JPS6451614A - Diagnostic device in recrystallizing device - Google Patents

Diagnostic device in recrystallizing device

Info

Publication number
JPS6451614A
JPS6451614A JP20897487A JP20897487A JPS6451614A JP S6451614 A JPS6451614 A JP S6451614A JP 20897487 A JP20897487 A JP 20897487A JP 20897487 A JP20897487 A JP 20897487A JP S6451614 A JPS6451614 A JP S6451614A
Authority
JP
Japan
Prior art keywords
beams
recrystallizing
wafer
stepped section
semiconductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20897487A
Other languages
Japanese (ja)
Inventor
Susumu Azeyanagi
Tetsuo Fujii
Akira Kuroyanagi
Tomohiro Funahashi
Mineichi Sakai
Shinji Yoshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP20897487A priority Critical patent/JPS6451614A/en
Publication of JPS6451614A publication Critical patent/JPS6451614A/en
Pending legal-status Critical Current

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Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

PURPOSE:To prevent the generation of a crystal defect resulting from the state of the surface of a semiconductor layer by irradiating the peripheral section of the position of irradiation of high energy beams in the semiconductor layer with beams for decision, detecting beams for decision reflected to the semiconductor layer and providing a means deciding the state of the semiconductor layer on the basis of the detection. CONSTITUTION:When a wafer 3 having a stepped section in the lower layer of a polycrystalline silicon thin-film is recrystallized, the intensity of the reflected beams of non-recrystallized region evaluating beams La detected by a non-crystallized region evaluating beam photodetector 6 is weakened at the front position of a position where the stepped section of the wafer 3 is irradiated with recrystallizing beams Lr. A controller 10 detects the weakening of the reflected beams, and detects the presence of the stepped section. The presence of the stepped section is detected, a driver circuit 11 is controlled at timing when the time when a space Wa between the position of irradiation of recrystallizing beams Lr and the position of irradiation of non-recrystallized region evaluating beams La is scanned passes, and the intensity of recrystallizing beams Lr is intensified. Accordingly, the wafer 3 is recrystallized by intensified recrystallizing beams Lr, thus preventing the nonuniformity of a temperature rise due to the stepped section of a lower layer in the wafer 3.
JP20897487A 1987-08-22 1987-08-22 Diagnostic device in recrystallizing device Pending JPS6451614A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20897487A JPS6451614A (en) 1987-08-22 1987-08-22 Diagnostic device in recrystallizing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20897487A JPS6451614A (en) 1987-08-22 1987-08-22 Diagnostic device in recrystallizing device

Publications (1)

Publication Number Publication Date
JPS6451614A true JPS6451614A (en) 1989-02-27

Family

ID=16565243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20897487A Pending JPS6451614A (en) 1987-08-22 1987-08-22 Diagnostic device in recrystallizing device

Country Status (1)

Country Link
JP (1) JPS6451614A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5133829A (en) * 1991-01-08 1992-07-28 Sematech, Inc. Single wafer regrowth of silicon
US5178840A (en) * 1991-01-08 1993-01-12 Sematech, Inc. Single wafer regrowth of silicon
USRE36371E (en) * 1992-03-27 1999-11-02 Tokyo Electron Limited Method of forming polycrystalline silicon film in process of manufacturing LCD

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5133829A (en) * 1991-01-08 1992-07-28 Sematech, Inc. Single wafer regrowth of silicon
US5178840A (en) * 1991-01-08 1993-01-12 Sematech, Inc. Single wafer regrowth of silicon
USRE36371E (en) * 1992-03-27 1999-11-02 Tokyo Electron Limited Method of forming polycrystalline silicon film in process of manufacturing LCD

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