JPS6448494A - Soldering device for flat package ic - Google Patents
Soldering device for flat package icInfo
- Publication number
- JPS6448494A JPS6448494A JP20545187A JP20545187A JPS6448494A JP S6448494 A JPS6448494 A JP S6448494A JP 20545187 A JP20545187 A JP 20545187A JP 20545187 A JP20545187 A JP 20545187A JP S6448494 A JPS6448494 A JP S6448494A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pattern
- heating
- flat package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To reduce interlayer and pattern separation and improve reliability of a printed wiring board by forming a radiating spring so that it comes in tight contact with each pattern of the printed wiring board when heating and pressurizing each lead thereof. CONSTITUTION:When heating and pressurizing a lead 12a of a flat package IC 12 by a heater chip 28, a radiating spring 31 is connected to each of patterns 36a of a printed wiring board 36, whereby a soldering at a uniform temperature can be made to each pattern of the printed wiring board without excessively heating a pattern whose area is smaller than the other because of different radiating effects due to different shapes of the patterns 36a. According to the constitution, interlayer and pattern separation can be reduced, and the reliability of the printed wiring board is improved while reducing the defects thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20545187A JPS6448494A (en) | 1987-08-19 | 1987-08-19 | Soldering device for flat package ic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20545187A JPS6448494A (en) | 1987-08-19 | 1987-08-19 | Soldering device for flat package ic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6448494A true JPS6448494A (en) | 1989-02-22 |
Family
ID=16507096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20545187A Pending JPS6448494A (en) | 1987-08-19 | 1987-08-19 | Soldering device for flat package ic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6448494A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5540884A (en) * | 1991-09-12 | 1996-07-30 | The Dow Chemical Company | Method of making co-fired, multilayer substrates |
CN107971597A (en) * | 2018-01-15 | 2018-05-01 | 上海希日电子有限公司 | A kind of glass terminal welder and its welding method |
JP2020015080A (en) * | 2018-07-27 | 2020-01-30 | 日本アビオニクス株式会社 | Soldering device |
-
1987
- 1987-08-19 JP JP20545187A patent/JPS6448494A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5540884A (en) * | 1991-09-12 | 1996-07-30 | The Dow Chemical Company | Method of making co-fired, multilayer substrates |
CN107971597A (en) * | 2018-01-15 | 2018-05-01 | 上海希日电子有限公司 | A kind of glass terminal welder and its welding method |
JP2020015080A (en) * | 2018-07-27 | 2020-01-30 | 日本アビオニクス株式会社 | Soldering device |
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