JPS6451614A - Diagnostic device in recrystallizing device - Google Patents
Diagnostic device in recrystallizing deviceInfo
- Publication number
- JPS6451614A JPS6451614A JP20897487A JP20897487A JPS6451614A JP S6451614 A JPS6451614 A JP S6451614A JP 20897487 A JP20897487 A JP 20897487A JP 20897487 A JP20897487 A JP 20897487A JP S6451614 A JPS6451614 A JP S6451614A
- Authority
- JP
- Japan
- Prior art keywords
- beams
- recrystallizing
- wafer
- stepped section
- semiconductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
Abstract
PURPOSE:To prevent the generation of a crystal defect resulting from the state of the surface of a semiconductor layer by irradiating the peripheral section of the position of irradiation of high energy beams in the semiconductor layer with beams for decision, detecting beams for decision reflected to the semiconductor layer and providing a means deciding the state of the semiconductor layer on the basis of the detection. CONSTITUTION:When a wafer 3 having a stepped section in the lower layer of a polycrystalline silicon thin-film is recrystallized, the intensity of the reflected beams of non-recrystallized region evaluating beams La detected by a non-crystallized region evaluating beam photodetector 6 is weakened at the front position of a position where the stepped section of the wafer 3 is irradiated with recrystallizing beams Lr. A controller 10 detects the weakening of the reflected beams, and detects the presence of the stepped section. The presence of the stepped section is detected, a driver circuit 11 is controlled at timing when the time when a space Wa between the position of irradiation of recrystallizing beams Lr and the position of irradiation of non-recrystallized region evaluating beams La is scanned passes, and the intensity of recrystallizing beams Lr is intensified. Accordingly, the wafer 3 is recrystallized by intensified recrystallizing beams Lr, thus preventing the nonuniformity of a temperature rise due to the stepped section of a lower layer in the wafer 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20897487A JPS6451614A (en) | 1987-08-22 | 1987-08-22 | Diagnostic device in recrystallizing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20897487A JPS6451614A (en) | 1987-08-22 | 1987-08-22 | Diagnostic device in recrystallizing device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6451614A true JPS6451614A (en) | 1989-02-27 |
Family
ID=16565243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20897487A Pending JPS6451614A (en) | 1987-08-22 | 1987-08-22 | Diagnostic device in recrystallizing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6451614A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5133829A (en) * | 1991-01-08 | 1992-07-28 | Sematech, Inc. | Single wafer regrowth of silicon |
US5178840A (en) * | 1991-01-08 | 1993-01-12 | Sematech, Inc. | Single wafer regrowth of silicon |
USRE36371E (en) * | 1992-03-27 | 1999-11-02 | Tokyo Electron Limited | Method of forming polycrystalline silicon film in process of manufacturing LCD |
-
1987
- 1987-08-22 JP JP20897487A patent/JPS6451614A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5133829A (en) * | 1991-01-08 | 1992-07-28 | Sematech, Inc. | Single wafer regrowth of silicon |
US5178840A (en) * | 1991-01-08 | 1993-01-12 | Sematech, Inc. | Single wafer regrowth of silicon |
USRE36371E (en) * | 1992-03-27 | 1999-11-02 | Tokyo Electron Limited | Method of forming polycrystalline silicon film in process of manufacturing LCD |
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