JPS6457633A - Suction transfer device - Google Patents

Suction transfer device

Info

Publication number
JPS6457633A
JPS6457633A JP21455787A JP21455787A JPS6457633A JP S6457633 A JPS6457633 A JP S6457633A JP 21455787 A JP21455787 A JP 21455787A JP 21455787 A JP21455787 A JP 21455787A JP S6457633 A JPS6457633 A JP S6457633A
Authority
JP
Japan
Prior art keywords
transferred
suction
mounting surface
transfer
flexible material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21455787A
Other languages
Japanese (ja)
Other versions
JPH0630370B2 (en
Inventor
Yoshihiko Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP21455787A priority Critical patent/JPH0630370B2/en
Publication of JPS6457633A publication Critical patent/JPS6457633A/en
Publication of JPH0630370B2 publication Critical patent/JPH0630370B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Manipulator (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Automatic Assembly (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To make it possible to suck an object to be transferred with sufficient suction force even if the object has warp, and transfer it, by setting a suction pad with an suction hole at a position higher than the mounting surface for the object to be transferred, and forming the pad by using flexible material. CONSTITUTION:In a transfer device which transfers objects to be transferred, and suction pad 36 having an suction hole is settled at a position higher than the mounting surface 32 for the object to be transferred, and constituted by using flexible material. For example, a transfer chuck 30 of nearly a horizontal U-shape and an alignment stage 24 are installed. The former sucks by the use of vacuum the object to be transferred on the mounting surface 32 and transfers it. The latter is arranged on the transfer path of the transfer chuck 30 so as to be able to ascend and descend and to freely rotate, and ascends via a central notched part 31 of the transfer chuck 30 to receive the object to be transferred. The object to be transferred is sucked by the use of vacuum to the alignment stage 24, which aligns the object to be transferred. The suction pad 36 is constituted by using flexible material possessing a suction surface at a position a little higher than the mounting surface 32. In the transfer chuck 30, the suction pads 36 are at least arranged at two positions of the mounting surface 32 of nearly a horizontal U-shape.
JP21455787A 1987-08-27 1987-08-27 Probe device Expired - Lifetime JPH0630370B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21455787A JPH0630370B2 (en) 1987-08-27 1987-08-27 Probe device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21455787A JPH0630370B2 (en) 1987-08-27 1987-08-27 Probe device

Publications (2)

Publication Number Publication Date
JPS6457633A true JPS6457633A (en) 1989-03-03
JPH0630370B2 JPH0630370B2 (en) 1994-04-20

Family

ID=16657696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21455787A Expired - Lifetime JPH0630370B2 (en) 1987-08-27 1987-08-27 Probe device

Country Status (1)

Country Link
JP (1) JPH0630370B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6075372A (en) * 1984-09-04 1985-04-27 セイレイ工業株式会社 Receiving trough for cylinder selecting rice huller
JP2001205586A (en) * 2000-01-28 2001-07-31 Myotoku Ltd Suction pad
US20110025344A1 (en) * 2007-11-26 2011-02-03 Tokyo Electron Limited Holding member for use in test and method for manufacturing same
JP2014229696A (en) * 2013-05-21 2014-12-08 三菱電機株式会社 Evaluation device of semiconductor device
JP2018134688A (en) * 2017-02-20 2018-08-30 パナソニックＩｐマネジメント株式会社 Work device and cable holding tool

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151310U (en) * 1984-09-11 1986-04-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151310U (en) * 1984-09-11 1986-04-07

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6075372A (en) * 1984-09-04 1985-04-27 セイレイ工業株式会社 Receiving trough for cylinder selecting rice huller
JP2001205586A (en) * 2000-01-28 2001-07-31 Myotoku Ltd Suction pad
US20110025344A1 (en) * 2007-11-26 2011-02-03 Tokyo Electron Limited Holding member for use in test and method for manufacturing same
JP2014229696A (en) * 2013-05-21 2014-12-08 三菱電機株式会社 Evaluation device of semiconductor device
US9551745B2 (en) 2013-05-21 2017-01-24 Mitsubishi Electric Corporation Semiconductor device assessment apparatus
JP2018134688A (en) * 2017-02-20 2018-08-30 パナソニックＩｐマネジメント株式会社 Work device and cable holding tool

Also Published As

Publication number Publication date
JPH0630370B2 (en) 1994-04-20

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