JPS6454755A - Memory - Google Patents

Memory

Info

Publication number
JPS6454755A
JPS6454755A JP62211574A JP21157487A JPS6454755A JP S6454755 A JPS6454755 A JP S6454755A JP 62211574 A JP62211574 A JP 62211574A JP 21157487 A JP21157487 A JP 21157487A JP S6454755 A JPS6454755 A JP S6454755A
Authority
JP
Japan
Prior art keywords
capacity
electrode
layers
conductive layer
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62211574A
Other languages
Japanese (ja)
Inventor
Masataka Shingu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP62211574A priority Critical patent/JPS6454755A/en
Publication of JPS6454755A publication Critical patent/JPS6454755A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)

Abstract

PURPOSE:To reduce the area of a cell by forming the lower electrode of the capacity of adjacent memories having a switching transistor and a laminated capacity of a first conductive layer and the other electrode of a second conductive layer, and disposing the first conductive layer adjacently thereto. CONSTITUTION:The lower electrode of a laminated capacity is formed of a polysilicon layer 3 connected to the source 11a of a FET in a memory cell 1, and of another polysilicon layer 4 connected to that in a memory cell 2, and the layers 3, 4 are alternately employed in a perpendicular direction to this paper. They are isolated in the cells by a connecting hole 14 to a bit line 15, and its interval R is small like on an isolating layer 12 in other boundary. Accordingly, they can be easily integrated. The ends of the layers 3, 4 cover the sidewalls of a gate electrode 16 to widen its area. An interlayer insulating film 18 is formed on each lower electrode, a common capacity upper electrode 19 is superposed, and a bit line 15 is disposed through an interlayer insulating film 20. According to this configuration, the pattern of the layers 3, 4 is reduced like a size R1, and can be extended to the vicinity of the boundary of the cells, thereby increasing its lower area to increase its capacity. Accordingly, even if a memory size is reduced, the characteric of the cell can be secured.
JP62211574A 1987-08-26 1987-08-26 Memory Pending JPS6454755A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62211574A JPS6454755A (en) 1987-08-26 1987-08-26 Memory

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62211574A JPS6454755A (en) 1987-08-26 1987-08-26 Memory

Publications (1)

Publication Number Publication Date
JPS6454755A true JPS6454755A (en) 1989-03-02

Family

ID=16608025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62211574A Pending JPS6454755A (en) 1987-08-26 1987-08-26 Memory

Country Status (1)

Country Link
JP (1) JPS6454755A (en)

Similar Documents

Publication Publication Date Title
KR910013555A (en) Semiconductor memory
KR910005460A (en) Semiconductor memory device
KR910020904A (en) Semiconductor memory device and manufacturing method
KR940020570A (en) Semiconductor integrated circuit device and manufacturing method thereof
KR840007312A (en) Semiconductor Memory with Multilayer Capacitor Memory Cells
KR960006037A (en) Semiconductor Memory Device Having Multilayer Capacitor and Manufacturing Method Thereof
US5194752A (en) Semiconductor memory device
KR930002289B1 (en) Semiconductor device
KR950002040A (en) Semiconductor device and manufacturing method thereof
US4131906A (en) Dynamic random access memory using MOS FETs and method for manufacturing same
KR930017186A (en) Multilayer Capacitor and Manufacturing Method Thereof
KR970067851A (en) Ferromagnetic nonvolatile memory cell and memory cell formation method
TW357454B (en) Semiconductor memory device
JP2000049306A5 (en)
JPS62190869A (en) Semiconductor memory
JPS6454755A (en) Memory
KR910010750A (en) Semiconductor memory
KR960012495A (en) Switching Transistors and Capacitors for Memory Cells
TW351846B (en) Method for fabricating memory cell for DRAM
US4173819A (en) Method of manufacturing a dynamic random access memory using MOS FETS
RU2004120776A (en) TRANSISTOR / REMEMBERING STRUCTURE AND ARRAYS OF INTEGRATED TRANSISTOR / REMEMBERING STRUCTURES WITH MATRIX ADDRESSING
US4887137A (en) Semiconductor memory device
JP2825039B2 (en) Semiconductor storage device
KR0161809B1 (en) Semiconductor memory device having a stacking tft
JPS55150267A (en) Semiconductor memory cell