JPS6453438A - Cooler for power semiconductor element - Google Patents

Cooler for power semiconductor element

Info

Publication number
JPS6453438A
JPS6453438A JP62209389A JP20938987A JPS6453438A JP S6453438 A JPS6453438 A JP S6453438A JP 62209389 A JP62209389 A JP 62209389A JP 20938987 A JP20938987 A JP 20938987A JP S6453438 A JPS6453438 A JP S6453438A
Authority
JP
Japan
Prior art keywords
parts
heat
cooler
heat dissipation
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62209389A
Other languages
Japanese (ja)
Inventor
Hisateru Akachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Actronics KK
Original Assignee
Actronics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Actronics KK filed Critical Actronics KK
Priority to JP62209389A priority Critical patent/JPS6453438A/en
Publication of JPS6453438A publication Critical patent/JPS6453438A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Abstract

PURPOSE:To enable a decrease in the weight of a cooler and a reduction in the size of the cooler by a method wherein a meanderingly crowled loop type fine heat pipe consisting of a combination of parallel straight pipe parts and bent pipe parts is used as a heat-receiving part and a heat dissipation part. CONSTITUTION:A group of straight pipe parts (heat-receiving parts) 1-1 is pinched by metallic flat plates 2, on which power semiconductor elements 4 are mounted by bonding, and the straight pipe parts 1-1 are connected thermally with the elements 4 to become heat-receiving parts. A group of straight pipe parts (heat dissipation parts) 1-2 and a group of bent pipe parts (heat dissipation parts) 1-3 are heat dissipation parts, which are inserted and held in a natural or forced convection, and check valves 5 are provided in a fine pipe container to regulate the circulating direction of an operating liquid. The operating liquid is circulated in a prescribed direction by the interaction of this regulating means and positive and negative vapor pressures, which are generated in the heat- receiving parts and the heat dissipation parts. Accordingly, as a unit of a group of fins is not needed, a decrease in the size of a cooler and a reduction in the weight of the cooler can be contrived.
JP62209389A 1987-08-25 1987-08-25 Cooler for power semiconductor element Pending JPS6453438A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62209389A JPS6453438A (en) 1987-08-25 1987-08-25 Cooler for power semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62209389A JPS6453438A (en) 1987-08-25 1987-08-25 Cooler for power semiconductor element

Publications (1)

Publication Number Publication Date
JPS6453438A true JPS6453438A (en) 1989-03-01

Family

ID=16572096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62209389A Pending JPS6453438A (en) 1987-08-25 1987-08-25 Cooler for power semiconductor element

Country Status (1)

Country Link
JP (1) JPS6453438A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211826A (en) * 1994-01-13 1995-08-11 Toyo Electric Mfg Co Ltd Semiconductor cooling equipment for electric car
DE10022972A1 (en) * 2000-05-11 2001-11-22 Bosch Gmbh Robert Micro heat exchanger has a number of parallel metal hollow fiber tubes shrouded by a graphite matrix body for a high heat exchange in a simple unit
JP2003501310A (en) * 1999-06-08 2003-01-14 ルーク ラメレン ウント クツプルングスバウ ベタイリグングス コマンディートゲゼルシャフト How to shape the speed of a car wheel
JP2012013277A (en) * 2010-06-30 2012-01-19 Toshiba Home Technology Corp Heat sink
KR20200077832A (en) * 2018-12-21 2020-07-01 세종대학교산학협력단 Heat exchanger with multi-layered heat pipe and cooling system using the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211826A (en) * 1994-01-13 1995-08-11 Toyo Electric Mfg Co Ltd Semiconductor cooling equipment for electric car
JP2003501310A (en) * 1999-06-08 2003-01-14 ルーク ラメレン ウント クツプルングスバウ ベタイリグングス コマンディートゲゼルシャフト How to shape the speed of a car wheel
JP4967140B2 (en) * 1999-06-08 2012-07-04 シェフラー テクノロジーズ アクチエンゲゼルシャフト ウント コンパニー コマンディートゲゼルシャフト Method of shaping the speed of an automobile wheel
DE10022972A1 (en) * 2000-05-11 2001-11-22 Bosch Gmbh Robert Micro heat exchanger has a number of parallel metal hollow fiber tubes shrouded by a graphite matrix body for a high heat exchange in a simple unit
JP2012013277A (en) * 2010-06-30 2012-01-19 Toshiba Home Technology Corp Heat sink
KR20200077832A (en) * 2018-12-21 2020-07-01 세종대학교산학협력단 Heat exchanger with multi-layered heat pipe and cooling system using the same

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