JPS6451252A - Cutting device - Google Patents
Cutting deviceInfo
- Publication number
- JPS6451252A JPS6451252A JP62204017A JP20401787A JPS6451252A JP S6451252 A JPS6451252 A JP S6451252A JP 62204017 A JP62204017 A JP 62204017A JP 20401787 A JP20401787 A JP 20401787A JP S6451252 A JPS6451252 A JP S6451252A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- water
- chips
- nozzle
- flows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:To prevent chips from scattering into work environment in an effective manner by enclosing the circumference of a stage where a workpiece is mounted, with a cover, while setting up a shower nozzle, for spraying water, in this cover. CONSTITUTION:Water is sprayed in every direction from all shower nozzles 12 set up in an inner wall of a cover 2, then a blade 5 is rotated at high speed, while it moves downward toward a stage 3 whereby cutting of a wafer 4 is started. At this time, a large quantity of chips 14 produced are mixed in cooling water to be fed to a cutting spot of the wafer 4 from a cooling water nozzle 9, and these chips are accelerated by high speed rotation of the blade 5 and scattered sprayfully. A part of this spray flows in a drain hole 19 by its own weight, another part flows into the hole 10 by water sprayed out of the nozzle 12 after colliding with a side wall of the cover 2, furthermore the spray floated in the cover 2 also flows into the drain hole 10 by mixing with the water out of the nozzle 12. Accordingly, these chips are in no case scattered into work environment after coming to dust.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62204017A JPS6451252A (en) | 1987-08-19 | 1987-08-19 | Cutting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62204017A JPS6451252A (en) | 1987-08-19 | 1987-08-19 | Cutting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6451252A true JPS6451252A (en) | 1989-02-27 |
Family
ID=16483391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62204017A Pending JPS6451252A (en) | 1987-08-19 | 1987-08-19 | Cutting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6451252A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2751254A1 (en) * | 1996-07-19 | 1998-01-23 | Renault | DEVICE FOR REMOVING PROJECTED CHIPS FROM THE MACHINING HEAD OF A TOOL MACHINE |
FR2771041A1 (en) * | 1997-11-17 | 1999-05-21 | Peugeot | Cooling fluid distributor in a homogeneous manner of the machining zone of a machine tool |
JP2010094769A (en) * | 2008-10-15 | 2010-04-30 | Sumco Techxiv株式会社 | Grinding method and grinding device |
JP2014100783A (en) * | 2012-11-16 | 2014-06-05 | Hon Hai Precision Industry Co Ltd | Dustproof device |
JP2014220447A (en) * | 2013-05-10 | 2014-11-20 | 株式会社ディスコ | Cutting apparatus |
CN105132664A (en) * | 2015-09-14 | 2015-12-09 | 苏州凯锝微电子有限公司 | Dual-cooling type cooling device |
CN108637813A (en) * | 2018-05-10 | 2018-10-12 | 彭云秋 | A kind of petroleum pipeline installation pipeline head end grinding device |
WO2024057951A1 (en) * | 2022-09-16 | 2024-03-21 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
-
1987
- 1987-08-19 JP JP62204017A patent/JPS6451252A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2751254A1 (en) * | 1996-07-19 | 1998-01-23 | Renault | DEVICE FOR REMOVING PROJECTED CHIPS FROM THE MACHINING HEAD OF A TOOL MACHINE |
WO1998003301A1 (en) * | 1996-07-19 | 1998-01-29 | Renault | Device for removing chips produced by the machining head of a machine tool |
FR2771041A1 (en) * | 1997-11-17 | 1999-05-21 | Peugeot | Cooling fluid distributor in a homogeneous manner of the machining zone of a machine tool |
WO1999025518A1 (en) * | 1997-11-17 | 1999-05-27 | Automobiles Peugeot | Device for homogeneous cooling of a machine-tool machining zone |
JP2010094769A (en) * | 2008-10-15 | 2010-04-30 | Sumco Techxiv株式会社 | Grinding method and grinding device |
JP2014100783A (en) * | 2012-11-16 | 2014-06-05 | Hon Hai Precision Industry Co Ltd | Dustproof device |
JP2014220447A (en) * | 2013-05-10 | 2014-11-20 | 株式会社ディスコ | Cutting apparatus |
CN105132664A (en) * | 2015-09-14 | 2015-12-09 | 苏州凯锝微电子有限公司 | Dual-cooling type cooling device |
CN108637813A (en) * | 2018-05-10 | 2018-10-12 | 彭云秋 | A kind of petroleum pipeline installation pipeline head end grinding device |
WO2024057951A1 (en) * | 2022-09-16 | 2024-03-21 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
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