JPS6452083A - Electroless gold plating solution - Google Patents

Electroless gold plating solution

Info

Publication number
JPS6452083A
JPS6452083A JP20810387A JP20810387A JPS6452083A JP S6452083 A JPS6452083 A JP S6452083A JP 20810387 A JP20810387 A JP 20810387A JP 20810387 A JP20810387 A JP 20810387A JP S6452083 A JPS6452083 A JP S6452083A
Authority
JP
Japan
Prior art keywords
gold
plating
soln
contg
stabilizer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20810387A
Other languages
Japanese (ja)
Inventor
Akira Tomizawa
Jiro Ushio
Osamu Miyazawa
Naoko Matsuura
Ataru Yokono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP20810387A priority Critical patent/JPS6452083A/en
Publication of JPS6452083A publication Critical patent/JPS6452083A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To obtain the title stable electroless gold plating soln. having low toxicity and capable of carrying out thick plating for a long time by incorporating the chloride or sulfide of lead as a stabilizer into the plating soln. contg. a gold (I) thiosulfate complex as a gold source. CONSTITUTION:The chloride or sulfide of lead and the stabilizer for inhibiting the autolysis of the plating soln. are incorporated into the plating soln. contg. a gold (I) thiosulfate complex as a gold source and contg. a reducing agent, a complexing agent, an antioxidant for the complex agent, a pH regulator, etc. Since the obtained electroless gold plating soln. does not contain a toxic cyanide ion, safety of the plating operation and simplification of the waste liq. treatment can be obtained. In addition, the soln. can be used for a long time due to the stabilizer.
JP20810387A 1987-08-24 1987-08-24 Electroless gold plating solution Pending JPS6452083A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20810387A JPS6452083A (en) 1987-08-24 1987-08-24 Electroless gold plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20810387A JPS6452083A (en) 1987-08-24 1987-08-24 Electroless gold plating solution

Publications (1)

Publication Number Publication Date
JPS6452083A true JPS6452083A (en) 1989-02-28

Family

ID=16550685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20810387A Pending JPS6452083A (en) 1987-08-24 1987-08-24 Electroless gold plating solution

Country Status (1)

Country Link
JP (1) JPS6452083A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105112953A (en) * 2015-09-17 2015-12-02 深圳市瑞世兴科技有限公司 Cyanide-free gold plating solution

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105112953A (en) * 2015-09-17 2015-12-02 深圳市瑞世兴科技有限公司 Cyanide-free gold plating solution

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