JPS6454736A - Manufacture of package - Google Patents
Manufacture of packageInfo
- Publication number
- JPS6454736A JPS6454736A JP21172187A JP21172187A JPS6454736A JP S6454736 A JPS6454736 A JP S6454736A JP 21172187 A JP21172187 A JP 21172187A JP 21172187 A JP21172187 A JP 21172187A JP S6454736 A JPS6454736 A JP S6454736A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- substrate
- mold
- semiconductor
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To mass-produce sealing structure having high moisture resistance by burying a semiconductor element the periphery of which is coated with a resin into a resin in a mold from the surface side of a substrate and molding the element. CONSTITUTION:A semiconductor 2 is loaded onto the surface of a substrate 1, and a conductor circuit 4 is formed onto the surface of the substrate 1. The circuit 4 is connected electrically to an integrated circuit in the element 2 by bonding wires 3 while being electrically connected to lead pins 6. The element 2 on the substrate 1 and the peripheries of the element 2 such as the wire 3 are coated with a resin 7. The whole is turned upside down, and buried into the resin 7 from the surface side of the substrate 1 into the resin 7 admitted into a mold (a formwork) 8 and molded. The whole is molded and removed from the mold, thus acquiring a semiconductor package. Accordingly, sealing structure having high moisture resistance can be mass-produced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21172187A JPS6454736A (en) | 1987-08-26 | 1987-08-26 | Manufacture of package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21172187A JPS6454736A (en) | 1987-08-26 | 1987-08-26 | Manufacture of package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6454736A true JPS6454736A (en) | 1989-03-02 |
Family
ID=16610501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21172187A Pending JPS6454736A (en) | 1987-08-26 | 1987-08-26 | Manufacture of package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6454736A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998008251A1 (en) * | 1996-08-20 | 1998-02-26 | Hitachi, Ltd. | Semiconductor and method for manufacturing the same |
-
1987
- 1987-08-26 JP JP21172187A patent/JPS6454736A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998008251A1 (en) * | 1996-08-20 | 1998-02-26 | Hitachi, Ltd. | Semiconductor and method for manufacturing the same |
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