 is particularly proper when it is used as the system clock wiring, etc., supplying a system clock for synchronously operating the whole integrated circuit.
JP21431187A 1987-08-28 1987-08-28 Semiconductor integrated circuit Pending JPS6457736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21431187A JPS6457736A (en) 1987-08-28 1987-08-28 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21431187A JPS6457736A (en) 1987-08-28 1987-08-28 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS6457736A true JPS6457736A (en) 1989-03-06

Family

ID=16653642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21431187A Pending JPS6457736A (en) 1987-08-28 1987-08-28 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS6457736A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206273A (en) * 1991-11-14 1993-08-13 Nec Corp Semiconductor integrated circuit
US5446410A (en) * 1992-04-20 1995-08-29 Matsushita Electric Industrial Co.,Ltd. Semiconductor integrated circuit
JPH11175184A (en) * 1997-12-12 1999-07-02 Fujitsu Ltd Clock distributing circuit for semiconductor integrated circuit
DE10104233A1 (en) * 2001-01-31 2002-08-22 Tech Uni Muenchen Lehrstuhl Fu Line layout method for wiring plane for integrated semiconductor device positions lines in wiring plane in order of their circuit activity

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206273A (en) * 1991-11-14 1993-08-13 Nec Corp Semiconductor integrated circuit
US5446410A (en) * 1992-04-20 1995-08-29 Matsushita Electric Industrial Co.,Ltd. Semiconductor integrated circuit
USRE36278E (en) * 1992-04-20 1999-08-24 Matsushita Electric Industrial Co.,Ltd. Semiconductor integrated circuit
JPH11175184A (en) * 1997-12-12 1999-07-02 Fujitsu Ltd Clock distributing circuit for semiconductor integrated circuit
DE10104233A1 (en) * 2001-01-31 2002-08-22 Tech Uni Muenchen Lehrstuhl Fu Line layout method for wiring plane for integrated semiconductor device positions lines in wiring plane in order of their circuit activity
DE10104233B4 (en) * 2001-01-31 2006-08-03 Technische Universität München Lehrstuhl für integrierte Schaltungen Method for assigning lines to wiring levels for semiconductor integrated circuit devices

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