JPS6451689A - Printed circuit board of silicon steel base plate - Google Patents
Printed circuit board of silicon steel base plateInfo
- Publication number
- JPS6451689A JPS6451689A JP20945287A JP20945287A JPS6451689A JP S6451689 A JPS6451689 A JP S6451689A JP 20945287 A JP20945287 A JP 20945287A JP 20945287 A JP20945287 A JP 20945287A JP S6451689 A JPS6451689 A JP S6451689A
- Authority
- JP
- Japan
- Prior art keywords
- silicon steel
- steel plate
- rust
- coated
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
PURPOSE:To prevent the progress of rust from a sagged surface caused by punching work to the inside of a wiring board, by constituting the board metal of silicon steel plate coated with a rust proof metal layer. CONSTITUTION:The surface of a silicon steel plate 1 is coated with a rust proof metal layer 2, which can be formed of oxidation resistant metal, e.g., aluminum, zinc, nickel, and chromium. The rust proof metal layer 2 is formed by electroplating, electroless plating, vapor-deposition, etc. After the silicon steel plate 1 is coated with the rust proof metal 2, resin, resin-impregnated glass cloth, etc., are arranged as a bonded insulating layer 3, and further a metal foil 4 is arranged, which are laminated and unified in a body. Then a circuit is formed, and punching work for digging holes, and the like are performed. Although the silicon steel plate 1 exfoliates from the bonded insulating layer 3, the end-surface of a sagged part 6 of the silicon steel plate 1 after exfoliation is coated with the rust-proof metal layer 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20945287A JPS6451689A (en) | 1987-08-24 | 1987-08-24 | Printed circuit board of silicon steel base plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20945287A JPS6451689A (en) | 1987-08-24 | 1987-08-24 | Printed circuit board of silicon steel base plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6451689A true JPS6451689A (en) | 1989-02-27 |
Family
ID=16573105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20945287A Pending JPS6451689A (en) | 1987-08-24 | 1987-08-24 | Printed circuit board of silicon steel base plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6451689A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005305842A (en) * | 2004-04-22 | 2005-11-04 | Sharp Corp | Composite steel sheet and method for manufacturing the same |
CN100433321C (en) * | 2005-07-29 | 2008-11-12 | 三洋电机株式会社 | Circuit board and circuit apparatus using the same |
-
1987
- 1987-08-24 JP JP20945287A patent/JPS6451689A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005305842A (en) * | 2004-04-22 | 2005-11-04 | Sharp Corp | Composite steel sheet and method for manufacturing the same |
CN100433321C (en) * | 2005-07-29 | 2008-11-12 | 三洋电机株式会社 | Circuit board and circuit apparatus using the same |
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