JPS645042A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS645042A
JPS645042A JP16034887A JP16034887A JPS645042A JP S645042 A JPS645042 A JP S645042A JP 16034887 A JP16034887 A JP 16034887A JP 16034887 A JP16034887 A JP 16034887A JP S645042 A JPS645042 A JP S645042A
Authority
JP
Japan
Prior art keywords
resin
cover
gel
space
subjected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16034887A
Other languages
Japanese (ja)
Inventor
Masanori Nakatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16034887A priority Critical patent/JPS645042A/en
Publication of JPS645042A publication Critical patent/JPS645042A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent thermal stress from being created in gel resin and to prevent a semiconductor element and leads from being subjected to external force, by making a case higher than the gel resin so as to define space between a cover and the gel resin. CONSTITUTION:A case 12 is higher than a gel resin 13, so that space is defined between a cover 14 and the resin 13. Even if temperature of the resin 13 is increased by heat generated in a semiconductor element 1 or by ambient temperature and the resin 13 is thermally expanded, the thermal expansion may be aborbed by the space between the resin 13 and the cover 14. Thus, creation of thermal stress in the resin 13 can be prevented effectively. In this manner, the element 1 and lead lines 8 can be prevented from being subjected to external force by the effect of the resin 13.
JP16034887A 1987-06-26 1987-06-26 Semiconductor device Pending JPS645042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16034887A JPS645042A (en) 1987-06-26 1987-06-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16034887A JPS645042A (en) 1987-06-26 1987-06-26 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS645042A true JPS645042A (en) 1989-01-10

Family

ID=15713039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16034887A Pending JPS645042A (en) 1987-06-26 1987-06-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS645042A (en)

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