JPS6448494A - Soldering device for flat package ic - Google Patents

Soldering device for flat package ic

Info

Publication number
JPS6448494A
JPS6448494A JP20545187A JP20545187A JPS6448494A JP S6448494 A JPS6448494 A JP S6448494A JP 20545187 A JP20545187 A JP 20545187A JP 20545187 A JP20545187 A JP 20545187A JP S6448494 A JPS6448494 A JP S6448494A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
pattern
heating
flat package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20545187A
Other languages
Japanese (ja)
Inventor
Teruo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP20545187A priority Critical patent/JPS6448494A/en
Publication of JPS6448494A publication Critical patent/JPS6448494A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To reduce interlayer and pattern separation and improve reliability of a printed wiring board by forming a radiating spring so that it comes in tight contact with each pattern of the printed wiring board when heating and pressurizing each lead thereof. CONSTITUTION:When heating and pressurizing a lead 12a of a flat package IC 12 by a heater chip 28, a radiating spring 31 is connected to each of patterns 36a of a printed wiring board 36, whereby a soldering at a uniform temperature can be made to each pattern of the printed wiring board without excessively heating a pattern whose area is smaller than the other because of different radiating effects due to different shapes of the patterns 36a. According to the constitution, interlayer and pattern separation can be reduced, and the reliability of the printed wiring board is improved while reducing the defects thereof.
JP20545187A 1987-08-19 1987-08-19 Soldering device for flat package ic Pending JPS6448494A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20545187A JPS6448494A (en) 1987-08-19 1987-08-19 Soldering device for flat package ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20545187A JPS6448494A (en) 1987-08-19 1987-08-19 Soldering device for flat package ic

Publications (1)

Publication Number Publication Date
JPS6448494A true JPS6448494A (en) 1989-02-22

Family

ID=16507096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20545187A Pending JPS6448494A (en) 1987-08-19 1987-08-19 Soldering device for flat package ic

Country Status (1)

Country Link
JP (1) JPS6448494A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5540884A (en) * 1991-09-12 1996-07-30 The Dow Chemical Company Method of making co-fired, multilayer substrates
CN107971597A (en) * 2018-01-15 2018-05-01 上海希日电子有限公司 A kind of glass terminal welder and its welding method
JP2020015080A (en) * 2018-07-27 2020-01-30 日本アビオニクス株式会社 Soldering device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5540884A (en) * 1991-09-12 1996-07-30 The Dow Chemical Company Method of making co-fired, multilayer substrates
CN107971597A (en) * 2018-01-15 2018-05-01 上海希日电子有限公司 A kind of glass terminal welder and its welding method
JP2020015080A (en) * 2018-07-27 2020-01-30 日本アビオニクス株式会社 Soldering device

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