JPS6450470U - - Google Patents

Info

Publication number
JPS6450470U
JPS6450470U JP14561587U JP14561587U JPS6450470U JP S6450470 U JPS6450470 U JP S6450470U JP 14561587 U JP14561587 U JP 14561587U JP 14561587 U JP14561587 U JP 14561587U JP S6450470 U JPS6450470 U JP S6450470U
Authority
JP
Japan
Prior art keywords
pad
integrated circuit
terminals
hybrid integrated
split
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14561587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14561587U priority Critical patent/JPS6450470U/ja
Publication of JPS6450470U publication Critical patent/JPS6450470U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す部分正面図、
第2図は第1図に示す分割パツドにクリツプ端子
を挿入した場合の部分正面図、第3図は従来の混
成集積回路の分割パツドの構造の一例を示す部分
正面図、第4図は第3図に示す従来の混成集積回
路の分割パツドにクリツプ端子を挿入した場合の
部分正面図である。 1……基板、2,2a……分割パツド、3,3
a……境界線、4……クリツプ端子。
FIG. 1 is a partial front view showing an embodiment of the present invention;
FIG. 2 is a partial front view of a clip terminal inserted into the dividing pad shown in FIG. 1, FIG. 3 is a partial front view showing an example of the structure of a dividing pad of a conventional hybrid integrated circuit, and FIG. FIG. 4 is a partial front view of the conventional hybrid integrated circuit shown in FIG. 3 when clip terminals are inserted into the dividing pads; 1... Board, 2, 2a... Divided pad, 3, 3
a...Border line, 4...Clip terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に部品または端子を半田付けすることに
より相互接続を行う混成集積回路の分割パツドの
構造において、前記分割パツドの前記部品または
端子で接続する部分の相対向する境界線の形状が
互いに凹部と凸部とで対向するように形成してい
ることを特徴とする混成集積回路の分割パツドの
構造。
In the structure of a split pad of a hybrid integrated circuit in which interconnections are made by soldering components or terminals on a board, the shapes of opposing boundary lines of the parts or terminals of the split pad to be connected are mutually recessed. A structure of a dividing pad of a hybrid integrated circuit, characterized in that the pad is formed so as to face a convex part.
JP14561587U 1987-09-22 1987-09-22 Pending JPS6450470U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14561587U JPS6450470U (en) 1987-09-22 1987-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14561587U JPS6450470U (en) 1987-09-22 1987-09-22

Publications (1)

Publication Number Publication Date
JPS6450470U true JPS6450470U (en) 1989-03-29

Family

ID=31414364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14561587U Pending JPS6450470U (en) 1987-09-22 1987-09-22

Country Status (1)

Country Link
JP (1) JPS6450470U (en)

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